1、 . . REVI 9 ION riglnal Date of 5%2-193 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-i SIZE BEfENSI IlECTROWlCS SIIWLY CEITIR A 1. SCOPE CODE IOENT. NO. DWQ NO; 11933 79017 . This drawing describes the requirements for monolithic silicon gate, c
2、H5 Inik!saeflchronous receiver/transmitter microcircuits. if microcircuit quality and re1 iabil ity assurance for procurement of microcircuits in accordance This drawing provfdes for a level iith MILA-38510, 1.2 Part nunber. The complete part nunber shall be as show in the following example: T T f f
3、 I Drawing nunber (1.2.1) (1.2.2) (3.3) 1.2.1 Devlce type. The device type shall identify the circuit function as follows: Device type Generic nunber Circuit o1 1854 sil icon S9t.e U.A.R.T 1.2.2 Case outline. The case outline shall be as designated in M!L-M-38510, appendix C and as 01 1 ows : Out1 i
4、ne 1 etter Q Case outline D-5 (40 lead, 9/16“ X 2 1/16“) 1.3 Absolute maximun ratings. Supply voltage range- - - - - - - - - - - - - - - - - -0.5 Vdc to +15 Vdc Input voltage range - - - - - - - - - - - - - - - - - -0.5 to Voo M.5 Vdc Storage temperature range - - - - - - - - - - - - - - -65Y to +15
5、O0C Maxlmun pomr dissipation, PD l/- - - - - - - - - - - 500 mdc g/ Lead temperature (soldering 10 seconds) - - - - - - - +3OO0C Junction tanperature- - - - - - - - - - - - - - - - - TJ - +175OC 1.4 Recamnended oueratlnq condltlons. Supply voltage- - - - - - - - - - - - - - - - - - - - +4 Vdc minimu
6、n to +12 Vdc maximun knblent operating temperature range - - - - - - - - - -55OC to +125OC - 1/ Must wlthstan the added PD due to short circuit test (e.9. Ias) - 2/ For TA = +lo0 to +125OC, derate linearly at 12 M/OC to 200 W. c Provided by IHSNot for ResaleNo reproduction or networking permitted wi
7、thout license from IHS-,-,-I 4 DEFENSE ElECTRllES SUPPLY CENTER IAYTON, OHIO 2. APPLICABLE DOCIMENTS 2.1 Issue of docuiients. The following docuiicnts, of the issue in effect on date of invitation SPEC IF ICAT I ON MILITARY Dr blds or request for proposal, form a pdrt of this clrawiny to Lhe extent
8、specified herein. MIL-M-38510 - Kicrocircuits, General Specification for. STANDARD MIL ITAHY MIL-STO-883 - Test Methods and Procedures for Yicroelectroaics. (Copies of specificatiotis, standards, drawifigs, and publications reqdired by suppliers ifi connec- ion with specific procurement functions sh
9、ould be chtaiced from tht Drxtrring activity or as irected by the contracting officer .) 3. REQUIREMENTS A I 14933 I 79017 REV WOE 3 3.1 Item requirernent2. The individual itea requirements shall hP in dc:rdance with IL-M-38510, and as specified herein. 3.2 Desi n construction, and physical dimensio
10、ns. The design, cczstruction, and physical imensiodbbe as specified in MIL-M-3851C and herein. 3.2.1 esign documentation. The design dccunentation shall be in arcnrdance with MIL-M-38510 nd, unless otherwise specified in-the contract or purchase order, shall be retained by the manu- acturer but be a
11、vailahle for review by the procuring activity ai r!;atr;ictcr lipon request. 3.2.2 Terminal connections. The terminal connections shall be as spcified on figure 1. 3.2.3 Case outlines. The case outlines shal; b in accordzrice with 1.2.2. 3.3 Lead material andfinish. Lead Raterial BFL fintsh shall be
12、 in accordance with MIL-M-38510. 3.4 Electrical performance characteristics. The e: tctricsl fwnatlce characteristics are as pecified in table I and apply over the full recm;.nued ainl;iorit operating temperature range, un- ess otherwise specified. 3.5 Markinq. Marking shall be in accordance with P:
