1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Change to vendor similar part number for vendor CAGE 18324. Changes to table I parameters tEAand COUT. Add vendor CAGE 18324 to device types 03 and 04 as a source of supply. Add new device design for device 04 for vendor CAGE 07933. Removed table
2、 III, figure 5, and programming procedures. Editorial changes throughout. 91-10-30 M. A. Frye G Changes in accordance with NOR 5962-R010-93 93-02-12 M. A. Frye H Changes in accordance with NOR 5962-R205-93 93-08-10 M. A. Frye J Updated boilerplate. Sheet 4, change VOHconditions from IOH= -2.0 mA to
3、-1.6 mA; change CINmax. limit from 10 pF to 15 pF; change COUTmax. limit for devices 01, 02, and 04 from 13 pF to 20 pF; add footnote 3 to tDAtest column. Removed logic diagrams. Remove vendors CAGE 50364 and 34335 as suppliers, and removed their associated switching time test circuits. 97-05-29 Ray
4、mond Monnin K Boilerplate update, part of 5 year review. ksr 05-06-30 Raymond Monnin L Boilerplate update, part of 5 year review. ksr 10-11-10 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV L L L L L L L L L L L L
5、 L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Darrell Hill DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT,
6、MEMORY, DIGITAL, SCHOTTKY BIPOLAR 32K PROGRAMMABLE READ ONLY MEMORY (PROM), MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 82-09-01 AMSC N/A REVISION LEVEL L SIZE A CAGE CODE 14933 82008 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E069-11 Provided by IHSNot for Resal
7、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, no
8、n-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 82008 01 J A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The dev
9、ice type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 4096 words x 8 bits per word PROM, T.S. 95 ns 02 4096 words x 8 bits per word PROM, T.S. 55 ns 03 4096 words x 8 bits per word PROM, T.S. 45 ns 04 4096 words x 8 bits per word PROM, T.
10、S. 70 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line package K GDFP2-F24 or CDFP3-F24 24 flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line packa
11、ge X CQCC1-N32 32 rectangular leadless chip carrier 3 CQCC1-N28 28 square leadless chip carrier Y CDFP4-F24 24 flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) -0.3 to +7.0 V dc Input voltage range +5.5 V
12、 dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 2/ Output voltage applied . -0.3 V dc to VCCOutput sink current . 100 mA Maximum power dissipation (PD) 3/ 1.04 W dc Maximum junction temperature (T
13、J) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc to 5.5 V dc Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Normalized fanout (each output) . 12 mA Case operating temperature range (TC) -55C to +125C 1/ Generic num
14、bers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Heat sinking is recommended to reduce the junction temperature. 3/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNo
15、t for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. T
16、he following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufac
17、turing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Mi
18、crocircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this
19、 drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accord
20、ance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38
21、535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications sha
22、ll not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The de
23、sign, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s)
24、. The truth table(s) shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A or C (see 4.3), the devices shall be programmed by the manufactu
25、rer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed). 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
26、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= 4.5 V to 5.5 V unless otherwise specified Device type G
27、roup A subgroups Limits Unit Min Max High level output voltage VOHVCC= minimum, IOH= -1.6 mA All 1, 2, 3 2.4 V Low level output voltage VOLVCC= minimum, IOL= 16mA All 1, 2, 3 0.5 V Input clamp voltage VICIIN= -18 mA All 1, 2, 3 -1.5 V High impedance (Off-state) output high current IOHZVCC= VCCmaximu
28、m VO= 2.4 V 01 1, 2, 3 100 A 02,03,04 40 High impedance (Off-state) output low current IOLZVCC= VCCmaximum VO= 0.4 V 01 1, 2, 3 -100 A 02,03,04 -40 High level input current IIHVIH= VCC maximum All 1, 2, 3 40 A Low level input current IILVIL= 0.4 V VCC= VCC maximum All 1, 2, 3 -250 A Short circuit ou
29、tput current IOSVOUT= 0.2 V 1/ All 1, 2, 3 -15 -100 mA Supply current ICCVCC= VCC maximum, all inputs grounded All 1, 2, 3 190 mA Input capacitance CINVCC= 5 V, f = 1 MHz, VIN= 2.0 V, see 4.3.1c All 4 15 pF Output capacitance COUTVCC= 5 V, f = 1 MHz, VOUT= 2.0 V, see 4.3.1c 01, 02, 04 4 20 pF 03 12
30、Address access time tAAVCC= 4.5 V and 5.5 V, see figure 4 01 9, 10, 11 95 ns 02 55 03 45 04 70 Chip enable access time tEA01, 04 45 ns 02, 03 35 Chip disable access time 2/ 3/ tDA01 45 ns 02, 03, 04 35 1/ Not more than one output shall be grounded at one time, for a maximum of 1 second. 2/ CL 5 pF.
31、3/ May not be tested but is guaranteed to the limits specified in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 5 DSCC FORM 2
32、234 APR 97 Device Types All Case Outlines J, K, Y, L X 3 Terminal Number Terminal Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 A7A6A5A4A3A2A1A0O1O2O3GND O4O5O6O7O8CE2A11CE1A10 A9A8VCC- - - - - - - - - - - - - - - - - - - - - - - - NC NC A7A6A5A4A3A2A1
33、A0NC O1O2O3NC GND O4NC O5O6O7O8NC CE2A11CE1NC A10 A9A8NC VCCNC A7A6A5A4A3A2A1A0NC O1O2O3GND NC O4O5O6O7O8 NC CE2A11CE1A10 A9A8VCC- - - - - - - - - - - - FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR
34、CUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 6 DSCC FORM 2234 APR 97 Word number CE1CE2Address Data NA A11A10A9A8A7A6A5A4A3A2A1A0O8O7O6O5O4O3O2O1L H H L X X X X X X X X X X X X X X X X X X X X X X X X See note 5 OC OC OC OC OC OC OC OC Notes: 1. NA
35、 = Not applicable. 2. X = Input may be high level, low level, or open circuit. 3. OC = Open circuit (high resistance output). 4. Program readout can only be accomplished with enable input at low level. 5. The outputs for an unprogrammed device shall be high for circuits C and F. FIGURE 2. Truth tabl
36、e (unprogrammed). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 7 DSCC FORM 2234 APR 97 Circuit F Notes: 1. Test table for devices pro
37、grammed in accordance with an altered item drawing may be replaced by the equivalent tests which apply to the specific program configuration of the resulting read-only memory. 2. CL= 30 pF minimum, including jig and probe capacitance: R1= 300 and R2= 600. 3. Outputs may be under load simultaneously.
38、 4. VOLACand VOHACare the measured output voltage levels while enabled. FIGURE 3. Switching time test circuits and waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, O
39、HIO 43218-3990 REVISION LEVEL L SHEET 8 DSCC FORM 2234 APR 97 Circuit F Continued FIGURE 3. Switching time test circuits and waveforms Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND
40、MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 9 DSCC FORM 2234 APR 97 Circuit C Note: R1= 270 and R2= 600 CL= 50 pF FIGURE 3. Switching time test circuits and waveforms Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M
41、ICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 10 DSCC FORM 2234 APR 97 Circuit C Continued FIGURE 3. Switching time test circuits and waveforms Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
42、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 82008 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 11 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I
43、and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-3
44、8535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance
45、 indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of suppl
46、y in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of con
47、formance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 V
48、erification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10. Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of configurat
