1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to footnote 5/ in 1.3. Added footnote 4/ to KVItest in table I. Made correction to figure 3. gt 03-02-19 R. MONNIN B Update drawing as part of 5 year review - jt 10-10-04 C. SAFFLE C Add case outline U. Delete references to device class M
2、requirements. - ro 12-11-28 C. SAFFLE REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Rajesh Pithadia DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS D
3、RAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Rajesh Pithadia APPROVED BY Raymond Monnin MICROCIRCUIT, LINEAR, POSITIVE, FIXED, 3 V, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 03-01-22 AMSC N/A REVISION LEVEL C SIZE
4、A CAGE CODE 67268 5962-03201 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E043-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSC
5、C FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN)
6、. When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 03201 01 V X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.
7、2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s)
8、identify the circuit function as follows: Device type Generic number Circuit function 01 RH-L4913-30 Radiation hardened, positive, fixed, 3 V, 2 A, low dropout voltage regulator 02 RH-L4913-30 Radiation hardened, positive, fixed, 3 V, 3 A, low dropout voltage regulator 1.2.3 Device class designator.
9、 The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outl
10、ine letter Descriptive designator Terminals Package style U See figure 1 3 Bottom terminal chip carrier X CDFP4-F16 16 Flat pack 1/ Y CBCC1-N3 3 Bottom terminal chip carrier Z See figure 1 3 TO-257 single row flange mount with insulated case and ceramic seal 1.2.5 Lead finish. The lead finish is as
11、specified in MIL-PRF-38535 for device classes Q and V. _ 1/ AlN ceramic header with metallized bottom side and pullback of 0.01 x 0.02 inches. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AN
12、D MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 2/ DC input voltage 14 V Output current: Case X . 2 A Cases U and Y 3 A Case Z . 3 A Power dissipation at TA= 25C: Case X . 1 W 3/ Cases U and Y . 1.5 W 3/ Case Z . 2.5 W 3/ Power dissip
13、ation at TC= 25C: Cases U, X, and Y 15 W Case Z . 10 W Thermal resistance, junction-to-case (JC): Cases U, X and Y 8.3C/W Case Z . 12.5C/W Thermal resistance, junction-to-ambient (JA): Case X . 125C/W Cases U and Y . 83C/W Case Z . 50C/W Storage temperature range -65C to +150C Operating temperature
14、range -55C to +150C Lead temperature (soldering, 10 seconds) +300C 4/ Maximum junction temperature (TJ) +150C 5/ 1.4 Recommended operating conditions. Input voltage range (VIN) . 4.5 V to 12 V Output voltage (VOUT) . 3 V Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features
15、. Maximum total dose available (dose rate = 50 - 300 rads(Si)/s): Device types 01 and 02 300 krads(Si) 6/ Latch-up . 7/ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/
16、At TA2.4 V, VIN= VOUT + 2 V 1,2,3 01 1 mA Inhibit voltage VINHON VIN= VOUT+ 2.5 V, IOUT= 5 mA 1,2,3 01 0.8 V VINHOFF 2.4 Dropout voltage VdIOUT= 400 mA 1 01, 02 0.45 V 2 0.55 3 0.4 IOUT= 1 A 1 0.65 2 0.8 3 0.55 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking
17、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless other
18、wise specified Group A subgroups Device type Limits Unit Min Max Supply voltage rejection 5/ SVR VIN= VOUT + 2.5 V, IOUT= 5 mA, f = 120 Hz, TA= +25C 4 01, 02 60 dB VIN= VOUT + 2.5 V, IOUT= 5 mA, f = 33 kHz, TA= +25C 30 Inhibit propagation 5/ delay tPLHVINHIBIT= 2.4 V, IOUT= 400 mA, VIN= VNOM+ 2.5 V,
19、 see figure 4 9 01, 02 20 s tPHL100 1/ Device types 01 and 02 have been characterized through all levels M, D, P, L, R, F of irradiation. However, this device is tested at the “F” level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradia
20、tion electrical measurements for any RHA level, TA= +25C. 2/ VIN= VOUT+ 2.5 V, CIN= 1 F, COUT= 1 F. 3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the con