13、;-M-38512 except the part nunber shall be n accordance with 1.2 herein. sed. The M38510/XXX part nimber, and the “JAil or “J“ mark shall not be 3.6 Product assurance requirements. Microcircuits furnished under this drawing shall have been ubjected to, and passed all the reqxrements, tests. and inspe
14、ctions dezailed herein including creening, and quality conformance inspectlon requirme?ts. I I I DESC FORM U4A MAR 74 T Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-8 - -.- 999999b 0123062 30T - - - - - - I TABLE I. El ec tr ical character i st ic
15、 s. Conditione Units V - - V Limits Test Ei- High-level output vol tage = 5 Vdc OD 10 Vdc 15 Vdc VIN = O or VDD , 2, 3 = 5 Vdc uDD 10 Vdc 15 Vdc VIN = O or VDD 1, 2, 3 Low-level output vol tage -. 1, 2, 3 Vo * 0.5 or VDD 5 Vdc 4.5 Vdc 9.0 Vdc = 1.0 or = 1.5 or VDD= 10 Vdc VoD = 15 Vdc 13.5 Vdc Low-l
16、evel input vol tage High-level output current VOH = 4.5 Ydc VOH = 13.5 Vdc VDD = 5 Vdc VDD = 15 Vdc VOL = 0.4 Vdc VOL - 0.5 Vdc VOL = 1.5 Vdc Voo = 5 Vdc YOD = 10 Vdc VDD = 15 Vdc I, 2, 3 Low-level output current VDD 15 Qdc TA -55OC, 25OC I, 2. 3 Qui e scent current TA = 125OC 3- state uutput leakag
17、e current 9 Maximm clock frequency TA = 25OC CL = 50 pF i101 VDD = 5 Vdc SIZE CODE IDENT. NO. DWO NO. A 14933 DtffSE EtlC1RONIEE SUPPLY CENTER AY101, OWID 7901 7 I REV IPAQl 4 4 BI st ?om 144A YAR ib Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-b
18、9999996 0323063 24b .n I I TABLE I. Electrical characteristics - Continued. Limits jmup A ubgroups lyrnbol Conditione Test kximun clock input r 1 se/ fa1 1 time MPX - 5 TA 25OC VDD 4 -12 V 9 tr. tf 9 Minimun clock pulse width TA 25OC Voo 5 V tr= tf= 10ns VDD = i0 V cL = 50 pl *lox 150 15 - 500 250 1
19、50 75 150 75 - - - -7 Minimun master reset, clear pulse width 9 VDD 5 V voo - 10 v 9 Input data setup time 9 voo = 5 V Voo = 10 v Input data hold time SIZE CODE IDENT. N0.I OW6 Mo- A l 14933 I, I BU fNSt ELECTRONICS SOW1 CtlllO BWN, unie 7901 7 t birr CORY 1UA YAR ?b -. Provided by IHSNot for Resale
20、No reproduction or networking permitted without license from IHS-,-,- -4 I_ W 9999996 0123064 LB2 W k- -I I MODE 2 -1 I t vcc MODE (VSS) VSS RRO RB7 RB6 RES RB4 RB3 RB 2 RB i RBO PE FE OE SFO RCLOCK DAR - DA so I PE WSLI WSL2 SBS PI CRL TB7 TB 6 TB5 TB4 TB3 TB2 TB I 160 soo TSRE THRL THRE MR FIGURE
21、1. Terminal conriections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1 3.6.1 Scrcenin . Screening shall be in accordance with method 5004, class 6, of MIL-STO-883 and ,.3 hereInd0 percent final electrical screening for off the shelf devices shal
22、l consist of he normal 100 percent K tests at 25OC with 10 percent POA, high and low temperature DC tests, and 15.C AC tests folloried by normal sampling and LTWs at group A lot acceptance. 3.6.2 pualification. Qualification inspection shall not be required. 3.6.3 Quality conformance inspection. Qua
23、lity conformance inspection shall be in accordance dth MIL-M-38510 and 4.4 herein. 3.7 Manufacturer eligibility. To be eligible to supply microcircuits to this drawing, a manu- Facturer must have manufacturer certification in accordance with MIL+-38510 for at least one line ind have PART I listing o
24、n Qualified Products List QPL-38510 for at least one device type (not iecessarlly the one for Mich the procurement of this drawing is to apply). 4. PRODUCT ASSURANCE PROVISIONS 4.1 4.2 Qualification inspection. Qualification inspection to this device type shall not be required. 4.3 Screenin . Screen
25、ing shall be in accordance with method 5004 of MIL-STO-883, and shall be Sampllng and inspection. Sampling and inspection procedures shall be in accordance wlth IIL-M-38510 and method 5005 of MIL-STO-883, except as modified herein. :onducted -Tp on a devices prlor to quality conformance inspection.
26、The following additional criteria ;hall apply: a. urn-in test (method 1015 of MIL-ST-883). (1) Test condition A, O or E, each circuit must be drfven with an appropriate signal to (2) TA = 125OC minimun. simulate circuit appl Ications and each circuit shall have maximun load appl ied . b. Interim and
27、 final electrical test parmeters shall be as specified in table II, except Interim electrical parmeters test prior to burn-in is optional at the discretion of the manufacturer. C. Percent defective allowable (PDA) - The PDA is specified as 10 percent based on failures from group A, subgroup 1, test
28、after cooldoini as final electrical test In accordance with method 5004 of MIL-STD-883, and with no intervening electrical measurements. If interim electrical paraneter tests are performed prior to burn-in, failures resulting from pre burn-in screening may be excluded from the POA. If interim electr
29、ical paran- eter tests prior to burn-in are omitted, then all screening failures shall be included in the PA. The verified failures of group A, subgroup 1, after burn-in divided by the total nunbtr of devices submitted for burn-in in that lot shall be used to determine the percent defective for the
30、lot. 1IL-M-38510. Groups A and B inspections shall be performed on each lot. Quality assurance shall reep lot records for 3 years (minimun), monitor for cmpliance to the prescrlbed procedures, and *serve that satisfactory manufacturing conditions and records on lots are maintained for these ievices.
31、 The records, including as a mlnimun an attributes sumiary of all screening and quality :onforaance Inspections conducted on each lot, shall be available for review by the customer at i1 1 times. ialues show in table I of method 5005 of MIL-ST-883 (class 6) and as follows: 4.4 Quality conformance in
32、spection. Quality conformance Inspection shall be in accordance with . 4.4.1 Group A inspectfon. Group A inspection shall consist of the test subgroups and LTW a. Tests shall be as specified in table II. b. Subyroups 4, 5, 6, 7, ti, 10 and 11 of table I of method 5005 of MIL-ST-U83 shall be anitted.
33、 4- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- m. ,- - - . d. L- I b 0323066 T55 a 4.4.2 Group 0 inspection. In group 0 inspection, each inspection lot shall be shjected to the 4.4.3 Group C and group D inspection. Group C and group D inspectio
34、ns shall be as specified In test subgroups and LTPD values show in table IIb of method 5005 of MIL-STO-883, class B. method 5005 of NIL-STD-883, class B. The frequency of testing and the sample size shall be in accor- dance with M1L-M-38510. Generic test data (6.5) may be used to satisfy the require
35、ments for group C and group O inspection. a. End point electrical paraneters shall be as specified in table II. b. Operating life test (method 1005 of MIL-STO-883) conditions: (1) Test condition D or E, each circuit must be driven with an appropriate signal to (2) TA = 125OC, minimun. (3) Test durat
36、ion: 1,000 hours. c. Subgroups 3 and 4 shall be added to the group C inspection requirements and shall consist of the tests, conditions, and limits specified for subgroups 10 and 11 of group A. simulate circuit applications and each circuit shall have maxiinun load applied. 4.5 Inspection of prepara
37、tion for delivery. Inspection of preparation for delivery shall be in accordance with MIL-M-38510, except that the rough handling test shall not apply. TABLE II. Electrical test requirements. I MIL-STO-883 test requfrements I Subgroups L/ I 1 - -1 electrical parameters (pre burn-in) (method 5004, 3.
