DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf

上传人:registerpick115 文档编号:698638 上传时间:2019-01-02 格式:PDF 页数:11 大小:71.69KB
下载 相关 举报
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf_第1页
第1页 / 共11页
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf_第2页
第2页 / 共11页
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf_第3页
第3页 / 共11页
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf_第4页
第4页 / 共11页
DLA SMD-5962-79024 REV D-2011 MICROCIRCUITS MEMORY DIGITAL 8192 BIT SWITCHABLE SCHOTTKY BIPOLAR PROM WITH TRI-STATE OUTPUT MONOLITHIC SILICON.pdf_第5页
第5页 / 共11页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change to military drawing format. Change from a suggested source drawing to an approved source drawing. Add CAGE 34335 and device type 02. Add case outline letters K, L, X, and 3. Change drawing CAGE to 67268. 88-01-15 M. A. Frye B Updated boile

2、rplate. Removed programming specifics from drawing. Separated source bulletin from body of drawing. - glg 00-08-01 Raymond Monnin C Correction to marking paragraph 3.5, updated boilerplate paragraphs. ksr 05-03-02 Raymond Monnin D Boilerplate update, part of 5 year review. ksr 11-01-20 Charles F. Sa

3、ffleTHE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY A. J. Foley DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIR

4、CUIT DRAWING CHECKED BY C. R. Jackson THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUITS, MEMORY, DIGITAL, 8192 BIT, SWITCHABLE, SCHOTTKY, BIPOLAR PROM WITH TRI-STATE OUTPUT, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 13

5、 August 1979 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 1493379024 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E164-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-

6、3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in

7、the following example: 79024 01 J A | | | | | | | | | | | | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit Access time 01 1/ 1K x 8-bit

8、 power switched bipolar PROM 90 ns 02 1/ 1K x 8-bit power switched bipolar PROM 75 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GD

9、FP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line package X CQCC1-N32 32 rectangular chip carrier package 3 CQCC1-N28 28 square leadless chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Sup

10、ply voltage range . -0.5 V dc to +7.0 V dc Address/enable Input voltages . -0.5 V dc to +5.5 V dc Address/enable Input current -30 mA dc to +5.5 mA dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835

11、 1.4 Recommended operating conditions. Case operating temperature range (TC) . -55C to +125C Supply voltage range (VCC) 4.5 V dc to 5.5 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part of this drawin

12、g to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103

13、. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated

14、 Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK

15、-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between t

16、he text of this drawing and the references cited herein, the text of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements

17、 shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certific

18、ation to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. Thes

19、e modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

20、specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Unprogrammed devices. Testing to the applicable truth table, or alternate testing as specified in 4.3.1d, shall be used for unprogrammed devices for contra

21、cts involving no altered item drawing. When testing is required per 4.3 herein, the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed) or to any altered item drawing pattern which includes at least

22、25 percent of the total number of bits programmed. 3.2.3 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless other

23、wise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each

24、 subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. Provided by IHSNot for ResaleNo reproduction or networking permitted with

25、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 79024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test | | Conditions | Group A |Device | Limits | | Symbol | -55C TC +125C |subgroups | t

26、ype | |Unit | | 4.5 V VCC 5.5 V | | | Min | Max | | | unless otherwise specified | | | | | | | | | | | | High level output voltage |VOH|VIL= 0.8 V, VIH= 2.0 V | 1, 2, 3 | All | 2.4 | | V | |IOH= -2.0 mA, VCC= 4.5 V | | | | | | | | | | | | | | | | | | | Low level output voltage |VOL|VIL= 0.8 V, VIH=

27、2.0 V | 1, 2, 3 | All | | 0.5 | V | |IOL= 16 mA, VCC= 4.5 V | | | | | | | | | | | | | | | | | | | Low level input voltage |VIL| VCC= 5.5 V | 1, 2, 3 | All | | 0.8 | V | | | | | | Input clamp voltage |VIC|VCC= 4.5 V, IIN= -18 mA, | 1, 2, 3 | All | | 0.8 | V | |Ambient temperature = 25C | | | | | | |

28、| | | | | Input threshold voltage |VIH| VCC= 4.5 V | 1, 2, 3 | All | 2.0 | | V | | | | | | | | | | | | | Address/enable input |IIH|VIH= 5.5 V | 1, 2, 3 | All | | 40 | A | | | | | | | | | | | | | | Address/enable input |IIL|VIN= 0.45 V | 1, 2, 3 | All |-1.0 | -250 | A | | | | | | Output short-circuit

29、 | | | | | | | current 1/ 2/ |IOS|VOUT= 0.2 V 1/ | 1, 2, 3 | All |-12 |-100 | mA | | | | | | | | | | | | | | Output disable current |IOHE|VCC= 5.5 V, VOUT= 2.4 V | 1, 2, 3 | All | | 40 | A | | | | | | | | | | | | | | Output disable current |IOLE|VOL= 0.45 V, VOUT= 5.5 V 2/ | 1, 2, 3 | All | | -40 |

30、A | | | | | | | Supply current |ICC|VCC= 5.5 V Disabled | 1, 2, 3 | All | | 80 | mA | | | | | | | | |All inputs grounded Enabled | | | | 185 | | | | | | | | Input capacitance |CIN|VIN= 2.0 V dc; f = 1 MHz | 4 | All | | 8 | pF |Ambient temperature = 25C | | | | | | | | | | | | Address access time |tA

31、VQV|See figure 2 and 3 | 9, 10, 11 | 01 | | 90 | ns | | | | 02 | | 75 | | | | | | | | | | | | | | | Chip power-down delay |tGVQZ|See figure 2 and 3 | 9, 10, 11 | All | | 50 | ns to tri-state | | | | | | | | | | | | | | | | | | | | | Chip power-up access |tGVQV|See figure 2 and 3 | 9, 10, 11 | 01 | |

32、 115 | ns time | | | | 02 | | 225 | | | | | | | | 1/ Not more than one output shall be shorted at a time for a maximum duration of one second. 2/ Device is in the three state. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

33、ING SIZE A 79024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, Appendix A. 3.6 Certificate of compliance. A certificate of complia

34、nce shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the

35、 requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change

36、 to DLA Land and Maritime-VA shall be required for any change that affects this drawing 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore d

37、ocumentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shal

38、l be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test (method 1015 of MIL-STD-883). (1) Test condition C, D or E. The test circuit shall be maintained by the manufacturer under document revision level control and shall b

39、e made available to the preparing or procuring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test

40、parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including grou

41、ps A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for the initi

42、al test and after process or design changes which may affect input capacitance. d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of group A, subgroups 9. 10, and 11. Either of two techniques is acceptable: (1) Testing the entire lot using

43、additional built-in test circuitry which allows the manufacturer to verify programmability and ac performance without programming the user array. If this is done, the resulting test patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing per the sampling plan specif

44、ied in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to programming. If more than 2 devices fail to program

45、, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable. Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than 2 total

46、devices fail, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than 4 total device failures allowable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

47、IZE A 79024 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device Types All Case Outlines J, K, L X 3 Terminal Number Terminal Symbol Terminal Symbol Terminal Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS Q3 Q4 Q5 Q6 Q7 E4 E3 E2 E1 A9 A8 VCC - - - - - - - - - - - - - - - - - - - - - - - - NC NC A7 A6 A5 A4 A3 A2 A1 A0 NC Q0 Q1 Q2 NC VSS Q3 NC Q4 Q5 Q6 Q7 NC E4 E3 E2 NC E1 A9 A8 NC V

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1