21、ditions specified in MIL-STD-883, method 1019, condition A. 4/ KVI= (Vrline) X 100 / VOUT1where Vrline= VOUT1 VOUT1; VOUT1= VOUTwhen VIN= VNOM+ 2.5 V and IOUT= 5 mA, VOUT1= VOUTwhen VIN= VMAX= 12 V and IOUT= 5 mA 5/ Controlled via design or process and is not directly tested. Characterized on initia
22、l design release and upon design or process changes which affect this parameter. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of co
23、mpliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manuf
24、acturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. Provided
25、by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Case U Symbol Inches Millimeters Min Nominal Max Min Nominal Max A 0
26、.112 0.121 0.13 2.844 3.073 3.302 A1 0.01 0.015 0.02 0.254 0.381 0.508 b 0.281 0.286 0.291 7.137 7.264 7.391 b1 0.22 0.225 0.23 5.588 5.715 5.842 b2 0.09 0.095 0.1 2.286 2.413 2.54 b3 0.115 0.12 0.125 2.921 3.048 3.175 D 0.395 0.4 0.405 10.033 10.16 10.287 D1 0.03 - - 0.762 - - E 0.291 0.296 0.301 7
27、.391 7.518 7.645 e 0.075 BSC 1.905 BSC NOTES: 1. Measurement prior to solder coating the mounting pads on bottom of package. 2. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the
28、event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUM
29、BUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Case Z Symbol Inches Millimeters Min Max Min Max A .185 .210 4.70 5.33 A1 .035 .045 0.89 1.14 A2 .115 .125 2.92 3.18 b .025 .035 0.64 0.89 D .650 .660 16.51 16.76 D1 .410 .420 10.41 10.67 E .410 .420 10.41 10.67 e .095 .105 2.41 2.6
30、7 H .202 .212 5.13 5.38 L .600 .650 15.24 16.51 L1 .527 .537 13.39 13.64 N - .028 - 0.71 P .140 .150 3.56 3.81 Note: The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of co
31、nflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-03201DLA LAND AND MARITIMECOLUMBUS, OH
32、IO 43218-3990REVISION LEVELCSHEET9DSCC FORM 2234APR 97Device type 01 02Case outlines X Uand Y ZTerminal number Terminal symbol1VOUT1VOUTVIN2VOUT1VINGND3VINGNDVOUT4VIN- -5VIN- -6VOUT2- -7VOUT2- -8 ISC - -9 NC - -10 OCM - -11 NC - -12 NC - -13 GND - -14 INH - -15 NC - -16 SENSE - -NC = No connectFIGUR
33、E 2. Terminal connections.FIGURE 3. Block diagram.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 FIGURE 4
34、. Inhibit propagation delay waveform. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1
35、Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.
36、4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and t
37、est temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturers Technology Review Board (TRB) in accordance with MIL-PR
38、F-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test param
39、eters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall
40、 be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL
41、-PRF-38535 including groups A, B, C, D, and E inspections, and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 5, 6, 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspect
42、ion end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accor
43、dance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturers TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, b
44、iases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required onl
45、y for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table IIA herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-PRF-38
46、535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA= +25C 5C, after exposure, to the subgroups specified in table IIA herein. Provided by IHSNot for ResaleNo reproduction or networking permitted withou
47、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03201 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 12 DSCC FORM 2234 APR 97 TABLE IIA. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Dev
48、ice class V Interim electrical parameters (see 4.2) 1 1 Final electrical parameters (see 4.2) 1,2,3,4,9 1/ 1,2,3,4,9 1/ 2/ Group A test requirements (see 4.4) 1,2,3,4,9 1,2,3,4,9 Group C end-point electrical parameters (see 4.4) 1,2,3 1,2,3 2/ Group D end-point electrical parameters (see 4.4) 1,2,3 1,2,3 Group E end-point electrical parameters (see 4.4) 1 1 1/ PDA applies to subgr
