1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Add vendor CAGE 18324 for case S. Convert to military drawing format. Case outline S inactive for new design. 87-01-16 Charles Reusing D Drawing updated to reflect current requirements. Added class V requirements. Updated table II. - gt 03-12-15
2、R. Monnin E Update drawing to current requirements. Editorial changes throughout. - gap 09-09-03 Charles F. Saffle CURRENT CAGE CODE 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N
3、/A PREPARED BY A. J. Foley DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. R. Jackson APPROVED BY N. A. Hauck MICROCIRCUIT, DIGIT
4、AL, TTL, LOW POWER SCHOTTKY, OCTAL BUFFER, DRIVER/RECEIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 78-12-07 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 78012 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E246-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
5、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and spa
6、ce application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples.
7、 For device classes M and Q: 78012 01 R X Drawing number Device type (see 1.2.2) Case outline (see 1.2.4)Lead finish (see 1.2.5)For device class V: 5962 - 78012 01 V R X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) L
8、ead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA lev
9、els and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS240 Octal buffer/line driver/line receiver with three state outputs 1.2
10、.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and wil
11、l not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided b
12、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in M
13、IL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for devi
14、ce classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 1/ 275 mW Lead temperature (soldering
15、, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage (VCC)4.5 V dc minimum to 5.5 V dc maximum High level input voltage (VIH) . 2.0 V dc Low level input voltage (VIL) 0.7 V dc Case operatin
16、g temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
17、 cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Out
18、lines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue,
19、Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
20、exemption has been obtained. _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
21、VISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification
22、in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The
23、design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The term
24、inal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specif
25、ied herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The
26、 electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufactur
27、er has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5
28、.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certi
29、ficate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HD
30、BK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requi
31、rements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Not
32、ification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs a
33、gent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered b
34、y this drawing shall be in microcircuit group number 9 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL
35、 E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max High level input voltage VIH1, 2, 3 2 V Low -level input voltage VIL1, 2, 3 0.7 V Input clamp voltage VICVCC= 4.5 V,
36、 II= -18 mA, TC= +25C 1 -1.5 V High level output voltage VOHVCC= 4.5 V, VIL= 0.7 V, IOH= -3 mA, VIH= 2.0 V 1, 2, 3 2.4 V VCC= 4.5 V, VIL= 0.5 V, IOH= -3 mA, VIH= 2.0 V 2 V Low level output voltage VOLVCC= 4.5 V, VIL= 0.7 V, IOL= 12 mA, VIH= 2.0 V 1, 2, 3 0.4 V Off-state output current, high level vo
37、ltage applied IOZHVCC= 5.5 V, VIH= 2 V, VIL= 0.7 V, VOH= 2.7 V 1, 2, 3 20 A Off-state output current, low level voltage applied IOZLVCC= 5.5 V, VIH= 2 V, VIL= 0.7 V, VOL= 0.4 V 1, 2, 3 -20 A Input current at maximum input voltage IIVCC= 5.5 V, VIN= 5.5 V 1, 2, 3 0.1 mA High level input current, any
38、input IIHVCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 -200 A Output short circuit current IOSVCC= 5.5 V, VOUT= 0 V 1/ 1, 2, 3 -40 -225 mA Supply current ICCVCC= 5.5 V Output high 1, 2, 3 27 mA Output low44 All outputs disabled 50 Functional tests See
39、4.4.1c 7, 8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Ele
40、ctrical performance characteristics Continued. Test Symbol Conditions -55C TC +125C Group A subgroups Limits Unit unless otherwise specified Min Max Propagation delay time, high to low level output 2/ tPHLVCC= 5.0 V RL= 667 5% CL= 45 pF 10% 9 18 ns 10, 11 25 RL= 110 5% CL= 50 pF 10% 9 23 10, 11 35 P
41、ropagation delay time, low to high level output 2/ tPLHVCC= 5.0 V RL= 667 5% CL= 45 pF 10% 9 14 ns 10, 11 20 RL= 110 5% CL= 50 pF 10% 9 19 10, 11 29 Output enable time to high level 2/ tPZHVCC= 5.0 V RL= 667 5% CL= 45 pF 10% 9 23 ns 10, 11 32 RL= 110 5% CL= 50 pF 10% 9 30 10, 11 42 Output enable tim
42、e to low level 2/ tPZLVCC= 5.0 V RL= 667 5% CL= 45 pF 10% 9 30 ns 10, 11 42 RL= 110 5% CL= 50 pF 10% 9 35 10, 11 53 Output disable time from high level 2/ tPHZVCC= 5.0 V RL= 667 5% CL= 5 pF 10% 9 25 ns 10, 11 35 RL= 110 5% CL= 50 pF 10% 9 35 10, 11 45 Output disable time from low level 2/ tPLZVCC= 5
43、.0 V RL= 667 5% CL= 5 pF 10% 9 25 ns 10, 11 35 RL= 110 5% CL= 5 pF 10% 9 30 10, 11 45 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should not exceed one second. 2/ Propagation delay time may be performed using either CL= 5 pF, CL= 45 pF or
44、CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMB
45、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines R, S, and 2 Terminal number Terminal symbol 1 1 G 2 1A1 3 2Y4 4 1A2 5 2Y3 6 1A3 7 2Y2 8 1A4 9 2Y1 10 GND 11 2A1 12 1Y4 13 2A2 14 1Y3 15 2A3 16 1Y2 17 2A4 18 1Y1 19 2 G 20 VCCFIGURE 1. Terminal co
46、nnections. Inputs Output G A Y H X Z L H L L L H H = High voltage level L = Low voltage level X = Irrelevant Z = High impedance FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE
47、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78012 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
48、S, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall
