1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED J Deleted reference to checkerboard pattern in 3.2.2.1. Deleted footnote reference to how subgroups 7 and 8 are verified in table II. Added footnote 2 to device types 11RX, 12RX, 13RX, and 14RX. Removed reference to case outline Y in 6.6, previousl
2、y replaced with case outline S. Editorial changes throughout. 1989 DEC 04 M. A. Frye K Changes in accordance with NOR 5962-R220-96 1996 SEP 13 William Johnson L Boilerplate update, part of 5 year review. REDRAWN ksr 2005 JUN 14 Raymond Monnin M Updated boilerplate paragraphs as part of a 5 year revi
3、ew. ksr 10-11-10 Charles F. Saffle REV SHET REV M M M M M SHEET 15 16 17 18 19 REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James Jamison DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO
4、43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR, PROGRAMMABLE LOGIC, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 22 July 1982 AMSC N/A REVISION LEVEL M SIZ
5、E A CAGE CODE 67268 81036 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E050-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 2 DSCC FORM 2
6、234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 81036 01 R A Drawing num
7、ber Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01, 07, 11 PAL16L8, L8A, L8A-2 16-input 8-output AND-OR invert gate array 02, 08, 12 PAL16R8, R8A,
8、R8A-2 16-input 8-output registered AND-OR gate array 03, 09, 13 PAL16R6, R6A, R6A-2 16-input 6-output registered AND-OR gate array 04, 10, 14 PAL16R4, R4A, R4A-2 16-input 4-output registered AND-OR gate array 05 PAL16X4 16-input 4-output registered AND-OR exclusive OR gate array 06 PAL16A4 16-input
9、4-output registered and-carry-or exclusive OR gate array 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat packag
10、e 1/ 2 CQCC1-N20 20 Square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (platinum-silicide) -0.5 to +7.0 V dc Supply voltage (titanium-tungsten) -0.5 to +12.0 V dc Input voltage range -0.5 to +5.5 V
11、 dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) 2/ See MIL-STD-1835 Output voltage applied . -0.5 V to VCCmaximum dc 3/ Output sink current . 100 mA Maximum power dissipation (PD) 4/ Device types 01, 02, 03, 04, 0
12、5, and 06 2.0 W Device types 07, 08, 09, and 10 1.0 W Device types 11, 12, 13, and 14 .5 W Maximum junction temperature (TJ) . +175C 1/ Outline letter Y was removed along with corresponding case outline, figure 1 (herein), and replaced with outline letter S with corresponding case outline F-9 (MIL-S
13、TD-1835). 2/ Heat sinking is recommended to reduce the junction temperature. 3/ Except during programming. 4/ Must withstand the added PD due to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
14、WING SIZE A 81036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage 2.0 V dc Maximum low level input voltage 0.8 V dc Case operating
15、 temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
16、cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outl
17、ines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue,
18、Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
19、exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QM
20、L) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as do
21、cumented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38
22、535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified
23、 on figure 1. 3.2.2 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, or C (see 4.3), the device
24、s shall be programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of fuses shall be programmed or to any altered item drawing pattern which includes at least 25 percent of the total number of fuses programmed. 3.2.2.2 Programmed devices. The truth table for program
25、med devices shall be as specified by an attached altered item drawing. 3.2.3 Logic diagram(s). The logic diagram(s) shall be as specified on figure 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81036 DLA LAND
26、 AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 4 DSCC FORM 2234 APR 97 3.2.4 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
27、 specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in acc
28、ordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For programmed devices, the altered item drawing number shall be added to the marking by the programming activity. 3.5.1 Certification/compliance
29、 mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certific
30、ate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affi
31、rm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Not
32、ification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility an
33、d applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10. Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of configurations; two processing op
34、tions are provided for selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.2.1 and table II. It is recommended that users perform subgroups 7 and 9 after programming to ver
35、ify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery. 4. VERIFICATION 4.1
36、 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional
37、 criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
38、 specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tes
39、ts prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 5 DSCC FORM 2234
40、 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions TC= -55C to +125C unless otherwise specified Device type Group A subgroups Limits Unit Min Max Input clamp voltage VICVCC= 4.5 V, II= -18 mA All 1, 2, 3 -1.5 V High level output voltage VOHVCC= 4.5 V, VIL= 0.0 V VIH= 3.0
41、 V, IOH= -2 mA 1-10 1, 2, 3 2.4 V 11-14 2.3 Low level output voltage VOLVCC= 4.5 V, VIL= 0.0 V VIH= 3.0 V, IOL= 12 mA All 1, 2, 3 0.5 V High level input voltage VIH1/ All 1, 2, 3 2 V Low level input voltage VIL1/ All 1, 2, 3 0.8 V High level input current IIHVCC= 5.5 V, VI= 2.4 V 2/ All 1, 2, 3 40 A
42、 Low level input current IILVCC= 5.5 V, VI= 0.4 V 2/ All 1, 2, 3 -0.25 mA Output short circuit current IOSVCC= 5.5 V, VO= 0.5 V 3/ All 1, 2, 3 -30 -250 mA Input Current IIVCC= 5.5 V, VI= 5.5 V All 1, 2, 3 1 mA Off-state output current IOZLVCC= 5.5 V, VIL= 0.0 V VIH= 3.0 V, VO= 0.4 V 2/ All 1, 2, 3 -
43、100 A Off-state output current IOZHVCC= 5.5 V, VIL= 0.0 V VIH= 3.0 V, VO= W.4 V 2/ All 1, 2, 3 100 A Supply current ICCVCC= 5.5 V 01 - 04, 07 - 10 1, 2, 3 185 mA 5 225 6 240 11 105 12 - 14 95 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without
44、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions TC= -55C to +125C unless otherwise specified Device type
45、Group A subgroups Limits Unit Min Max Propagation delay data input to output tPHLVCC= 5.0 V, CL= 50 pF 10% R1= 390, R2= 750 01, 03, 04, 05, 06 9, 10, 11 45 ns 07, 09, 10 30 11, 13, 14 50 Propagation delay data input to output tPLH01, 03, 04, 05, 06 9, 10, 11 45 ns 07, 09, 10 30 11, 13, 14 50 Propaga
46、tion delay output high impedance to output high 1/ tPZH01, 03, 04, 05, 06, 11, 13, 14 9, 10, 11 45 ns 07, 09, 10 30 Propagation delay output high impedance to output low tPZL01, 03, 04, 05, 06, 11, 13, 14 9, 10, 11 45 ns 07, 09, 10 30 Propagation delay output high to output high impedance 1/ tPHZ01,
47、 03, 04, 05, 06, 11, 13, 14 9, 10, 11 45 ns 07, 09, 10 30 Propagation delay output low to output high impedance tPLZ01, 03, 04, 05, 06, 11, 13, 14 9, 10, 11 45 ns 07, 09, 10 30 Propagation delay high impedance to output high (pin 11 to output enable) 1/, 4/ tPZH02, 03, 04, 05, 06, 08, 09, 10, 12, 13
48、, 14 9, 10, 11 25 ns Propagation delay high impedance to output low (pin 11 to output enable) 4/ tPZL02, 03, 04, 05, 06, 08, 09, 10, 12, 13, 14 9, 10, 11 25 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81036 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions TC= -55C to +125C
