1、 MIL-PRF-83532E 26 August 2013 SUPERSEDING MIL-PRF-83532D 29 September 2008 PERFORMANCE SPECIFICATION DELAY LINES, ACTIVE GENERAL SPECIFICATION FOR This specification sheet is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers
2、 the general requirements for fixed (tapped and untapped) pulse delay lines. 1.2 Classification. 1.2.1 Part or Identifying Number (PIN). The PIN will be as shown in the following example: M 83532/01 A 001 B C Military level M or C (see 1.2.2) Specification sheet Case outline A,B,C,D,E, or F (see app
3、endix) Dash number Product level A, B, or S (see 1.2.3) Lead finish (see 3.4.5.1) 1.2.2 Military level. The military designator is identified by a single letter M, or C. M is for high reliability military applications, and C is for general purpose military applications. 1.2.3 Product level. The prod
4、uct level is identified by a single letter A, B, or S. Levels A and B are for high reliability military applications. Level S is for high reliability space applications. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification.
5、 This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of do
6、cuments cited in sections 3 and 4 of this specification, whether or not they are listed. AMSC N/A FSC 5999 INCH-POUND Comments, suggestions or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990, or emailed to Relaydla.mil
7、. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.dla.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83532E 2 2.2 Government documen
8、ts. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPE
9、CIFICATIONS MIL-PRF-123 - Capacitors, Fixed, Ceramic Dielectric, (Temperature Stable and General Purpose), High Reliability, General Specification For. MIL-PRF-19500 - Semiconductor Device, General Specification for. MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. MIL-PRF-38535 - In
10、tegrated Circuits (Microcircuits) Manufacturing, General Specification for. MIL-PRF-55342 - Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability, Space Level, Performance Specification for. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Estab
11、lished Reliability and Nonestablished Reliability , General Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic and Electrical Component Parts. MIL-STD-790 - Established Reliability and High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fib
12、er Optic Parts Specifications. MIL-STD-810 - Environmental Engineering Considerations and Laboratory Tests. MIL-STD-883 - Microelectronics. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardizat
13、ion Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation
14、or contract. AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/EIA 557-B - Statistical Process Control Systems. (Copies of this document are available online at www.ansi.org or from American National Standards Institute (ANSI), 11 West 42ndStreet, New York, NY 10036-8002.) ELECTRONIC COMPONENTS ASSO
15、CIATION (ECA) ECA/EIA - 242 - Definitions for Electromagnetic Delay Line. (Copies of this document may be purchased from ECA - Electronic Components Association, 2214 Rock Hill Rd., Suite 170, Herndon, VA 20170, http:/www.eciaonline.org/. Provided by IHSNot for ResaleNo reproduction or networking pe
16、rmitted without license from IHS-,-,-MIL-PRF-83532E 3 INTERNATIONAL ORGANIZATION FOR STANDARDS (ISO) ISO 10012 - Measurement management systems - Requirements for measurement processes and measuring equipment. ISO/IEC 17025 General requirements for the competence of testing and calibration laborator
17、ies. (Copies of this document are available online at www.ansi.org or from American National Standards Institute (ANSI), 11 West 42ndStreet, New York, NY 10036-8002.) 2.4 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this docume
18、nt and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individ
19、ual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification and the specification sheet, the latter shall govern. 3.2 Qualification. Delay lines furnished under this specific
20、ation shall be products which are authorized by the qualifying activity for listing on the applicable qualified products list (QPL) before contract award (see 4.4 and 6.3). 3.3 QPL system. Product level A delay lines shall be subjected to, and pass, all applicable requirements, tests, and inspection
21、s described herein, including qualification and conformance inspection requirements. Requirements for this system are specified in MIL-STD-790. Product levels B and S shall be subjected to and pass all applicable requirements, tests, and inspections specified in MIL-PRF-38534 including qualification
22、, conformance inspections, ESD and SPC measures. Military level C parts must meet the inspection requirements of 4.6.1.2.1. 3.3.1 Statistical process control (SPC). (for level B and S, see 3.3) As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC system that meets t
23、he requirements of ANSI/EIA-557-B. 3.3.2 Electrostatic sensitive discharge (ESD) control program. (for level B and S, see 3.3) As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish and maintain an ESD control system. As a minimum, this program shall address the identificati
24、on of ESD sensitive (ESDS) sub-components and end items, facilities, training, design protection, handling procedures, marking, cleaning, packaging, and verification. 3.3.2.1 ESD identifier / index mark. Delay lines supplied to this specification are considered to be ESD class 1 devices susceptible
25、to ESD voltages of 0 volt to 1,999 volts. Delay lines shall be marked on top, over pin 1, with a single equilateral triangle ( ) ESD identifier (see 3.21.2c and appendix). 3.4 Materials. The materials used in construction of active delay lines shall be nonnutrient to fungus and shall not blister, ou
26、tgas, soften, flow or show defects that adversely affect storage, operation at rated conditions, or environmental capabilities. 3.4.1 Flammable materials. Materials used in the construction of delay lines shall be nonflammable and nonexplosive. 3.4.2 Corrosive materials. Corrosive materials used in
27、any of the manufacturing processes shall be removed or neutralized so that no corrosion will result from such use. Materials used in the construction of delay lines shall be noncorrosive. 3.4.3 Solder and soldering flux. Solder and soldering flux shall be of such quality as to enable the delay lines
