1、QML-310322013-11-14QUALIFIED PRODUCT LISTOFPRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATIONMIL-PRF-31032Printed Circuit Board/Printed Wiring Board, General Specification forThis list has been prepared for use by or for the Government in the acquisition of products covered by the subject specificat
2、ion and such listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense. This list is subject to change without notice; revision or amendment of this list will be issued as necessary. The listing of a product does not release the contractor f
3、rom compliance with the specification requirements.THE ACTIVITY RESPONSIBLE FOR THIS QUALIFICATION DATASET is the DeDLA Land and Maritime - VQ, Columbus, OH 43218-3990.DLA Land and Maritime-VQ supplemental information available at: http:/www.landandmaritime.dla.mil/programs/qmlqpl/QPLdetail.asp?QPL=
4、31032GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3DR67 M Gre
5、en Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.75815 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass R
6、einforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0MHG5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mount
7、ing.6T499 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3BKL5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered,
8、Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1VUH8 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Sold
9、ered Part Mounting.65200 M Green Until: 14-NOV-15NQML-310321 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-G
10、OVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4AA34 M Green Unt
11、il: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinfor
12、ced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0GN71 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1K
13、XU6 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3AF82 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven
14、E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.6T499 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered P
15、art Mounting.65723 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1VUH8 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multi
16、layered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.63695 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes,
17、 For Soldered Part Mounting.75815 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3C7D2 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Boar
18、d, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.L2665 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated
19、 Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NQML-310322 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted withou
20、t license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mo
21、unting.4MEG7 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.C4831 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayere
22、d, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.U4538 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For S
23、oldered Part Mounting.3DR67 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.63695 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rig
24、id, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.38898 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Throu
25、gh Holes, For Soldered Part Mounting.57034 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4AA34 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wi
26、ring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.L2665 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, Wi
27、th Plated Through Holes, For Soldered Part Mounting.45032 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0MHG5 M Green Until: 14-NOV-15NMIL-PRF-3103
28、2/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Ba
29、se Material, With Plated Through Holes, For Soldered Part Mounting.03640 M Green Until: 14-NOV-15NQML-310323 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or net
30、working permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Hol
31、es, For Soldered Part Mounting.7Z463 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.4MEG7 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring B
32、oard, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Pla
33、ted Through Holes, For Soldered Part Mounting.5L706 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.66982 M Green Until: 14-NOV-15NMIL-PRF-31032/1: P
34、rinted Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.1KXU6 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Mat
35、erial, With Plated Through Holes, For Soldered Part Mounting.01KV9 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.66766 M Green Until: 14-NOV-15NMIL
36、PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.01KV9 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting
37、 Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3CP65 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.7Z463 M Green Until
38、 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.04RV5 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforce
39、d thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.6RJS1 M Green Until: 14-NOV-15NQML-310324 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for Resa
40、leNo reproduction or networking permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION TEST REFERENCE CAGE CODESupplier TypeCertified StatusStop ShipMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material,
41、 With Plated Through Holes, For Soldered Part Mounting.30598 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3CP65 M Green Until: 14-NOV-15NMIL-PRF-3
42、1032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.45032 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin
43、 Base Material, With Plated Through Holes, For Soldered Part Mounting.65745 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0K703 M Green Until: 14-N
44、OV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.65916 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced ther
45、mosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3ECL3 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3AF82 M Gr
46、een Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0YYS4 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass
47、Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.79616 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Moun
48、ting.4GZ84 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered, Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.3ECL3 M Green Until: 14-NOV-15NMIL-PRF-31032/1: Printed Wiring Board, Rigid, Multilayered,
49、 Woven E-Glass Reinforced thermosetting Resin Base Material, With Plated Through Holes, For Soldered Part Mounting.0YYS4 M Green Until: 14-NOV-15NQML-310325 of 25Source: QPD at https:/assist.daps.dla.mil - QPL Date: 2013-11-14If past the certification date, contact Qualifying Activity for status.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-GOVERNMENT DESIGNATION MANUFACTURER DESIGNATION T
