1、SMD-5762-Bb028 REV C m 9999996 0033922 O26 m NOTICE OF REVISION (NOR) (See MIL-STD-480 for instructions) This revision described below has been authorized for the document listed. Form Approved OMB NO. 0704-0188 DATE (-1 92/11/30 Public reporting burden for this collection is estimated to average 1
2、hour per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comnents regarding this burden estimate or any other aspect of this collection of information
3、, including suggestions for reducing this burden, to Washington Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington. VA 22202-4302, and to the Office of Information and Regulatory Affairs, Office of Management and Budget, Was
4、hing 1. ORIGINRTOR “E AIID AWRESS Monica L. Poelking CHIEF MICROELECTRONICS BRANCH DESC-ECC Defense Electronics Supply Center Dayton, Ohio 45444-5277 92/11/30 6. TITLE OF WiJHEKI HICROCIRCUITS, 4-BIT BIPOUVI HICROPROGRM SEQUENCER, IK)IIOLITHIC SILICON. i,-OC 20503. 3. mmi. 4. CAGECOM 67268 7. REVISI
5、ON LETTER 8. ECP mi. 86028ECP - 1 9. COWFIGURATIOII ITEM (OR SY!iXtl) TO WICH ECP APPLIES ALL 10. DESCRIPTIW OF REVISIOW Sheet 1: Revisions ltr column: add “C“ Revisions description column; add “Changes in accordance with Revisions date column; add “92-11-30“. Revision level block: add “C“. Revision
6、 status of sheet; for sheet 1,4 add “C“. Table I, (IIL) Input low current change the maximum limit for Push/pop, E, Di NOR 5962-R028-93“ a Sheet 4: from: - 0.72 mA Table I, (IIL) Input low current change the maximum limit for others from: -0.36 mA to: -0.76 mA to: -0.41 m9. Revision level block; add
7、 “C“. 11. THIS SECTION FOR GOVERNHEKT USE ONLY _ a. CHECK ONE XIEXISTING DOCUMENT SUPPLEMENTED CUSTODIAN OF MASTER DOCUMENT BY THIS NOR MAY BE USED IN MANUFACTURE. MAY INCORPORATE THIS CHANGE. FURNISH REVISED DOCUMENT TO: REVISED DOCUMENT MUST BE RECEIVED BEFORE MANUFACTURER SHALL MAKE ABOVE REVISIO
8、N AND b. ACTIVITY AUTHORIZED TO APPRQVE SIGNATURE AND TITLE CHANGE FOR GOVERNMENT I DATE (YYMMDD) 1- 12. ACTIVITY ACCWLISHING REVISICM REVISION COMPLETED (Signature) 1 DATE (YYMMDD) I DES C - E C C I Jeffery Tunstall I 92/11/30 D Form 1695, JUL 88 Previous editions are obsolete. Provided by IHSNot f
9、or ResaleNo reproduction or networking permitted without license from IHS-,-,-SlD-5962-Bb028 REV C W 999999b 0033923 Tb2 W -q+ i7 DATE (YR-MO-DA) I APPmED 1987 NOV 9 -L% 1988 DEC 2 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 THIS DRAWING IS AVAILABLE FORUSEBYALLDEPARTMENTS AND AGENCIES OF T
10、HE DEPARTMENT OF DEFENSE O01 DISTRIBUTION STATEMENT A. Approved for public release; dklrlbullon Is iinllmlled. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. 1. SCOPE 1.1 Scope. This drawingIldescribes device requirements for class B microcircuits
11、 in accordance with 1.2.1 of MIL-STD-883, non-JAN devices“. Provisions for the use of MIL-STD-883 in conjunction with compliant 1.2 Part number. The complete part number shall be as shown in the following example: 86028 I o1 T R T X T Outline letter Case outline R D-8 (20-lead, 1.060“ x .310“ x .200
12、“), dual-in-line package -0.5 V dc to +7.0 V dc -0.5 V dc to +5.5 V dc -65C to +15OoC .770 W +300 OC See MIL-M-38510, appendix C +175“C +30 mA -30 mA to t5.0 mA 4.5 V dc minimum to 5.5 V dc maximum 2.0 Y dc 0.8 V dc -55C to +125C - 1/ Must withstand the added PD due to short circuit test; e.g., 10s.
