1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor CAGE 18324 to case outline E, F, and 2. Add vendor CAGE 27014 to case outline F. Editorial changes throughout. Change to current CAGE code. jak. 88-11-29 M. A. Frye C Add vendor CAGE F8859. Add class V device criteria. Editorial change
2、s throughout. ljs 99-11-04 Raymond Monnin D Correct data limits in paragraph 1.3. Add case outline X. Add Table III, delta limits. Editorial changes throughout. ljs 00-07-13 Raymond Monnin E Correct table II. Update boilerplate to MIL-PRF- 38535 requirements. jak 02-01-18 Thomas M. Hess F Add JEDEC
3、Standard in paragraphs 2.2 and 4.4.1c. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-09-14 Thomas M. Hess CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jam
4、es E. Nicklaus DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Ray Monnin APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH-SP
5、EED CMOS, 3-STATE DATA SELECTOR/MULTIPLEXER, MONOLITHIC SILICON DRAWING APPROVAL DATE 85-10-28 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 85124 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E463-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STA
6、NDARD MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application
7、device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device cla
8、sses M and Q: 85124 01 E A Drawing number Device type (see 1.2.2) Case outline(see 1.2.4) Lead finish(see 1.2.5)For device class V: 5962 - 85124 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1
9、2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked
10、 with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC257 Three-state data selector/multiplexer 1.2.3 Device class designator. The device class
11、 designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class
12、Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networ
13、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter D
14、escriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier X CDFP4-F16 16 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-
15、38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc Input clamp diode current (IIK) 20 mA Output clamp diode cu
16、rrent (IOK) . 20 mA Continuous output current . 35 mA Continuous current through VCCor GND 70 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Jun
17、ction temperature (TJ) +175C 5/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V 0 to 1,000 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns 1/ Stresses above
18、 the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to GND. 3 The limits for the parameters specified herein shall apply over the ful
19、l specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. 5/ Maximum junction temperature shall not be exceeded except for allowable short circuit duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provi
20、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standa
21、rds, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integra
22、ted Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HD
23、BK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s
24、) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 7-A - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX High-Speed CMOS Dev
25、ices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of thi
26、s drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as
27、 specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for no
28、n-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Cas
29、e outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure
30、 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified in figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLU
31、MBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and sha
32、ll apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 he
33、rein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still b
34、e marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-
35、PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this draw
36、ing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply
37、for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for d
38、evice classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) invol
39、ving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation.
40、Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reprod
41、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C
42、 unless otherwise specified Group A subgroups Limits Unit Min Max High-level output voltage VOH VIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -6 mA VCC= 4.5 V 1 3.98 2, 3 3.7 VIN= VIHor VILIOH= -7.8 mA VCC= 6.0 V 1 5.48 2, 3 5.2 Low-level output v
43、oltage VOLVIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1 VIN= VIHor VILIOL= +6 mA VCC= 4.5 V 1 0.26 2, 3 0.4 VIN= VIHor VILIOL= +7.8 mA VCC= 6.0 V 1 0.262, 3 0.4 High level input voltage VIH2/ VCC= 2.0 V 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low-level input vo
44、ltage VIL2/ CC= 2.0 V 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINTC= +25C, VCC= 2.0 V to 6.0 V See 4.4.1c 4 10.0 pF Power dissipation capacitance CPDSee 4.4.1c 4 40 pF Quiescent supply current ICCVIN= VCC or GND, IOUT= 0 A VCC= 6.0 V 1 8 A 2, 3 160 Input leakage current IINVCC=
45、 6.0 V, VIN= VCCor GND 1 0.1 A 2, 3 1.0 Off-state output current IOZVOUT= VCCor GND, VIN= VIHor VILVCC= 6.0 V 1 0.5 A 2, 3 10 Functional tests See 4.4.1b 7, 8 L H See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
46、 MICROCIRCUIT DRAWING SIZE A 85124 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Limits Unit
47、Min Max Propagation delay mA or mB to mY tPHL, tPLH3/ TC= +25C CL= 50 pF VCC= 2.0 V 9 150 ns VCC= 4.5 V 30 VCC= 6.0 V 26 TC= -55C, +125C CL= 50 pF VCC= 2.0 V 10, 11 225 ns VCC= 4.5 V 45 VCC= 6.0 V 38 Propagation delay time, A/B to mY tPHL, tPLH3/ TC= +25C CL= 50 pF VCC= 2.0 V 9 175 ns VCC= 4.5 V 35
48、VCC= 6.0 V 30 TC= -55C, +125C CL= 50 pF VCC= 2.0 V 10, 11 265 ns VCC= 4.5 V 53 VCC= 6.0 V 45 Propagation delay output enable from G to mY tPZH, tPZL3/ TC= +25C CL= 50 pF VCC= 2.0 V 9 150 ns VCC= 4.5 V 30 VCC= 6.0 V 26 TC= -55C, +125C CL= 50 pF VCC= 2.0 V 10, 11 225 ns VCC= 4.5 V 45 VCC= 6.0 V 38 Propagation delay time, output enable from G to mY (disable) tPHZ, tPLZ3/ TC= +25C CL= 50 pF VCC= 2.0 V 9 150 ns VCC= 4.5 V 30 VCC= 6.0 V 26 TC= -55C, +125C CL= 50 pF VCC= 2.0 V 10, 11 225 ns VCC= 4.5 V 45 VCC= 6.0 V 38 See footnotes at end of table. P