28、 to meet all the requirements of this specification. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83532E 4 3.4.4 Case material. Unless otherwise specified (see 3.1), cases may be of metallic or nonmetallic material. All metallic surfaces s
29、hall be protected against corrosion by a suitable finish and shall be free from blisters and other defects which may affect the protective value of this finish. For level B, the cases shall be hermetically sealed. 3.4.5 Terminals. Terminals shall be solder lug terminals, printed-circuit and dual-in-
30、line terminals, or solid-wire lead terminals, as specified (see 3.1). All solder type terminals shall be capable of complying with the solderability requirements of this specification. 3.4.5.1 Lead finish. Lead frame or terminal material shall be in accordance with MIL-PRF-38534. The lead finish sha
31、ll conform to one of the following finishes and as specified in 3.1. (NOTE: Pure tin finish shall not be used for any internal or external package surface or as a lead finish. In addition, pure tin plating shall not be used as an undercoat.): Finish letter Lead frame or terminal material and finish
32、A Type A, B, or C, with hot solder dip B Type A, B, or C, with tin-lead plate C Type A, B, or C, with gold plate 3.4.5.2 Meniscus. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inch (0.25 mm) above the seating plane of the delay line. 3
33、.4.6 Components. All component parts used in the construction of active delay lines, specified herein or not specified, shall be of such quality as to ensure the delay line meets all performance requirements. Product levels B and S shall meet element evaluation requirements of MIL-PRF-38534. 3.4.6.1
34、 Passive circuit elements. For level A, capacitors shall be screened to MIL-PRF-123 or MIL-PRF-55681. Resistors shall be screened to MIL-PRF-55342. 3.4.6.2 Discrete semiconductor devices. For level A, discrete semiconductor devices, including diodes, zener diodes, and transistor devices, shall be te
35、sted to and meet the screening requirements of MIL-PRF-19500. 3.4.6.3 Integrated circuits (IC). For level A, all ICs shall be tested to and meet the screening requirements of MIL-PRF-38535. 3.4.7 Pure tin. Use of pure tin, plating or otherwise, is prohibited internally and externally (see 6.6). Use
36、of tin-lead finishes are acceptable provided that the minimum lead continent is 3 percent. Acceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product (see 4.7.1). When materials are not specified, materials shall be used which en
37、able the delay line to meet the performance requirements of this specification. Acceptance or approval of any constituent material shall not be construed as a guarantee of the acceptance of the finished product. 3.5 Interface and dimensions. Delay lines shall meet the interface and physical dimensio
38、ns as specified in the applicable specification sheet (see 3.1). 3.5.1 Dimensions (see 4.7.2). When delay lines are inspected in accordance with 4.7.2, the dimensions shall be within the tolerances specified on the specification sheet (see 3.1). 3.5.2 Visual inspection (see 4.7.3). There shall be no
39、 evidence of flaking, pitting, blistering, peeling, cracks, bursting, bulging, or other defects. The delay lines shall also meet the requirements of 3.1, 3.20, and 3.21. 3.6 Solderability (see 4.7.4). The delay lines shall meet the applicable criteria for terminal evaluation in the test method. Prov
40、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-83532E 5 3.7 Resistance to solvents (see 4.7.5). There shall be no evidence of mechanical damage and all markings shall remain legible. The paint or exterior finish shall not soften, peel, or show o
41、ther signs of deterioration. 3.8 Resistance to soldering heat (see 4.7.6). There shall be no softening of the insulation or loosening of the windings or terminals, no evidence of internal solder reflow or heat damage, and delay times shall meet the requirements of 3.1. 3.9 Terminal strength (see 4.7
42、.7). Terminals shall display no evidence of loosening, rupturing, or other mechanical damage. Bends shall not be considered as damage, unless surface cracking is evident. 3.10 Seal (see 4.7.8). There shall be no evidence of continuous air bubble flow or compound leakage. 3.11 Electrical characterist
43、ics (see 4.7.9). Delay lines shall be capable of meeting all the electrical requirements (3.11.1 through 3.11.4) specified (see 3.1). 3.11.1 Delay time (see 4.7.9.1.1). Unless otherwise specified, the overall delay times shall be as specified in the specification sheets (see 3.1). 3.11.2 Rise time (
44、see 4.7.9.1.2). The rise time of pulses taken at the delay output shall be as specified in the specification sheets (see 3.1). 3.11.3 Delay time at temperature extremes (see 4.7.9.1.3). The delay time at the maximum and minimum operating temperatures shall be as specified in the specification sheets
45、 (see 3.1). 3.11.4 DC characteristics (see 4.7.9.1.4). The dc characteristics shall be as specified in the specification sheets (see 3.1). 3.12 Salt spray (corrosion) (when specified, see 3.1 and 4.7.10). There shall be no evidence of corrosion as exhibited by any visible degradation of the surfaces
46、 that can be attributed to flaking, pitting, blistering, or otherwise loosened protective coating or metal surface. 3.13 Vibration (see 4.7.11). There shall be no leakage of filling material and no evidence of other physical damage such as cracks, bursting, or bulging of the case. There shall be no
47、evidence of mechanical damage and there shall be no electrical discontinuity during the test. 3.14 Shock (see 4.7.12). There shall be no leakage of filling material and no evidence of other physical damage such as cracks, bursting, or bulging of the case. There shall be no evidence of mechanical dam
48、age and there shall be no electrical discontinuity during the test. 3.15 Flammability (level A only) (see 4.7.13). There shall be no evidence of violent burning which results in an explosive-type fire, and the coating material used shall be self-extinguishing. A delay line shall not be considered to
49、 have failed in the event that it is consumed by the applied flame. A delay line shall be considered to have failed only if an explosion or dripping of flaming material occurs, an explosive-type flame is produced, or if visible burning continues beyond the allowable duration of 3 minutes after removal of the applied flame. 3.16 Thermal shock (see 4.7.14). Not more than 10 percent of the surface shall have peeling, flaking, chipping, cracking, or other