38、1.9) Final electrical test rameters i*, 2, 3, 9 Group A test requiranents (method 5004, 3.1.15$ 18 2s 3, (method 5005) 9 r Groups C and D end point 192, 3 electrical parameters . (method 5005) groups for group C per iodic inspect ions PDA applies to subgroup 1 (see 4.3). - 1/ Subgroups per method 50
39、05, Table I. Additional electrical sub- 5. PACKAGING 5.1 Packaging requirments. The requirements for packaging shall be in accordance with MIL-M-383T0. 6. NOTES 6.1 m. Uily 6.4 of the notes specified in MIL-M-38510 shall apply to this drawing. Provided by IHSNot for ResaleNo reproduction or networki
40、ng permitted without license from IHS-,-,-6.2 Intended use. Microcircuits conforming to this drawing are intended for use when military ipecifications do not exist and qualified military devices that will perform the required function ire not available for OEM application. This drawing is intended e
41、xclusively to prevent the polif- ?ration of unnecessary dupl icate specifications. drawings and stock catalog listings. hen a nilitary specification exists and the product covered by this drawing has been qualified for listlng ,n QPL-38510, this drawing becanes obsolete and will not be used for new
42、design. The QPL-38510 woduct shall be the preferred item for all applications. 6.3 Ordering data. lhe contract or order should specify the following: a. Complete part nunber (see 1.2). b. Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspect
43、ion lot to be supplied wtth each shipnent by the device manufacturer, if applicable. c. Requlrement for certificate of compliance, if applicable. d. Requirements for notification of change of product or process to procuring activity, if applicable. e. Requirements for packaging and packing. f. Requi
44、rements for carrier, special lead lengths or lead forming, If applicable. requirements shall not affect the part nunber. Unless otherwise specified, these requirements will not apply to direct shipment to the Government. These 6.4 Replaceability. Replaceability is determined as follows: a. Microcirc
45、uits covered by this drawing will replace the same generic device covered by contractor prepared specification or drawing. b. #hen Military Specification MIL-M-38510/475 is issued, the part nunbered devices specified in this drawing will be replaced by the microcircuit identified as part nunber M385
46、10/47501 B- . 6.5 Generic test data. Generic test data may be used to satisfy the requirements of 4.4.3. Generic test data is defined as test data from devices manufactured during the same tlme period, by means of the same production technique, materials, controls and design, and in the same mlcro-
47、circuit group (see 3.1.3(h) of MIL-M-38510) as the deliverable devices. The same time period shall be interpreted as covering a maximun span of 180 days between the generic test sample fabrication and the fabrlcation of deliverable devices. The vendor is required to retain generic data for a period
48、of not less than 36 months from the date of shlpnent. accunulatlon of static charge. Input protective devices hiive been designed in the chip to minimize the effect of this static buildup. tbwever, the following handling practices are recmended : 6.6 Handllnq. MOS devices must be handled with certai
49、n precautions to avoid daage due to a. Devices should be handled on benches with conductive and grounded surface. b. Ground test equi pment and tool s. c. O0 not handle devices by the leads. d. Store devices in conductive foam or carriers. e. Avoid use of plastice, Tubber, or silk in MOS areas. f. Maintain relative hunidity above 50 percent if practical. 1 S
