1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added case outline M. -sld 13-05-01 Charles F. Saffle REV SHEET REV A A A A A A SHEET 15 16 17 18 19 20 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan DLA LAND AND
2、MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil/ STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle MICROCIRCUIT, HYBRID, DUAL VOLTAGE REGULATOR, 3 AMP, POSITIVE AN
3、D NEGATIVE, LOW DROPOUT, ADJUSTABLE DRAWING APPROVAL DATE 12-11-13 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-10213 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E396-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
4、ING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are availa
5、ble and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 R 10213 01 K M X Federal RHA Device Device Case Lead stock class designator type
6、class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator.
7、 A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 8653, 8654 Dual voltage regulator, 3 amp, positive and negative, low dropout, adjustable 02 8687, 8688 Dual voltage regulator, 3 a
8、mp, positive, low dropout adjustable 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or
9、 QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in application
10、s where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees
11、 (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefor
12、e the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Pro
13、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated i
14、n MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style M See figure 1 8 Surface Mount with unformed leads U See figure 1 8 Thru-hole Z See figure 1 8 Surface Mount 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ra
15、tings. 1/ Input voltage: Positive regulator +25 V Negative regulator -35 V Input-Output differential voltage: Positive regulator 25 V Negative regulator 30 V Output voltage: Positive regulator +25 V Negative regulator -30 V Output current: Positive regulator 6 A Negative regulator -4,5 A Junction te
16、mperature (TJ) +150C Power Dissipation (PD) . See table IB herein Thermal resistance, junction-to-case (JC) each regulator . 5C/W Lead temperature (soldering, 10 seconds) 300C Storage temperature range -65C to +150C 1.4 Recommended operating conditions. Output voltage range: Postive voltage regulato
17、r . +1.25 V to +23 V dc Negative voltage regulator -2.37 V to -25 V dc Input- Output differential range: Positive regulator +1.8 V to +24 V Negative regulator -1.05 V to -29 V Output current: Positive regulator 3 A maximum Neagtive regulator 3 A maximum Case operating temperature range (TC) -55C to
18、+125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 - 300 rad(Si)/s) 100 krad(Si) 2/ 3/ 4/ _ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Bip
19、olar device types may degrade from displacement damage from radiation which could affect RHA levels. These device types have not been characterized for displacement damage. 3/ These parts may be dose rate sensitive in a space enviroment and may demonstrate enhanced low dose rate effects. Radiation e
20、nd-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Dose rate shall be in accordance with MIL-STD-883, method 1019, condition A. 4/ The active elements that make up the device on this drawing have been tested for Tota
21、l Ionizing Dose (TID) in accordance with MIL-STD-883 test method 1019 condition A. RHA testing of the active elements covered on this SMD are tested in alternate packages (TO3) and (TO39), not the packages as specified in paragraph 1.2.4. Provided by IHSNot for ResaleNo reproduction or networking pe
22、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards,
23、and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEF
24、ENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicks
25、earch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in th
26、is document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-
27、38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirement
28、s as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physica
29、l dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as
30、 specified on figure 3. 3.2.4 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.2.5 Maximum power dissipation verses case tempe
31、rature table. The maximum power dissipation verses case temperature is specified in table IB. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table IA and shall apply over the full specified operating tempe
32、rature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table IA. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be
33、 marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 4321
34、8-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot
35、 sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity
36、 (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers pro
37、duct meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permit
38、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC+125C P PMAXunless otherwise specified Gr
39、oup A subgroups Device types Limits Unit Min Max POSITIVE REGULATOR Reference voltage 2/ VREF1.5 V (VIN - VOUT) 15 V, ILOAD= 10 mA1,2,3 01,02 1.210 1.275 V Line regulation 2/ 3/ VOUTVIN1.5 V (VIN - VOUT) 15 V, ILOAD= 10 mA 1,2,3 01,02 0.25 % Load regulation 2/ 3/ VOUTIOUT10 mA IOUT 3.0 A, (VIN - VOU
40、T)= 3 V 4,5,6 01,02 0.35 % Thermal regulation 30 ms pulse, TC= +25C 4 01,02 0.04 %/W Dropout voltage 2/ 4/ VDROPVREF= 1%, IOUT= 3.0 A 9,10,11 01,02 1.8 V Ripple rejection IOUT= 0.5 A, (VIN - VOUT)= 3 V, f = 120 Hz, CADJ= COUT= 25 F9,10,11 01,02 60 dB Adjustment pin current 2/ IADJ1,2,3 01,02 120 A A
41、djustment pin current change 2/ IADJ10 mA IOUT 3.0 A, 1.5 V (VIN - VOUT) 15 V 1,2,3 01,02 5 A Minimum load current 2/ 4/ IMIN(VIN - VOUT)= 25V 1,2,3 01,02 10 mA Current limit 2/ ICL(VIN - VOUT)= 5 V 4 01,02 5.25 A NEGATIVE REGULATOR Reference voltage 2/ VREFVIN- VOUT= -1.2 V to -28 V, 1 mA IOUT 3 A,
42、 VOUT= -5 V1,2,3 01 -2.29 -2.45 V Dropout Voltage 2/ VDROPIOUT= 0.5 A, VOUT= -5 V 9,10,11 01 0.425 V IOUT= 3 A, VOUT= -5 V 1.05 Ripple rejection IOUT= 0.5 A, (VIN - VOUT)= 3 V, f = 120 Hz, CADJ= COUT= 25 F9,10,11 01 60 dB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or
43、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-10213 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TC+125C P PMA
44、Xunless otherwise specified Group A subgroups Device types Limits Unit Min Max NEGATIVE REGULATOR - CONTINUED Line regulation 2/ 3/ VOUTVIN1 V (VIN - VOUT) 20 V, VOUT= -5 V 1,2,3 01 0.02 %/V Load regulation 2/ 3/ VOUTIOUT5 mA IOUT 3 A, (VIN - VOUT) = -1.5 V to -10 V, VOUT= -5 V 4,5,6 01 0.8 % Minimu
45、m input voltage 2/ VIN MIN IOUT= 3 A, VOUT= VREF9,10,11 01 -4.5 V Internal current limit 2/ IMAX-1.5 V (VIN - VOUT) -10 V, TC = +25C 4 01 3.3 4.55 A (VIN- VOUT)=-15 V, TC = +25C 2.0 4.5 (VIN - VOUT) = -20 V, TC = +25 1.0 3.1 External current limit 2/ ILIMRLIM= 5 k 4,5,6 01 2.7 3.7 A RLIM= 15 k 0.9 1
46、.6 Quiescent supply current 2/ IQIOUT= 5 mA, VOUT= VREF, (-4 V VIN -25 V) 1,2,3 01 3.5 mA Supply current change with load 2/ IQ(VIN - VOUT)= .25 V +(.25 x IOUT) 1,2,3 01 35 mA/A (VIN- VOUT) -2 V 21 1/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose
47、 rate effects. Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. 2/ The active elements that make up this device have been tested to RHA designator level “R“ (100 krad(Si) of Method 1019, condition A of M
48、IL-STD-883 at +25C for these parameters and limits. RHA testing of the active elements covered on this SMD were done in alternate packages (TO3) and (TO39), not the packages as specified in paragraph 1.2.4. 3/ Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. Measu
