1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHET REV SHET REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla
2、.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 06-02-01 MICROCIRCUIT, DIGITAL-LINEAR, ANALOG-TO-DIGITAL CONVERTER, 8-BIT, 20 MSPS TO 200 MSPS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE
3、CODE 67268 5962-04231 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E184-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 2 DSC
4、C FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Numb
5、er (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 04231 01 Q X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (
6、see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A speci
7、fied RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 ADC08200 8-bit, 20 MSPS to 200 MSPS, analog-to-digital converte
8、r 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accorda
9、nce with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 24 Flat pack 1.2.5 Lead finish. The lea
10、d finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUM
11、BUS, OHIO 43218-3990 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage (VA) . 3.8 V Driver supply voltage (VDR) VA+ 0.3 V Voltage on any input or output pin . -0.3 V to VAReference voltage (VRT, VRB) VAto AGND CLK, PD voltage range . -0.05 V to ( VA+ 0.0
12、5 V ) Input current at any pin . 25 mA 3/ Package input current . 50 mA 3/ Power dissipation (PD) at TA= 25C . 969 mW 4/ Soldering temperature, 10 seconds 260C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) . 25C/W Thermal resistance, junction-to-ambient (JA) 129
13、C/W still air 72C/W, 500 linear feet per minute air flow 1.4 Recommended operating conditions. Supply voltage (VA) . +2.7 V to +3.6 V Driver supply voltage (VDR) +2.4 V to VAGround difference | GND DR GND | . 0 V to 300 mV Upper reference voltage (VRT) 0.5 V to ( VA 0.3 V ) Lower reference voltage (
14、VBR) . 0 V to ( VRT 0.5 V ) VINvoltage range VRBto VRTOperating ambient temperature range (TA) -55C TA +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herei
15、n. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcir
16、cuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ All voltages are measured with respect to
17、 GND = AGND = DR GND = 0 V, unless otherwise specified. 3/ When the input voltage at any pin exceeds power supplies (that is, less than AGND or DR GND, or greater than VAor VDR), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of p
18、ins that can safely exceed the power supplies with an input current of 25 mA to two. 4/ The absolute maximum junction temperature (TJMAX) for this device is 150C. The maximum allowable power dissipation is dictated by TJMAX, the junction-to-ambient thermal resistance (JA), and ambient temperature (T
19、A), and can be calculated using the formula PDMAX= (TJMAX TA)/ JA. The values for maximum power dissipation listed above will be reached only when this device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply pol
20、arity is reversed). Obviously, such conditions should always be avoided. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 D
21、SCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardizatio
22、n Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applica
23、ble laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (
24、QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, an
25、d physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1
26、. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specifi
27、ed in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with
28、 the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA
29、 designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ o
30、r “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the
31、requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an a
32、pproved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conf
33、ormance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of produ
34、ct (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable
35、 required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 57 (see MIL-PRF-38535, appendix A). Provided by I
36、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Cond
37、itions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxDC accuracy section Integral non-linearity INL 1,2,3 01 -1.2 +1.9 LSB Differential non-linearity DNL 1,2,3 01 -0.95 +0.95 LSB Missing codes 1,2,3 01 0 Full scale error FSE 1,2,3 01 60 mV Zero sc
38、ale offset error VOFF1,2,3 01 70 mV Analog input and reference characteristics section Input voltage VIN1,2,3 01 VRBVRTV Top reference voltage VRT1,2,3 01 0.5 VAV Bottom reference voltage VRB1,2,3 01 0 VRT 0.5 V Reference ladder resistance RREFVRTto VRB1,2,3 01 120 200 CLK, PD digital input characte
39、ristics section Logical high input voltage VIHVDR= VA= 3.6 V 1,2,3 01 2.4 V Logical low input voltage VILVDR= VA= 2.7 V 1,2,3 01 0.8 V Digital output characteristics section High level output voltage VOHVA= VDR= 2.7 V, IOH= -400 A 1,2,3 01 2.4 V Low level output voltage VOLVA= VDR= 2.7 V, IOL= 1.0 m
40、A 1,2,3 01 0.5 V Dynamic performance section Effective number of bits ENOB fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 6.7 Bits Signal-to-noise and distortion SINAD fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 41.5 dB Signal-to-noise ratio SNR fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 42 dB See footnotes at end of t
41、able. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristic
42、s Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxDynamic performance section - continued Spurious free dynamic range SFDR fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 47 dB Total harmonic distortion THD fIN= 50 MHz, VIN=
43、FS 0.25 dB 4,5,6 01 -47 dB Second harmonic distortion HD2 fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 -47 dBc Third harmonic distortion HD3 fIN= 50 MHz, VIN= FS 0.25 dB 4,5,6 01 -47 dB Power supply characteristics section Analog supply current IADC input 1,2,3 01 86 mA Output driver supply current IDRDC i
44、nput, PD = low 1,2,3 01 0.6 mA Total operating current IA+ IDRDC input, PD = low 1,2,3 01 86.6 mA Power consumption PC DC input, excluding reference 1,2,3 01 260 mW AC electrical characteristics section Maximum conversion rate fC14,5,6 01 200 MHz 1/ Unless otherwise specified, VA= VDR= +3.0 V dc, VR
45、T= +1.9 V, VRB= 0.3 V, CL= 5 pF, fCLK= 200 MHz at 50% duty cycle. 2/ The analog inputs are protected as shown below. Input voltage magnitudes up to VA+ 300 mV or to 300 mV below GND will not damage this device. However, errors in the A/D conversion can occur if the input goes above VDRor below GND b
46、y more than 100 mV. For example, if VAis 2.7 V dc, the full-scale input voltage must be 2.8 V dc to ensure accurate conversions. 3/ To guarantee accuracy, it is required that VAand VDRbe well bypassed. Each supply pin must be decoupled with separate bypass capacitors. Provided by IHSNot for ResaleNo
47、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-04231 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 Case X NOTES: 1. Lead thickness may be increased by 0.003 inch (0.08 mm) maximum af
48、ter lead finish is applied. 2. Pin 1 identification shall be a tab on the pin as shown. 3. The U.S. government preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC
