1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add types 04, 05; Device type 01. 83-07-20 N. A. Hauck B Remove 2 vendors FSCM 01295, FSCM 50088. Add 1 vendor FSCM 34335 with device types 06, 07, 08. 84-01-23 N. A. Hauck C Add block diagram and timing diagram for device types 06, 07, and 08. R
2、emove test requirements for tOEZand tCEZ. 84-10-11 Michael A. Frye D Change value of tAZ. 85-12-30 N. A. Hauck E Add TOHZfor device types 06, 07, and 08. Editorial changes throughout. 86-04-04 N. A. Hauck F Changes in accordance with NOR 5962-R161-96. 96-06-26 Michael A. Frye G Boilerplate update, p
3、art of 5 year review. REDRAWN ksr 06-03-28 Raymond Monnin H Updated body of drawing to meet current requirements. - glg 12-07-20 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHEET REV H H SHEET 15 16 REV STATUS REV H H H H H H H H H H H H H
4、 H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Philip Thompson DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Darrell Hill COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauc
5、k MICROCIRCUIT, MEMORY, DIGITAL, NMOS 16K (2048 X 8) BIT STATIC RANDOM ACCESS MEMORY (SRAM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 82-03-18 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 81039 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E364-12 Provided by
6、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-
7、883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 81039 01 J A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Dev
8、ice type(s). The device type(s) identify the circuit function as follows: Device type Generic number Supply voltage variation Address access time 01 (See 6.9) 5% 90 ns 02 5% 120 ns 03 5% 200 ns 04 5% 200 ns 05 10% 200 ns 06 10% 90 ns 07 10% 120 ns 08 10% 200 ns 1.2.2 Case outline(s). The case outlin
9、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line package Z CQCC1-N32 32 Rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3
10、Absolute maximum ratings. VCCsupply voltage range -0.5 V dc to +7.0 V dc 1/ Temperature under bias . -55C to +125C Storage temperature range . -65C to +150C Maximum power dissipation (PD) 2/ -1.0 W Lead temperature (soldering 5 seconds) 300C Thermal resistance, junction to case (JC) . 40C/mW Junctio
11、n temperature (TJ) . +150C All input or output voltages with respect to ground 6.0 V dc to -0.5 V dc 3/ Output short circuit current: Device types 01, 02, 03, 04, 05 20 mA Device types 06, 07, 08 10 mA 1/ All voltages referenced to VSS. 2/ Must withstand the added PDdue to short circuit test (e.g.,
12、IOS). 3/ Negative undershoots to a minimum of -1.5 V are allowed with a maximum of 50 ns pulse width. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION
13、LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Case operating temperature range . -55C to +125C Input low voltage (VIL): Device types 01, 02, 03, and 04 . -0.3 V dc to +0.65 V dc 4/ Device type 05, 06, 07, 08 -0.3 V dc to +0.8 V dc Supply voltage range (VCC): Device type
14、s 01, 02, 03, and 04 . +4.75 V dc to +5.25 V dc 4/ Device type 05, 06, 07, 08 +4.5 V dc to +5.5 V dc Supply voltage range (VSS) . 0 V dc 4/ Input high voltage (VIH): Device types 01, 02, 03, and 04 . +2.4 V dc to VCC+0.5 V dc 4/ Device type 05, 06, 07, 08 +2.0 V dc to VCC+0.5 V dc 2. APPLICABLE DOCU
15、MENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEF
16、ENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - Lis
17、t of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of prece
18、dence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item require
19、ments. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who
20、 has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modific
21、ations to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
22、 4/ All voltages referenced to VSS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, an
23、d physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.3
24、Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I a
25、nd shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38
26、535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance
27、indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply
28、 in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conf
29、ormance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Ve
30、rification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNo
31、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C T
32、C 125C unless otherwise specified Group A subgroups Device Types Limits Units Min Max High level output voltage 2/ VOHIOUT= -1 mA 1,2,3 All 2.4 V Low level output voltage 2/ VOLIOUT= 4 mA 1,2,3 02,03, 06,07, 08 0.4 IOUT= 2.1 mA 04, 05 0.4 Output leakage current IOLOE = VIH 1,2,3 All -50 +50 A Input
33、leakage current IIL1,2,3 All -10 +10 Average VCCcurrent ICC1TC= 25C and -55C 1,2,3 01,02,03, 04,05 120 mA 06,07,08 180 ICC2TC= 125C 01,02,03, 04,05 90 06,07,08 180 Input capacitance 3/ 4/ CIExcept D0 thru D7 4 02,03 4 pF 04,05 8 06,07,08 6 CDD0 thru D7; OE = VIHAll 10 Functional tests 5/ 8A,8B All R
34、ead cycle time (See figure 4) 6/ tRCCE = OE = VIL 9,10,11 02,07 120 ns 03,04,05, 08 200 06 90 Address access time (See figure 3) 6/ tAACE = OE = VIL02,07 120 ns 03,04,05, 08 200 06 90 Chip enable access time 6/ tCEACE = VIL02 60 ns 03,04,05 100 06 90 07 120 08 200 See footnotes at end of table. Prov
35、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Sy
36、mbol Conditions 1/ 6/ -55C TC 125C unless otherwise specified Group A subgroups Device Types Limits Units Min Max Chip enable data off time 7/ tCEZCE = VIL9,10,11 02,03 5 35 ns Output enable access time tOEA02 60 03,04,05 100 06 50 07 70 08 80 Output enable data off time 7/ tOEZ02,03 5 35 Address da
37、ta iff tune tAZCE = OE = VIL 9,10,11 01,02,03,04,05 5 ns Output in high-Z from OE tOHZCE = VIL9,10,11 06 35 ns 07 45 08 50 Write cycle time (See figure 5) tWCWE = CE = VIL9,10,11 02,07 120 ns 03,04,05,08 200 06 90 Address setup time tASCE = VIL 9,10,11 02,03 0 ns 04,05,08 20 06,07 10 Address hold ti
38、me tAHCE = VIL9,10,11 02 40 ns 03 65 04,05 0 Data to write setup time tDSWWE = CE = VIL9,10,11 02 10 ns 03 20 04,05 80 06 35 07 45 08 60 Data from write hold time tDHWCE = VIL9,10,11 All 10 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without
39、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 6/ -55C TC 125C unless otherwise specified Group A su
40、bgroups Device Types Limits Units Min Max Write pulse duration tWDCE = VIL9,10,11 02 45 ns 03 60 04,05 100 06 55 07 70 08 100 Write enable data off time tWEZCE = VIL 9,10,11 02,03 5 35 ns 04,05 60 Write pulse lead time 7/ tWPLCE = VIL9,10,11 02 65 ns 03 130 Output hold time from address change tAH9,
41、10,11 06,07,08 5 ns Output in low Z from CE tCLZ9,10,11 06,07,08 5 ns Output in high Z from CE tCHZ9,10,11 06 40 ns 07 50 08 55 Output in low Z from OE tOLZ9,10,11 06,07,08 5 ns Chip selection to power up time tPU9,10,11 06,07,08 0 ns Chip de-selection to power down time tPD9,10,11 06 45 ns 07 55 08
42、 60 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 VQTABLE I. Electrical perform
43、ance characteristics - Continued. Test Symbol Conditions 1/ 6/ -55C TC 125C unless otherwise specified Group A subgroups Device Types Limits Units Min Max Write recovery time tWR9,10,11 06,07,08 5 ns Output in low Z from WE tWLZ9,10,11 06,07,08 5 ns Output in high Z from WE tWHZ9,10,11 06 35 ns 07,0
44、8 50 Address valid to end of write tAW9,10,11 06 80 ns 07 105 08 120 1/ All voltages referenced to VSS. 2/ Negative undershoots to a minimum of -1.5 V are allowed with a maximum of 50 ns pulse width. 3/ Effective capacitance calculated from the equation C = with V = 3 volts and VCC= 5.0 V 4/ For sub
45、group 4 see 4.3.1c. 5/ For subgroup 8 see 4.3.1d. 6/ AC measurements assume transition time = 5 ns and input levels are from VSSto 3.0 V. 7/ These three tests not performed for device types 04, 05, 06, 07 and 08. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
46、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 Device Types All Case Outline J Z Terminal Number Terminal Symbol Terminal Symbol 1 A7NC 2 A6NC 3 A5NC 4 A4A75 A3A66 A2A57 A1A48 A0A39 DQ0A210 DQ1A111
47、DQ2A012 VSSNC 13 DQ3DQ014 DQ4DQ115 DQ5DQ216 DQ6VSS17 DQ7NC 18 CE DQ319 A10DQ420 OE DQ521 WE DQ622 A9DQ723 A8CE 24 VCCA1025 - OE 26 - WE 27 - NC 28 - A929 - A830 - NC 31 - NC 32 - VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
48、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81039 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 10 DSCC FORM 2234 APR 97 CE OE WE MODE DQ VIHX X DESELECT HIGH Z VILX VILWRITE DINVILVILVIHREAD DOUTVILVIHVIHREAD HIGH Z X = Dont care FIGURE 2. Truth table. FIGURE 3. Block Diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
