DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf

上传人:bowdiet140 文档编号:698826 上传时间:2019-01-02 格式:PDF 页数:15 大小:422.04KB
下载 相关 举报
DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf_第1页
第1页 / 共15页
DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf_第2页
第2页 / 共15页
DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf_第3页
第3页 / 共15页
DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf_第4页
第4页 / 共15页
DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf_第5页
第5页 / 共15页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to military drawing format and change L and L1 dimensions of case outline Y. Editorial changes throughout. 87-05-08 N. A. Hauck B Made corrections on figure 5 Instruction set. Technical update to Table I. Updated boiler plate and editoria

2、l changes throughout. - LTG 00-05-02 Monica L. Poelking C Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-09-08 Thomas M. Hess THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12

3、 13 14 PMIC N/A PREPARED BY Ray Monnin DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR DMA AND AGENCIES O

4、F THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-03-07 ADDRESS GENERATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 86030 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E404-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

5、TANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3

6、8535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86030 01 X X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device t

7、ype Generic number Circuit function 01 2940 DMA address generator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y See figure 1 28 Flat pack 3 CQCC1-N2

8、8 28 Leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage range -0.5 V dc to +5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation, (PD)

9、1.733 W 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Case X 15C/W 2/ Case Y 15C/W Case 3. 15C/W 2/ Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high-level inpu

10、t voltage (VIH) 2.0 V dc Maximum low-level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ When a thermal resistance value for this case is included in MIL-STD-1835 that value shall supersede

11、 the value indicated herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.

12、1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPE

13、CIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Sta

14、ndard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-

15、5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQU

16、IREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufactu

17、rer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (

18、QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the

19、 QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and on figure 1. 3.2.2 Ter

20、minal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 4. 3.2.5 Instruction set. The instru

21、ction set shall be as specified on figure 5. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The ele

22、ctrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER

23、COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking

24、of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. Th

25、e compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved sou

26、rce of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conforma

27、nce. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review

28、. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

29、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise specified

30、 Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= minimum, IOH= -1.0 mA VIH= VIHor VIL1, 2, 3 All 2.4 V WCO, ACO IOL= 8.0 mA Output low voltage VOLVCC= minimum, VIN= VIHor VIL1/ A0-7, D0-7DONE IOL= 16 mA 1, 2, 3 All 0.5 V Input high level 2/ VIH1, 2, 3 All 2.0 V Input lo

31、w level 2/ VIL1, 2, 3 All 0.8 V Input clamp voltage VICVCC= minimum, IIN= -18 Ma 1, 2, 3 All -1.5 V D0-7-0.15 Input low current IILVCC= maximum, VIN= 0.5 V All others 1, 2, 3 All -0.8 mA D0-7150 Input high current IIH1VCC= maximum, VIN= 2.7 V All others 1, 2, 3 All 40 A Input high current IIH2VCC= m

32、aximum, VIN= 5.5 V 1, 2, 3 All 1.0 mA Output leakage on DONE ICEXVCC= maximum, VO= 5.5 V 1, 2, 3 All 250 A Output short circuit current 3/ IOSVCC= maximum + 0.5 V, VO= 0.5 V 1, 2, 3 All -30 -85 mA A0-7-50 IOZLVCC= maximum VOUT=0.5V D0-71, 2, 3 All -150 A A0-750 Output off current IOZHOE = 2.4 V VOUT

33、= 2.4V D0-71, 2, 3 All 150 A TC= -55C to +125C 315 Power supply current ICCVCC= maximum, TC= +125C 1, 2, 3 All 225 mA Functional testing See 4.3.1d 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

34、CIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise specified Group A subgroups Device ty

35、pe Limits Unit Min Max ts127 ns Set-up time 1 Hold time 1 Input D0-7 th19, 10, 11 All 6 ns ts249 Set-up time 2 Hold time 2 Input: I0, I1, I2th29, 10, 11 All 5 ns ts334 Set-up time 3 Hold time 3 Input: ACI th39, 10, 11 All 5 ns ts4Set-up time 4 Hold time 4 Input: WCI Control moves 0, 1, 3 only th49,

36、10, 11 All 5 ns Propagation delay 1 Input: ACI Output: ACO tpd19, 10, 11 All 21 ns tpd2Propagation delays 2 and 3 Input: WCI (WCI to DONE occurs only in control modes 0 and 1) Outputs: WCO DONE tpd39, 10, 11 All 54 ns Propagation delay 4 Input: I0 I2Output: D0-7 tpd49, 10, 11 All 41 ns tpd564 ns tpd

37、6tpd762 ns Propagation delays 5-8 Input: CP (CP to DONE occurs only in control modes 0, 1 and 2) Outputs: ACO WCO A0-7DONE tpd89, 10, 11 All 88 ns tEN142 Enable time 1 Disable time 1 From: I0-2To: D0-7tDIS19, 10, 11 All 42 ns tEN230 Enable time 2 Disable time 2 From: OE To: A0-7tDIS2See figure 4 9,

38、10, 11 All 30 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I

39、. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise specified Group A subgroups Device type Limits Unit Min Max Minimum clock low time tPWL9, 10, 11 All 23 ns Minimum clock high time tPWH9, 10, 11 All 35 ns Maximum clock frequenc

40、y 4/ fmaxSee figure 4 9, 10, 11 All 16 MHz 1/ IOLlimit on Aiand Di(I = 0 to 7) applies to either output individually, but not both at the same time. The sum of the loading on Aiand Diis limited to 24 mA MIL. 2/ These input levels provide no guaranteed noise immunity and should only be static tested

41、in a noise-free environment (not functionally tested) 3/ Not more than one output should be shorted at a time. Duration of the short circuit test should not exceed one second. 4/ Not tested directly but guaranteed to the limit shown. Provided by IHSNot for ResaleNo reproduction or networking permitt

42、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Case Y Parameter Min. mm Max. mm A b c D E E1 E2 E3 e L L1 Q S S1 .070 .017 .006 .690 .620 - .520 .030 .045 .250 1.140 .0

43、30 - .005 1.78 0.43 0.15 17.53 15.75 - 13.21 0.76 1.14 6.35 28.96 0.76 - 0.13 .098 .023 .010 .730 .660 .680 - - .055 .320 1.240 .060 .045 - 2.49 0.58 0.25 18.54 16.76 17.27 - - 1.40 8.13 31.50 1.52 1.14 - NOTES: 1. Index area: A notch, tab, or pin one identification mark shall be located within the

44、shade area shown. 2. E1 allows for Ag-Cu alloy brazed overrun. 3. