1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I: remove subgroup 8 requirement. Transition time limits shall be guaranteed if not tested. 84-08-27 M. A. Frye B Add vendor FSCM 18714. Table I: propagation delay times at VCC= 2.0 V and VCC= 6.0 V and subgroups 10 and 11 shall be guarante
2、ed if not tested. Add vendor FSCM 04173. 85-10-28 M. A, Frye C Inactivate cases C and 2 for new design. No approved sources for case outlines A and B. Change to military drawing format. Editorial changes throughout. 89-03-24 M. A. Frye D Add vendor CAGE F8859. Add class V device criteria. Editorial
3、changes throughout. ljs 99-11-19 Raymond Monnin E Correct data limits in paragraph 1.3 and test conditions in Table I. Add case outline X. Add Table III, delta limits. Editorial changes throughout. ljs 00-07-12 Raymond Monnin F Correct table II. Update boilerplate to MIL-PRF-38535 requirements. jak
4、02-02-08 Thomas M. Hess G Add JEDEC Standard in paragraphs 2.2 and 4.4.1c. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-09-17 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 1
5、2 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck MICROCIRCU
6、IT, DIGITAL, HIGH-SPEED CMOS, QUAD 2-INPUT EXCLUSIVE-OR GATE, MONOLITHIC SILICON DRAWING APPROVAL DATE 84-06-01 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 84046 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E498-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license
7、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and s
8、pace application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example
9、s. For device classes M and Q: 84046 01 C A Drawing number Device type (see 1.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 84046 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4)
10、Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA leve
11、ls and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC86 Quad 2-input EXCLUSIVE-OR gate 1.2.3 Device class designator. The dev
12、ice class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Devi
13、ce class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction
14、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline
15、 letter Descriptive designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat pack B GDFP4-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier X CDFP3-F14 14 Flat pack 1.2.5 Lead finish. The lead finish
16、 is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to
17、VCC+0.5 V dc Input clamp diode current (IIK) 20 mA Output clamp diode current (IOK) . 20 mA Continuous output current . 25 mA Continuous current through VCCor GND 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds
18、) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 5/ 1.4 Recommended operating conditions. 2/ 3 / Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V 0 to
19、 1,000 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to GND.
20、3/ The limits for the parameters speified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be exceeded except for allowable short circuit duration burn-in
21、screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM
22、 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation
23、 or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENS
24、E HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,
25、PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 7-A - Stand
26、ard for Description of 54/74HCXXXXX and 54/74HCTXXXXX High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between
27、the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements fo
28、r device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for de
29、vice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q an
30、d V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure
31、2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND
32、ARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics
33、 and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in tab
34、le I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the de
35、vice. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification ma
36、rk for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-3853
37、5 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of complian
38、ce submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 C
39、ertificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device cla
40、ss M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to
41、review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 3
42、6 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical
43、performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max High-level output voltage VOH VIN= VIHminimum or VILmaximum IOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHminimum or VILmaximum IOH=
44、-4.0 mA VCC= 4.5 V 1 3.98 2, 3 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 1 5.48 2, 3 5.2 Low-level output voltage VOLVIN= VIHminimum or VILmaximum IOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHminimum or VILmaximum IOL= +4.0 mA VCC= 4.5 V 1 0.26 2, 3 0.4 VIN= VIHminimum o
45、r VILmaximum IOL= +5.2 mA VCC= 6.0 V 1 0.26 2, 3 0.4 High level input voltage VIH2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low-level input voltage VIL2/ VCC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINTC= +25C, VCC= 2.0 V to 6.0 V See 4.4.1c 4 10.0 pF Pow
46、er dissipation capacitance (per gate) CPDSee 4.4.1c 4 35 pF Quiescent supply current ICCVIN= VCC or GND VCC= 6.0 V IOUT= 0 A 1 2.0 A 2, 3 40.0 Input leakage current IINVCC= 6.0 V VIN= VCCor GND 1 0.1 A 2, 3 1.0 Functional tests See 4.4.1b 7, 8 See footnotes at end of table. Provided by IHSNot for Re
47、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test cond
48、itions 1/ -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max Propagation delay time, mA or mB to mY tPHL, tPLH3/ CL= 50 pF See figure 4 VCC= 2.0 V 9 120 ns 10, 11 180 VCC= 4.5 V 9 24 10, 11 36 VCC= 6.0 V 9 20 10, 11 31 Transition time, High to Low, Low to High tTHL, tTLH4/ CL= 50 pF See figure 4 VCC= 2.0 V 9 75 ns 10,11 110 VCC= 4.5 V 9 15 10, 11 22 VCC= 6.0 V 9 13 10, 11 19 1/ For a power supply of 5.0 V 10, the worst case output voltages (VOHand VOL) occur for HC at 4.5 V. Thus, the 4.5 V values should be used when designing wi
