DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf

上传人:livefirmly316 文档编号:698550 上传时间:2019-01-02 格式:PDF 页数:11 大小:69.88KB
下载 相关 举报
DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf_第1页
第1页 / 共11页
DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf_第2页
第2页 / 共11页
DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf_第3页
第3页 / 共11页
DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf_第4页
第4页 / 共11页
DLA SMD-5962-76015 REV H-2009 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON.pdf_第5页
第5页 / 共11页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Change IIL, fMAX, tPHL4, and tPHL4. Delete minimum limits from propagation delays. Add vendor, FSCM 04713. Editorial changes throughout. 86-01-15 N. A. Hauck F Added approved source of supply. Updated boilerplate. 95-03-24 M. L. Poelking G Update

2、 to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-02-27 Raymond Monnin H Update drawing to current requirements. Editorial changes throughout. - gap 09-07-08 Charles F. Saffle CURRENT CAGE CODE IS 67268. The original first sheet of this drawing has been rep

3、laced. REV SHET REV SHET REV STATUS REV H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY T. E. Gordon DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AG

4、ENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY R. F. Gonzales APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, COUNTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 76-03-23 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 76015 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E171-09 Prov

5、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requireme

6、nts for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76015 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.

7、2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS197 50/30-MHz presettable decade or binary counter 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descrip

8、tive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line package D GDFP1-F14or CDFP2-F14 14 Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range

9、. -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 149 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supp

10、ly voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot

11、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and hand

12、books. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits,

13、 Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Sta

14、ndard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text

15、of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

16、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

17、class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordanc

18、e with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the devi

19、ce. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shal

20、l be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth tables shall be as specified on figure 2. 3

21、.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgrou

22、ps specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certificatio

23、n/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.

24、3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm th

25、at the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notifica

26、tion of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentatio

27、n shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 22

28、34 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -400 A VIN= 0.7 V or 2.0 V 1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4 mA VIN

29、= 0.7 V or 2.0 V 1, 2, 3 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V High level input current IIH1VCC= 5.5 V, 1, 2, 3 20 A at data or count/load VIH= 2.7 V High level input current IIH21, 2, 3 40 A at clear, clock 1 or clock 2 High level input current IIH3VCC= 5.5 V, 1, 2

30、, 3 100 A at data or count/load VIH= 5.5 V High level input current IIH41, 2, 3 200 A at clear, clock 1 or clock 2 Low level input current IIL1VCC= 5.5 V, 1, 2, 3 -400 A at data or count/load VIL= 0.4 V Low level input current IIL21, 2, 3 -800 A at clear Low level input current IIL31, 2, 3 -2.4 mA a

31、t clock 1 Low level input current IIL41, 2, 3 -1.3 mA at clock 2 Short circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 -6 -130 mA Supply current ICCVCC= 5.5 V 1, 2, 3 27 mA Functional tests See 4.3.1c 7 Maximum clock frequency fMAX VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 30 MHz 10, 11 20 2/ CL= 50 pF

32、10% 9 25 MHz 10, 11 17 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 T

33、ABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max Propagation delay time, clock 1 to QAtPLH1VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 15 ns 10, 11 21 2/ CL= 50 pF 10% 9 20 ns 10, 11 28 tPHL1VCC

34、= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 21 ns 10, 11 29 2/ CL= 50 pF 10% 9 26 ns 10, 11 36 Propagation delay time, clock 2 to QBtPLH2VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 19 ns 10, 11 27 2/ CL= 50 pF 10% 9 24 ns 10, 11 33 tPHL2VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 35 ns 10, 11 49 2/ CL= 50 pF 10% 9 40 ns

35、 10, 11 56 Propagation delay time, clock 2 to QCtPLH3VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 51 ns 10, 11 71 2/ CL= 50 pF 10% 9 56 ns 10, 11 78 tPHL3VCC= 5.0 V, RL= 5 k5% CL= 15 pF 10% 9 63 ns 10, 11 88 2/ CL= 50 pF 10% 9 68 ns 10, 11 95 Propagation delay time, clock 2 to QDtPLH4VCC= 5.0 V, RL= 2 k5%

36、CL= 15 pF 10% 9 78 ns 10, 11 109 2/ CL= 50 pF 10% 9 84 ns 10, 11 116 tPHL4VCC= 5.0 V, RL= 5 k5% CL= 15 pF 10% 9 95 ns 10, 11 133 2/ CL= 50 pF 10% 9 103 ns 10, 11 144 See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA

37、RD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min M

38、ax Propagation delay time, A, B, C, D, to QA, QB, QC, QDtPLH5VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 27 ns 10, 11 38 2/ CL= 50 pF 10% 9 32 ns 10, 11 45 tPHL5VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 44 ns 10, 11 62 2/ CL= 50 pF 10% 9 49 ns 10, 11 69 Propagation delay time, load to any output tPLH6VCC= 5.0

39、 V, RL= 2 k5% CL= 15 pF 10% 9 39 ns 10, 11 55 2/ CL= 50 pF 10% 9 44 ns 10, 11 62 tPHL6VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 45 ns 10, 11 63 2/ CL= 50 pF 10% 9 50 ns 10, 11 70 Propagation delay time, high to low level, clear to any output tPHL7VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 51 ns 10, 11 71 2/

40、CL= 50 pF 10% 9 56 ns 10, 11 78 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and gu

41、arantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEV

42、EL H SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D Terminal number Terminal symbol 1 COUNT/LOAD 2 QC3 (Data Input) C 4 (Data Input) A 5 QA6 CLOCK 2 7 GND 8 CLOCK 1 9 QB10 (Data Input) B 11 (Data Input) D 12 QD13 CLEAR 14 VCCFIGURE 1. Terminal connections. COUNT OUTPUT QDQCQBQA0

43、L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 5 L H L H 6 L H H L 7 L H H H 8 H L L L 9 H L L H 10 H L H L 11 H L H H 12 H H L L 13 H H L H 14 H H H L 15 H H H H H = High level. L = Low level. Output QAconnected to clock 2 input. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction

44、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76015 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordan

45、ce with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test cond

46、ition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in ac

47、cordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II.

48、 Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3, 10*, 11* * PDA applies to subgroup 1. * Subgroups 10 and 11, if not

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1