13、 l I I I I I I I Drawing number Devi ce type Case outline lead finish per (1.2.1) (1.2.2) MIL-M-38510 1.2.1 Device type. The device type shall identify the circuit function as follows: Generic number Ci rcu i t f unc t i on Device type o1 2911A Microprogram sequencer 1.2.2 Case outline. The case out
14、line shall be as designated in appendix C of MIL-M-38510, and as :o1 1 ows : 1.3 Absolute maximum ratings. Supply voltage range - - - - - - - - - - - - - - - - Input voltage range- - - - - - - - - - - - - - - - - Storage temperature range- - - - - - - - - - - - - - Maximum power dissipation (PD) i/-
15、 - - - - - - - - - Lead temperature (soldering, 10-seconds) - - - - - - Thema1 resistance, junction-to-case (Jc): Junction temperature (TJ)- - - - - - - - - - - - - - DC output current, into inputs - - - - - - - - - - - CaseR- DC input current - - - - - - - - - - - - - - - - - - 1.4 Recommended oper
16、ating conditions. Supply voltage (V c) - - - - - - - - - - - - - - - - Minimum high leve! input voltage (VIH) - - - - - - - Maximum low level input voltage (V LI- Case operating temperature range (+ci- 1 - - 1 1 1 1 - - SIZE 66028 STANDARDIZED MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER RMC
17、IONLEVEL SHEET 2 DAYTON, OHIO 45444 :SC FORM 193A SEP 87 t U. S. QOVERHMENT FNTIHcI -E 1888-510-8M Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I SMD-5962-b028 REV C m 999999b 0031925 835 m 2. APPLICABLE DOCUt4ENTS 2.1 Government specification and
18、 standard. Unless otherwise specified, the following specification and standard, of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPEC IF I CAT ION MILITARY
19、MIL-M-38510 - Microcircuits, General Specification for. STANDARD MILITARY MI L-STD-883 - Test Methods and Procedures for Microelectronics. (Copies of the specification and standard required by manufacturers in connection with specific acquisition functions should be obtained from the contracting act
20、ivity or as directed by the contracting activity. 1 references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the 3. REQUIREt4ENTS 3.1 Item requirements. The individual item requirements shall be
21、in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensinherei n. I 3.2.1 Terminal connections. The termina
22、l connections shall be as specified on figure 1. 3.2.2 Truth tables. The truth tables shall be as specified on figure 2. 3.2.3 Logic diagram. 3.2.4 Case outline. The case outline shall be in accordance with 1.2.2 herein. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance
23、 characteristics. Unless otherwise specified, the electrical Iperformance characteristics are as specified in table I and apply over the full case operating temperature range. be marked with the part number listed in 1.2 herein. may also be marked as listed in 6.5 herein. 3.4 Marking. Marking shall
24、be in accordance with MIL-STD-883 (see 3.1 herein). The part shall In addition, the manufacturers part number 3.5 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in 6.5. The certificate of compliance I
25、 submitted to DESC-ECS prior to listinn as an approved source of supply shall state that the I manufacturers product meets the requirements of MIL-STD-883 (see 3: i herein) and the requirements herein. SIZE 86028 STANDARDIZED MILITARY DRAWING A SHEET 3 DEFENSE UECTRONICS SUPPLY CENTER DAYTON, OHIO 4
26、5444 REVISION LEVEL it U. S. GOVERNMENT PRINTiNG OFFICE: 1988-549-934 DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. El ectrical performance characteristfcs. Test Output high voltage Output low voltage Input high level
27、 Input low level Input clamp voltage Input low current Input high current Input high current Output short circuit current i-/ Power supply current smo1 VOH Yo L !I H VIL IC IL IHl !IH2 os cc I t Limits I Conditions IGroup A I I Unit Isubgroupsl Min I Max I vcc = v.5 v-to 5.5 v I tII I It u nlecs o t
28、herwi se speci f ied I I I 1, 2, 3 f 2.4 f IOH = -1.0 mA VIN = YIH Or I I I II I 1 1, 2, 3 I I I I I I I I I I I 1, 2, 3 I 1-1.5 I Y -55C i U. 8. GOVUWHPIT PRIMIN OFFICE 1888-548-gM DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
29、,-SMD-5962-Bb02 REV C 999999b 0033933 039 W STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAWN, OHIO 45444 Case R SIZE 86028 A REVISION LEVEL SHEET g A “cc q2 q3 Doq 4 NOTE: Pin 1 is marked for orientation. Provided by IHSNot for ResaleNo reproduction or networking permitted withou
30、t license from IHS-,-,- - SMD-59b2-b028 REV C m 99b 0033932 T75 m I IS1 so I IL L I IL H I IH L I IH H I Address selection I I Symbol I Source for Y outputs 1 Microprogram counter I HPC I I I Address/holding register IAR Pushlpop stack I STKO Direct inputs I“ Output control - -. I II I I IrnIrnI Yi
31、I I II iX Hi I II IL ILI I II IH ILI I II I H IL ISource selected by So, Si I I II I f7 U S GOVERNMENT PRHTING OFFICE 1987-5W096 DESC FORM 193A SEP a7 Synchronous stack control III S lm IPUPI Push/pop stack change I III I 1 III I IH X I No change I i.L i H 1 Increment stack pointer, then push i IL I
