1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes IAW NOR 5962-R030-93 - wlm. 93-01-22 Monica L. Poelking B Changes IAW NOR 5962-R034-96 - jak. 96-02-29 Monica L. Poelking C Change drawing CAGE code to 67268. Update boilerplate to MIL-PRF-38535 requirements. - jak 01-11-15 Thomas M. Hess
2、 D Add vendor code 0C7V7 and 0DKS7. Update boilerplate to MIL-PRF-38535 requirements. -phn 08-05-27 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Greg A. Pitz STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo
3、 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, CMOS, HEX SCHMITT TRIGGER, MONOLITHIC SILICON THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-09
4、-04 AMSC N/A SIZE A CAGE CODE 67268 5962-85501 REVISION LEVEL D SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E412-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
5、OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as show
6、n in the following example: 5962-85501 01 R A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 40106B Hex Schmitt trigger 02 14584 Hex Sch
7、mitt trigger 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute m
8、aximum ratings. 1/ Supply voltage range (VDD) -0.5 V dc to +18 V dc Input voltage range -0.5 V dc to VDD+0.5 V dc Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) 500 mW 2/ Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See
9、MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 1/ Supply voltage range (VDD) +3.0 V dc to +15 V dc Case operating temperature range (TC). -55C to +125C 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ For TC= +100C to +125C, derate linearly
10、 at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1
11、 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPEC
12、IFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Stan
13、dard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5
14、094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUI
15、REMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufactur
16、er or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (Q
17、M) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the
18、QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. Th
19、e terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as s
20、pecified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permi
21、tted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. T
22、he electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). Fo
23、r packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-
24、PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be
25、listed as an approved source of supply in MIL-HDBK-103 and QML-38535 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requireme
26、nts herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-385
27、35, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for Resale
28、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 Table I. Electrical performance characteristics. Test Symbol Test conditions -5
29、5C TC +125C Device type Group A subgroups Limits Unit unless otherwise specified Min Max VDD= 5.0 V dc 4.95 V VDD= 10.0 V dc 9.95 High-level output voltage VOHVIN= 0.0 V or VDDIO 1.0 A VDD= 15.0 V dc All 14.95 VDD= 5.0 V dc 0.05 V VDD= 10.0 V dc 0.05 Low-level output voltage VOLVIN= 0.0 V or VDDIO 1
30、.0 A VDD= 15.0 V dc All 1, 2, 3 0.05 01 4.3 V VDD= 5.0 V dc VO= 0.5 V dc or 4.5 V dc 02 3.5 01 8.6 VDD= 10.0 V dc VO= 1.0 V dc or 9.0 V dc 02 7.0 01 12.9 High-level input voltage VIHVDD= 15.0 V dc VO= 1.5 V or 13.5 V dc IO 1.0 A 02 1, 2, 3 11.0 01 0.7 V VDD= 5.0 V dc VO= 0.5 V dc or 4.5 V dc 02 1.5
