1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to Standard Microcircuit Drawing (SMD) format and update drawing to current requirements. Change CAGE to 67268. Editorial changes throughout. - gap 09-11-16 Charles F. Saffle CURRENT CAGE IS 67268 The original first sheet of this drawing
2、has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY David W. Queenan DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS
3、 AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, ADVANCED LOW POWER SCHOTTKY TTL, INVERTER GATE, BUFFER OUTPUT, MONOLITHIC SILICON DRAWING APPROVAL DATE 84-08-27 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 14933 84061 SHEET 1 OF 8 DSCC
4、 FORM 2233 APR 97 5962-E365-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This
5、 drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 84061 01 B X Drawing number Device type (see 1.2.1) Case ou
6、tline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS1004 Hex 1-input inverter gate, buffer output 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
7、 as follows: Outline letter Descriptive designator Terminals Package style B GDFP4-14 14 Flat package C GDIP1-T14 or CDIP2-T14 14 Dual-in-line package D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38
8、535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range . -65 to +150C Maximum power dissipation (PD), per device 1/ . 66 mW dc Lead temperature (soldering, 10 seconds) +300C Thermal r
9、esistance, junction to case (JC) See MIL-STD-1835 Junction temperature (TJ) 175C 1.4 Recommended operating conditions. Supply voltage (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Maximum low level input voltage (VIL) . 0.8 V dc Minimum high level input voltage (VIH) 2.0 V dc Case operating temperatu
10、re range (TC) -55 to +125C _ 1/ Must withstand the added PDdue to short-circuit test (e.g., IO). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS
11、ION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are th
12、ose cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case
13、Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenu
14、e, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specif
15、ic exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
16、(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as
17、 documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF
18、-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.
19、2 herein. 3.2.2 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical pe
20、rformance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Prov
21、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38
22、535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance
23、indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply
24、 in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certif
25、icate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs
26、 agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall
27、 be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883
28、. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as ap
29、plicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufact
30、urer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics.
31、Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, VIH= 2.0 V, 1, 2, 3 2.4 V dc IOH= -1.0 mA, VIL= 0.8 V Low level output voltage VOLVCC= 4.5 V, VIL= 0.8 V, 1, 2, 3 0.4 V dc IIN= 12 mA, VIH= 2.0 V Input clamp
32、 voltage VI CVCC= 4.5 V, IIN= -18 mA, 1 -1.5 V dc TC= +25C Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1, 2, 3 0 -100 A High level input current IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 20 A IIH2VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 100 A Output current 1/ IOVCC= 5.5 V, VO= 2.25 V 1, 2, 3 -30 -112 mA Suppl
33、y current, outputs high ICCHVCC= 5.5 V 1, 2, 3 3 mA Supply current, outputs low ICCLVCC= 5.5 V 1, 2, 3 12.0 mA Propagation delay time, low-to-high level tPLHVCC= 5.0 V, CL= 50 pF 10%, RL= 500 9 1 7 ns 10, 111 9 Propagation delay time, high-to-low level tPHL9 1 6 ns 10, 111 8 1/ The output conditions
34、 have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
35、S, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 CASES B, C, and D FIGURE 1. Logic diagram and terminal connections (top view). 4321 5 6 711121314 10 9 82A1 A 1Y 2Y 3A 3Y GND5A6A 6Y 4A 4Y5YV CC14 15 16 17 188 7 6 5 491011121332120191YNC1AV6A3YGND 4Y4ANCCC 6YNC5ANC5Y2ANC2YNC3ACASE 2P
36、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Truth table (each gate) Input Output A Y L H H L Y = A F
37、IGURE 2. Truth table. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in tabl
38、e II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test cond
39、itions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, bi
40、ases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without l
41、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 84061 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I
42、) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if n
43、ot tested, shall be guaranteed to the specified limits in table I. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government mi
44、crocircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes
45、 to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system app
46、lication requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-054
47、4. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of
48、compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 09-11-16 Approved sources of supply for SMD 84061 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have