32、 L I Pop stack (decrement stack pointer11 III I I I I current PC onto STKO I III I H = High L = Low X = Dont care Z = High impedance FIGURE 2. Truth tables. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-Bb028 REV C 9999996 0033933 903 A W
33、$1 Il -I 86028 STANDARDIZED SIZE MILITARY DRAWING A i 1 REVICION LEVEL I SHEET I B 11 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON. OHIO 45444 I I I f7 U C.GOVERNMENTPRHTINGOFFICE: 1987-549096 DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
34、 IHS-,-,-Ai Three-state outputs vouTXf 1 cLI - 5. O-VBE-vOL R1 - IoL tVoL/l kn B. Normal outputs vcc =5v S1 VOUT d- R2 Test output loads 1 I I I I I Pin no. IPin labellTest circuitlR1 I R2 I I I I II I I 12-15 I Yo-3 I A I220 1 1 kn I I I I II I 1220 I 2.4 knl I l8 I cn+4 I II I CL “1 1 tv IR OL OL
35、2 NOTES: 1. Ci = 50 pF includes scope probe, wiring and stray capacitances without device in test fixture. 2. Si, S2, and S3 are closed during function tests all and AC test except output enable tests. 3. Si and S3 are closed while S2 is open for tpd10 high test. Si and $2 are closed while S3 is ope
36、n for tpd10 low test. 4. CL = 5.0 pF for output disable tests, FIGURE 4. Switching test circuits. SIZE STANDARDIZED 86028 A MILITARY DRAWING I DEFWCE ELECTRONICS SUPPLY CENTER DAYTON, OHK) 45444 A I AEVICION LEVEL I I I * U.S.GWERNMENTPRnITINQOFFICE 1987-MPOQB DESC FORM 193A SEP 87 Provided by IHSNo
37、t for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-59b2-b028 REV C W 999999b 0033935 784 W b CP SIZE 86028 STANDARDIZED MILITARY DRAWING A REVISION LEVEL A SHEET 13 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH0 45444 FIGURE 5. Switching waveforms. ALL INP (EXCEPT Y
38、 OUT Cn +4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SND-5962-b028 REV C m 9999996 003l193b 610 m 3.6 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with each lot of micro
39、circuits delivered to this drawing. 3.7 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 (see 3.1 herein). 3.8 Verification and review. DESC, DESCS agent, and the acquiring activity retain the option to review the manufacturers facility and
40、applicable required documentation. shall be made available onshore at the option of the reviewer. Offshore documentation 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. 4.2 Screenin . Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent s
41、pecified in MIL-STO-883 (see 3.1 herein). conducted -Y on al devices prior to quality conformance inspection. The following additional criteria shall apply: Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be a. Burn-in test, method 1015 of MIL-STD-883. (1) (2) TA = +125C,
42、 minimum. Interim and final electrical test parameters shall be as specified in table II herein, exce t interim electrical parameter tests prior to burn-in are optional at the discretion of tKe manufacturer. Test condition A, B, Cy or D using the circuit submitted with the certificate of compliance
43、(see 3.5 herein). b. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, By C, and D inspections. cri teria chal 1 apply. The following additional 4.3.1 a. b. C. 4.3.2 a. b. Group A inspection. Tests shall be a
44、s specified in table II herein. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. Subgroups 7 and 8 shall verify the truth table specified on figure 2. Groups C and D inspections. End-point electrical parameters shall be as specified in table II herein. Steady-state life
45、 test conditions, method 1005 of MIL-STU-883. (1) Test condition A, B, Cy or D using the circuit submitted with the certificate of compliance (see 3.5 herein). (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. SIZE 860211 STANDARDIZED MILITAR
46、Y DRAWING A SHEET 14 DEFENSE ELECTRONES SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL ESC FORM 193A ri U. 9. GOVERNMENT PRINTING OFFNE. 1W-548-W4 SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-b028 REV C W 9999996 0031937 557 i 5.
47、 PACKAGING TABLE I I. Electrical test requirements. SIZE A 86028 STANDARDIZED MILITARY DRAWING REVISION LEVEL SHEET 15 A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 w I I Subgroups I I MIL-STD-883 test requirements I (per method I I I 5005, table I) I I I I I Interim electrical parameters I
48、 I 1 I (method 5004) I I I I I Fi na1 electrical test parameters I I (method 5004) I 1*, 2, 3, 7, 8,l I 19 I I Group A test requi rements I I (method 5005) I 1, 2, 3, 7, 8, I I I 9, lo*, 11* I IGroups C and D end-point I I electrical parameters I 1, 2, 3 I I (method 5005) I I - I I I * FA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 5.1 Packaging requirements. The requirements for packaging shall be in accordance with I MIL-M-38SlO. 1 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are in
