1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor, FSCM 04713. Delete min. limits from IILand propagation delays. Width of output pulse shall be guaranteed if not tested. Editorial changes throughout. 86-03-21 N. A. Hauck C NOR 5962-R142-92 92-02-21 M. L. Poelking D Add approved sourc
2、e of supply. Updated boilerplate. 95-03-24 M. L. Poelking E Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-06-24 Raymond Monnin F Add class “V“ to document. Update to reflect latest changes in format and requirements. Editorial changes throughout.
3、-les 03-11-06 Raymond Monnin G Update drawing to current requirements. Editorial changes throughout. - gap 09-07-14 Charles F. Saffle CURRENT CAGE CODE 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6
4、 7 8 9 10 11 PMIC N/A PREPARED BY T. E. Gordon DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY R. F. Gonzales APPROVED BY N. A. Hauc
5、k MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, MULTIVIBRATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 76-11-24 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 76039 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E173-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
6、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and
7、 space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examp
8、les. For device classes M and Q: 76039 01 E X Drawing number Device type (see 1.2.2)Case outline (see 1.2.4)Lead finish (see 1.2.5)For device class V: 5962 - 76039 01 V E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4
9、) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA
10、levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS123 Dual monostable multivibrator, retriggerable with clear 1.2.3 De
11、vice class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not
12、 be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHS
13、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-ST
14、D-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line package F GDFP2-F16 or CDFP3-F16 16 Flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A f
15、or device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ 110 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance,
16、 junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimim to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperatur
17、e range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th
18、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR
19、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
20、 Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption ha
21、s been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test e.g., IOS. Provided by IHSNot for ResaleNo repro
22、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q
23、 and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall
24、 be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-385
25、35, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic dia
26、gram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply o
27、ver the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In a
28、ddition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked.
29、Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535.
30、 The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6
31、.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this d
32、rawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device clas
33、ses Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devic
34、es acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore d
35、ocumentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 10 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or
36、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A subgroups
37、Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4.0 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 -1.5 V High level
38、 input current at data or enable P IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -0.4 mA Short circuit output current IOSVCC= 5.5 V 1/ 1, 2, 3 -15 -150 mA Supply current ICCVCC= 5.5 V 2/ 1, 2, 3 20 mA Functi
39、onal tests See 4.3.1c 7 Propagation delay time, high to low level A to Q 3/ tPHL1VCC= 5.0 V, RL= 2 k5% CL= 15 pF 10% 9 45 ns 10, 11 63 Rext= 5 k Cext= 0 CL= 50 pF 10% 9 50 ns 10, 11 75 Propagation delay time, low to high level A to Q 3/ tPLH1CL= 15 pF 10% 9 33 ns 10, 11 46 CL= 50 pF 10% 9 38 ns 10,
40、11 57 Propagation delay time, high to low level B to Q 3/ tPHL2CL= 15 pF 10% 9 56 ns 10, 11 78 CL= 50 pF 10% 9 61 ns 10, 11 92 Propagation delay time, low to high level B to Q 3/ tPLH2CL= 15 pF 10% 9 44 ns 10, 11 62 ns CL= 50 pF 10% 9 49 ns 10, 11 74 See footnotes at end of table. Provided by IHSNot
41、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol
42、Conditions -55C TC+125C Group A subgroups Limits Unit unless otherwise specified Min Max Propagation delay time, high to low level clear to Q 3/ tPHL3VCC= 5.0 V, RL= 2 k5% Rext= 5 k Cext= 0 CL= 15 pF 10% 9 27 ns 10, 11 38 CL= 50 pF 10% 9 32 ns 10, 11 48 Propagation delay time, low to high level clea
43、r to Q 3/ tPLH3CL= 15 pF 10% 9 45 ns 10, 11 63 CL= 50 pF 10% 9 50 ns 10, 11 75 Minimum width of Q output pulse, A or B to Q 3/ 4/ tWQ(MIN) CL= 15 pF 10% 9 200 ns 10, 11 302 ns CL= 50 pF 10% 9 205 ns 10, 11 308 Width of Q output pulse A or B to Q 3/ 4/ tWQVCC= 5.0 V, RL= 2 k5% Rext= 10 k Cext= 1000 p
44、F CL= 15 pF 10% 9 4.00 5.00 s 10, 11 3.20 5.70 s CL= 50 pF 10% 9 3.50 6.00 s 10, 11 3.00 6.25 s 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ ICC, if not tested, shall be guaranteed to the specified limits. 3
45、/ Propagation delay time testing may be performed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. 4/ Output pulse width, if not tested, shall be guaranteed to the specified lim
46、its. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76039 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F Terminal numb
47、er Terminal symbol 1 1A 2 1B 3 1 CLR 4 1 Q 5 2Q 6 2Cext 7 2Rext/Cext 8 GND 9 2A 10 2B 11 2 CLR 12 2 Q 13 1Q 14 1Cext 15 1Rext/Cext 16 VCCFIGURE 1. Terminal connections. INPUTS OUTPUTS CLEAR A B Q Q L X X L H X H X L H X X L L H H L H H L H H = High level. L = Low level. = from low to high level. X =
48、 Irrelevant (any input, including transitions). = from high to low level. = one high level pulse. = one low level pulse. An external timing capacitor may be connected between Cextand Rext/Cextpositive. For accurate repeatable pulse widths, connect an external resistor between Rext/Cextand VCCwith Rintopen circuited. To obtain variable pulse widths, connect external variable resistance between Rintor Rext/Cextand VCC. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or ne
