1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete minimum limits from IILand propagation delays. Change IILmaximum limit. Editorial changes throughout. 86-03-16 N. A. Hauck B Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 05-01-13 Raymond M
2、onnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY H. L. Baker DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, O
3、HIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, BINARY MULTIPLIER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 81-01-19 MONOLITHIC SILICON AMSC N/A REVISION LEVEL
4、 B SIZE A CAGE CODE 14933 80026 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E081-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET
5、 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 80026 01 E
6、 X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS261 2-bit-by-4-bit parallel binary multiplier 1.2.2 Case outline(s). The case outlin
7、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings
8、. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 209 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction tem
9、perature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipat
10、ion is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
11、ION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are th
12、ose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case
13、Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document
14、Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws an
15、d regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qu
16、alified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MI
17、L-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification ma
18、rk in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines sha
19、ll be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perform
20、ance characteristics are as specified in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table
21、 I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
22、D MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The com
23、pliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source o
24、f supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance.
25、A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSC
26、C, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without
27、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDe
28、vice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -0.4 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4.0 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V Low level input cu
29、rrent IIL1VCC= 5.5 V, VIN= 0.4 V at all inputs except M0, M1, or G 1, 2, 3 All -400 A IIL2at M0 or M1 1, 2, 3 All -720 A IL3at G 1, 2, 3 All -600 A High level input current IIH1VCC= 5.5 V, VIN= 2.7 V at all inputs except M0 or M1 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 100 A IIH3 VCC
30、= 5.5 V, VIN= 2.7 V at M0 or M1 1, 2, 3 All 40 A IH4 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 200 A Short circuit output current IOSVCC= 5.5 V, VOUT= GND 1/ 1, 2, 3 All -15 -100 mA Supply current ICC VCC= 5.5 V, VIN= GND 1, 2, 3 All 38 mA Propagation delay time, tPLH1VCC= 5.0 V, 9, 10, 11 All 52 ns from e
31、nable tPHL1RL= 2 k 5%, 9, 10, 11 All 46 ns Propagation delay time, tPLH2CL= 50 pF 10% 9, 10, 11 All 58 ns from any M tPHL29, 10, 11 All 52 ns Propagation delay time, tPLH39, 10, 11 All 61 ns from any B tPHL39, 10, 11 All 55 ns 1/ Not more than one output should be shorted at a time and the duration
32、of the short circuit condition should not exceed one second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 A
33、PR 97 01 Case outlines E, F Terminal number Terminal symbols 1 B3 2 B4 3 G (LATCH CONTROL) 4 M2 5 Q4 6 Q3 7 Q2 8 GND 9 Q1 10 Q0 11 M0 12 M1 13 B0 14 B1 15 B2 16 VCCFIGURE 1. Terminal connections. Inputs Outputs Latch Multiplier control G M2 M1 M0 Q4 Q3 Q2 Q1 Q0 L X X X Q40Q30Q20Q10Q00H L L L H L L L
34、 L H L L H B4 B4 B3 B2 B1 H L H L B4 B4 B3 B2 B1 H L H H B4 B3 B2 B1 B0 H H L L B4 B3 B2 B1 B0 H H L H B4 B4 B3 B2 B1 H H H L B4 B4 B3 B2 B1 H H H H H L L L L H = high level, L = low level, X = irrelevant. Q40. Q00= The logic level of the same output before the high-to-low transition of G. B4 . B0 =
35、 The logic level of the indicated multiplicand (B) input. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEE
36、T 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality con
37、formance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring
38、activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II he
39、rein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - -
40、- Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 Additional electrical subgroups for group C periodic inspections 10, 11 * * PDA applies to subgroup 1. * Subgroups 1
41、0 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1
42、 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
43、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 80026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test
44、conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs
45、, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging sh
46、all be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this
47、drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD
48、Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Appro
