1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED K Delete one vendor from device 01, CAGE 34335. Add a footnote to table I. Make editorial changes throughout. 88 - 05 - 24 Michael A. Frye L Changes in accordance with NOR 5962-R065-96 96 - 02 - 27 Michael A. Frye M Boilerplate updated to allow for
2、 alternate die/fabrication requirements. ksr 01 - 04 - 02 Raymond Monnin N Correction to marking paragraph 3.5, updated boilerplate paragraphs. ksr 05-03-02 Raymond Monnin P Update body of drawing to reflect current requirements. - glg 10-12-07 Charles Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING
3、 HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV P P P P P P P P P P OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Joan M. Fisher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson TH
4、IS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, NMOS, 2K X 8 UV ERASABLE PROGRAMMABLE READ ONLY MEMORY (PROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 02 February 1979 AMSC N/A REVISION LEVEL SIZE A CAGE COD
5、E 14933 78022 P SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E041-11 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78022 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 2 DSCC FORM 2234 APR 9
6、7 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78022 01 J X Drawing number Devic
7、e type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 (see 6.6) 2Kx8-Bit UV EPROM 450 ns 02 (see 6.6) 2Kx8-Bit UV EPROM 450 ns 03 (see 6.6) 2Kx8
8、-Bit UV EPROM 350 ns 04 (see 6.6) 2Kx8-Bit UV EPROM 350 ns 05 (see 6.6) 2Kx8-Bit UV EPROM 150 ns 06 (see 6.6) 2Kx8-Bit UV EPROM 200 ns 07 (see 6.6) 2Kx8-Bit UV EPROM 250 ns 08 (see 6.6) 2Kx8-Bit UV EPROM 300 ns 09 (see 6.6) 2Kx8-Bit UV EPROM 450 ns 1.2.2 Case outline(s). The case outline(s) are as d
9、esignated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 and CDIP2-T24 24 dual-in-line package 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage, VCC- - -0.3 V dc
10、 to +6 V dc 2/ Temperature under bias - -65C to +135C Storage temperature range - -65C to +150C Maximum power dissipation, PD- 635 mW Lead temperature (soldering, 10 seconds) - +300C Thermal resistance, junction-to-case (JC): - (See MIL-STD-1835) Junction temperature (TJ) - +160C All input or output
11、 voltages with respect to ground - - -0.3 V dc to +6 V dc VPPsupply voltage with respect to ground during program (device types 01, 02, 03, 04)- - -0.3 V dc to +26.5 V dc VPPsupply voltage with respect to ground during program (device types 05, 06, 07, 08, - -0.3 V dc to +13.5 V dc and 09) 1/ Lid sh
12、all be transparent to permit ultraviolet light erasure. 2/ All voltages referenced to VSS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78022 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHE
13、ET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Case operating temperature range - -55C to +125C Input low voltage, VIL- -0.1 V dc to +0.8 V dc Input high voltage, VIH- 2.0 V dc to 6.5 V dc High level program input voltage, VIH(PR), (device types 01, 02, 03, and 04) - - 24 V dc to 2
14、6 V dc High level program input voltage, VIH(PR), (device types 05, 06, 07, 08, and 09) - 12.0 V dc to 13.3 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified h
15、erein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Micr
16、ocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quickse
17、arch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this docum
18、ent, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product bui
19、lt to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualify
20、ing activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as descri
21、bed herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternati
22、ve approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. Provided by
23、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78022 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 4 DSCC FORM 2234 APR 97 3.2.2 Terminal connections. The terminal connections shall be as specified
24、on figure 1. 3.2.3 Truth table(s). See 3.2.3.1 and 3.2.3.2 3.2.3.1 Unprogrammed or erased devices. The truth table for unprogrammed devices shall be as specified on figure 2. 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.3 Electrical pe
25、rformance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in
26、table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mar
27、k. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product buil
28、t in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturers QM plan, the “QD” certification mark shall be used in place of the “Q“ or “QML“ certification mark. 3.6 Processing EPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the man
29、ufacturer prior to delivery. 3.6.1 Erasure of EPROMS. When specified, devices shall be erased in accordance with the procedures and characteristics specified in 4.4. 3.6.2 Programmability of EPROMS. When specified, devices shall be programmed to the specified pattern using the procedures and charact
30、eristics specified in 4.5. 3.6.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed to the specified pattern or erased. As a minimum, verification shall consist of performing a functional test (subgroups 7 and 8) to verify that all bi
31、ts are in proper state. Any bit that does not verify to be in the proper state shall constitute a device failure and shall be removed from the lot. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply i
32、n MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of confo
33、rmance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.10 V
34、erification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHS
35、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78022 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 5 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures
36、 shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-S
37、TD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as app
38、licable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufactu
39、rer. c. A data retention stress test shall be included as part of the screening procedure. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall ap
40、ply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capaci
41、tance. A minimum sample of five (5) devices with zero failures shall be required. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C or D. The test circu
42、it shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
43、in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4 Erasing procedure. The device is erased by exposure to high intensity shortwave ultraviolet light at a wavelength of 253.7 nm. The recommended integrated dose
44、 (i.e., UV intensity X exposure time) is 15 W-s/cm2. An example of an ultraviolet source which can erase the device in 30 minutes is the model S52 shortwave ultraviolet lamp. The lamp should be used without short wave filters and the EPROM should be placed about one inch from the lamp tubes. After e
45、rasure, all bits are in the high state. 4.5 Programming procedures. The programming procedures shall be as specified by the device manufacturer and shall be made available upon request. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78022 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL P SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C GND = 0V VCC= 5 V, VP
