DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf

上传人:twoload295 文档编号:698615 上传时间:2019-01-02 格式:PDF 页数:9 大小:62.24KB
下载 相关 举报
DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf_第1页
第1页 / 共9页
DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf_第2页
第2页 / 共9页
DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf_第3页
第3页 / 共9页
DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf_第4页
第4页 / 共9页
DLA SMD-5962-78014 REV K-2005 MICROCIRCUIT LINEAR DUAL ANALOG SWITCH MONOLITHIC SILICON《硅单片双重模拟开关 线性微型电路》.pdf_第5页
第5页 / 共9页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED G Changes in accordance with NOR 5962-R154-92 92-08-31 M. A. FRYE H Drawing updated to reflect current requirements. Incorporate revision G NOR. Editorial changes throughout. -drw 00-10-02 R. MONNIN J Update to current requirements. Editorial chang

2、es throughout. -drw 03-03-11 R. MONNIN K Make correction to marking paragraph 3.5. -rrp 05-06-15 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY WILLIAM

3、 E. SHOUP DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, DUAL ANALOG SWITCH, MONOLITHIC SILICON AND AGENCIES OF T

4、HE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-01-19 AMSC N/A REVISION LEVEL K SIZE A CAGE CODE 14933 78014 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E330-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014

5、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying

6、Number (PIN). The complete PIN is as shown in the following example: 78014 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 DG1

7、29A Dual DPST analog switch 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line X CDFP3-F14 14 Flat pack 1.2.3 Lead fi

8、nish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VCC- VEE36 V dc VCC- VD. 36 V dc VDor VS- VEE. 36 V dc VD- VS. 22 V dc VCC- VR. 25 V dc VR- VEE25 V dc VIN- VEE. 30 V dc VCC- VIN. 25 V dc VIN- VR6 V dc Current (any terminal) 30 mA Storage temperature

9、range -65C to +150C Power dissipation (PD): 1/ 2/ Case A . 750 mW 3/ Case C . 825 mW 4/ Lead temperature (soldering 10 seconds) . 300C Junction temperature (TJ) 150C Thermal resistance, junction to case (JC): Case A . 70C/W Case C . 50C/W 1/ Must withstand the added PDdue to short circuit test (e.g.

10、, IOS). 2/ All leads soldered to board. 3/ Derate 10 mW/C above 75C. 4/ Derate 11 mW/C above 75C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVI

11、SION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing

12、to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 -

13、Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/ass

14、ist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

15、 this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class

16、 level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance wit

17、h the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. T

18、hese modifications shall not affect the PIN as described herein. A “Q” or “QML” certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be

19、as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein

20、, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are desc

21、ribed in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-

22、JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q” or “QML” certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted with

23、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgr

24、oups Device type Limits Unit Min MaxDrain source ON resistance RDS(ON)VD= 10 V, IS= -10 mA, 1, 3 All 30 VIN= 2.5 V 2/ 2 60 Source OFF leakage IS(OFF)VS= 10 V, VD= -10 V, 1 All 1 nA current VIN= 0.8 V 2/ 2 100 Drain OFF leakage ID(OFF)VS= -10 V, VD= 10 V, 1 All 1 nA current VIN= 0.8 V 2/ 2 100 Channe

25、l ON leakage ID(ON)VD= VS= -10 V, 1 All -2 nA current VIN= 2.5 V 2/ 2 -100 Input current, input voltage IINLVIN= 0.8 V 2/ 1, 3 All 0.1 A low 2 2 Input current, input voltage IINHVIN= 2.5 V 2/ 1, 2 All 60 A high 3 120 Turn ON time tON9 All 0.6 s 10, 11 0.9 Turn OFF time tOFF9 All 1.6 s 10, 11 2.4 Sou

26、rce OFF capacitance CS(OFF)VS= 0 V, ID= 0, f = 1 MHz All 3/ pF Drain OFF capacitance CD(OFF)VD= 0 V, IS= 0, f = 1 MHz All 3/ pF Channel ON capacitance CD(ON)+ CS(ON)VD= VS= 0 V All 4/ pF OFF isolation RL= 75, f = 1 MHz All 5/ dB See footnotes at end of table. Provided by IHSNot for ResaleNo reproduc

27、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+12

28、5C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxPositive supply current ICCVIN= 2.5 V 2/, one channel ON 1 All 3.0 mA VIN= 0 V, all channels OFF 25 A Negative supply current IEEVIN= 2.5 V 2/, one channel ON 1 All -1.8 mA VIN= 0 V 2/, all channels OFF -25 A Reference su

29、pply current IREFVIN= 2.5 V 2/, one channel ON 1 All -1.4 mA VIN= 0 V 2/, all channels OFF -25 A 1/ Unless otherwise specified: VCC= 12 V, VEE= -18 V, VR= 0 V. 2/ VIN= must be a step function with a minimum rise and fall rate of 1 V/s. 3/ Typically 2.4 pF. See table II, not tested. 4/ Typically 2.8

30、pF. See table II, not tested. 5/ Typically 60 dB. See table II, not tested. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted

31、 to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be pro

32、vided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufac

33、turers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CEN

34、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 6 DSCC FORM 2234 APR 97 Device type All Case outline A, C, and X Terminal number Terminal symbol 1 D22 S43 D44 NC 5 D36 S37 D18 S19 IN110 VR(ENABLE) 11 VCC12 VEE13 IN214 S2FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo re

35、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be

36、in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1

37、) Test condition A, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applic

38、able, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer

39、. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subg

40、roups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (meth

41、od 5004) 1*, 2, 3 Group A test requirements (method 5005) 1, 2, 3, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3, (10, 11)* * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to specified limits in table I. Provided by IHSNot for ResaleNo

42、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78014 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 8 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specif

43、ied in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, C, D, or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request.

44、The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packagi

45、ng requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

46、6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents

47、. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record

48、 of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has be

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1