1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Reword paragraph 4.3.1d. Update vendors part numbers. Editorial changes throughout. 87-06-22 N. A. Hauck B Changes in accordance with NOR 5962-R081-96. glg 96-03-22 Michael A. Frye C Update drawing to current requirements. Editorial changes throu
2、ghout. ksr. 10-02-08 Charles F. Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED CURRENT CAGE CODE IS 67268 REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROC
3、IRCUIT DRAWING CHECKED BY D.A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR, 2K x 8-bit, PROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL
4、 DATE 86-09-18 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 5962-85526 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E106-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85526 DEFENSE SUPPLY CENTER COLUMBU
5、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PI
6、N is as shown in the following example: 5962-85526 01 J_ A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 1/ Circuit function Propagation Delay 01 27PS1
7、91 2048 X 8-bit bipolar PROM (three state) 75 ns 02 27PS191A 2048 X 8-bit bipolar PROM (three state) 65 ns 03 27PS191 2048 X 8-bit bipolar PROM (three state) 75 ns 04 27PS191A 2048 X 8-bit bipolar PROM (three state) 65 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 a
8、nd as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24, CDIP2-T24 24 dual-in-line package K GDFP2-F24, CDFP3-F24 24 flat package L GDIP3-T24, CDIP4-T24 24 dual-in-line package X CQCC1-N32 32 rectangular chip carrier 3 CQCC1-N28 28 square chip carrier 1.2.3 Lead fini
9、sh. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range - -0.5 V dc to +7.0 V dc Input voltage range - -0.5 V dc to +5.5 V dc Storage temperature range - -65C to +150C Maximum power dissipation (PD) 1/ - 1.02 W Lead temperature (soldering,
10、 10 seconds) - +300C Thermal resistance, junction-to-case (JC): 2/ Case outlines J, K, X, 3, and L - See MIl-STD-1835 DC voltage applied to outputs (except during programming) - -0.5 V to VCCmaximum DC voltage applied to outputs during programming - 21 V Output current into outputs during programmin
11、g (maximum duration 1 s) - 250 mA DC input current - -30 mA to +5 mA 1.4 Recommended operating conditions. Supply voltage (VCC) - +4.5 V dc minimum to +5.5 V dc maximum Minimum high-level Input high voltage (VIH) - 2.0 V dc Maximum low-level Input low voltage (VIL) - 0.8 V dc Case operating temperat
12、ure range (TC) - -55C to +125C 1 Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ Heat sinking is recommended to reduce the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A
13、 5962-85526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specifie
14、d herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard M
15、icrocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quic
16、ksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this do
17、cument, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product
18、built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qual
19、ifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as des
20、cribed herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and here
21、in. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specifi
22、ed on figure 2. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical perfor
23、mance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in tabl
24、e II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 D
25、SCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C 4.5 V VCC 5.5 V unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA, 1, 2, 3 All 2.4 V IN= VIHor VILOutput low voltage VO
26、LVCC= 4.5 V, IOL= 16.0 mA, 1, 2, 3 All 0.50 V IN= VIHor VILInput high voltage 2/ VIHGuaranteed input logical high voltage for all inputs 1/ 1, 2, 3 All 2.0 V Input low voltage 2/ VILGuaranteed input logical low voltage for all inputs 1/ 1, 2, 3 All 0.8 V Input low current IILVCC= 5.5 V, VIN= 0.45 V
27、1, 2, 3 All -250 A Input high current IIHVCC= 5.5 V, VIN= VCC1, 2, 3 All 40 A Output short circuit IOSVCC= 5.5 V, 1, 2, 3 All -15 -90 mA current VOUT= 0.0 V 2/ Power supply current ICCAll inputs = GND 1, 2, 3 All 185 mA Power down supply current ICCDCS 1= 2.7 V All other inputs = GND 1, 2, 3 All 80
28、mA Input clamp voltage VIVCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.2 V Output leakage current ICEXVCC= 5.5 V VO= VCC1, 2, 3 All 40 A VCS 1= 2.4 V VO= 0.4 V -40 Input capacitance 3/ CINVIN= 2.0 V, VCC= 5.0 V TA= +25C, f = 1 MHz 4 All 8 pF Output capacitance 3/ COUT(see 4.3.1c) 4 All 14 pF Address access
29、 time tAASee figures 4 and 5 4/ 9, 10, 11 01, 03 75 ns 02, 04 65Enable access time tEASee figures 4 and 5 5/ 9, 10, 11 01, 03 90 ns 02, 04 75Enable recovery time tERSee figures 4 and 5 5/ 9, 10, 11 01, 03 45 ns 02, 04 30Power switched address access timetAAPSSee figures 4 and 5 9, 10, 11 01, 03 90 n
30、s 02, 04 75 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I
31、. Electrical performance characteristics - Continued. 1/ These are absolute voltages with respect to device ground pin and include all overshoots due to system and/or tester noise. Do not attempt to test these values without suitable equipment 2/ For test purposes, not more than one output at a time
32、 should be shorted. Short circuit test duration should not exceed one second. 3/ These parameters are not 100 percent tested, but are tested initially and after any design or process change affecting CINand COUT. 4/ tAAis tested with switch S1closed and CL= 30 pF. 5/ tEAis tested with CL= 30 pF to t
33、he 1.5 V level; S1open for high impedance to high tests and closed for high impedance to low tests. tERis tested with CL= 5 pF. High to high impedance tests are made with S1open to an output voltage of VOH= -0.5 V; low-to-high impedance tests are made to the VOL= +0.5 V level with S1closed. 3.5 Mark
34、ing. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer ha
35、s the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in acc
36、ordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to
37、 DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provid
38、ed with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus (DSCC), DSCCs agent, and the acquiring activity retain th
39、e option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, append
40、ix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circui
41、t shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015
42、 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking
43、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-85526 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 o
44、f MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (CINand COUTmeasurement)
45、shall be measured only for the initial test and after process or design changes which may affect capacitance. d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of Group A, subgroups 9, 10, and 11. Either of two techniques is acceptable. (1)
46、 Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and AC performance without programming the user array. If this is done, the resulting test pattern shall be verified on all devices during subgroups 9, 10, and 11 of group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. T