31、01 1.4 VDD= 10.0 V dc VO= 1.0 V dc or 9.0 V dc 02 3.0 01 2.1 Low-level input voltage VILVDD= 15.0 V dc VO= 1.5 V dc or 13.5 V dc IO 1.0 A 02 1, 2, 3 4.0 3 -0.64 1 -0.51 VDD= 5.0 V dc VO= 4.6 V dc VIN= 0.0 V or VDD2 -0.36 3 -1.6 1 -1.3 VDD= 10.0 V dc VO= 9.5 V dc VIN= 0.0 V or VDD2 -0.9 3 -4.2 1 -3.4
32、 High-level output current IOHVDD= 15.0 V dc VO= 13.5 V dc VIN= 0.0 V or VDDAll 2 -2.4 mA 3 0.64 1 0.51 VDD= 5.0 V dc VO= 0.4 V dc VIN= 0.0 V dc or VDD2 0.36 3 1.6 1 1.3 VDD= 10.0 V dc VO= 0.5 V dc VIN= 0.0 V dc or VDD2 0.9 3 4.2 1 3.4 Low-level output current IOLVDD= 15.0 V dc VO= 1.5 V dc VIN= 0.0
33、 V dc or VDDAll 2 2.4 mA Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Table I. Electrical perfo
34、rmance characteristics Continued. Test Symbol Test conditions -55C TC +125C Device type Group A subgroups Limits Unit unless otherwise specified Min Max 1, 3 0.1 Input current IINVIN= 0.0 V dc or 15 V dc All 2 1.0 A 1, 3 1.0 01 2 30.0 1, 3 0.25 VDD= 5.0 V dc VIN= 0.0 V dc or VDD02 2 7.5 1, 3 2.0 01
35、2 60.0 1, 3 0.5 VDD= 10.0 V dc VIN= 0.0 V dc or VDD02 2 15.0 1, 3 4.0 01 2 120.0 1, 3 1.0 Quiescent supply current IDDVDD= 15.0 V dc VIN= 0.0 V dc or VDD02 2 30.0 A Input capacitance CINVIN= 0.0 V dc, TA= +25C All 4 7.5 pF Functional tests See 4.3.1d All 7 01 3.0 4.3 VDD= 5.0 V dc 02 1.7 3.5 01 6.0
36、8.6 V VDD= 10.0 V dc 02 3.2 7.0 01 9.0 12.9 Positive going threshold voltage VT+VDD= 15.0 V dc 02 1, 2, 3 5.2 10.6 01 0.7 2.0 VDD= 5.0 V dc 02 1.5 3.3 01 1.4 4.0 V VDD= 10.0 V dc 02 3.0 6.7 01 2.1 6.0 Negative going threshold voltage VT-VDD= 15.0 V dc 02 1, 2, 3 4.5 9.9 Provided by IHSNot for Resale
37、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Table I. Electrical performance characteristics Continued. Test Symbol Test con
38、ditions -55C TC +125C Device type Group A subgroups Limits Unit unless otherwise specified Min Max VDD= 5.0 V dc 01 1, 2, 3 1.0 3.6 VDD= 10.0 V dc 01 1, 2, 3 2.0 7.2 VDD= 15.0 V dc 01 1, 2, 3 3.0 10.8 V 1 0.25 1.0 2 0.21 1.0 VDD= 5.0 V dc 02 3 0.27 1.0 1 0.30 1.2 2 0.25 1.2 VDD= 10.0 V dc 02 3 0.36
39、1.3 1 0.60 1.5 2 0.50 1.4 Hysteresis voltage VHVDD= 15.0 V dc 02 3 0.77 1.7 V 9 300.0 01 10, 11 390.0 ns 9 250.0 Propagation delay time, high-to-low level tPHLVDD= 5.0 V dc CL= 50 pF RL= 200 k 02 10, 11 375.0 9 300.0 01 10, 11 390.0 ns 9 250.0 Propagation delay time, low-to-high level tPLHVDD= 5.0 V
40、 dc CL= 50 pF RL= 200 k 02 10, 11 375.0 9 200.0 Transition time tTLH, tTLH VDD= 5.0 V dc CL= 50 pF RL= 200 k All 10, 11 300.0 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COL
41、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Case outlines C Terminal number Terminal symbol Terminal number Terminal symbol 1 1A 8 4Y 2 1Y 9 4A 3 2A 10 5Y 4 2Y 11 5A 5 3A 12 6Y 6 3Y 13 6A 7 VSS14 VDDFIGURE 1. Terminal connections. (Each Inverter) Inputs Outputs mA
42、mY L H H L H = High voltage level L = Low voltage level FIGURE 2. Truth table. FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321
43、8-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 NOTES 1. CL= 50 pF (includes probe and jig capacitance). 2. Data rise and fall time (tr, tf) = 20 ns. FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
44、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85501 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Scree
45、ning. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall
46、be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test m
47、ethod 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conf
48、ormance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINmeasurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. d. Subgroup 7 shall include verification of the truth table. 4.3.2 Gro
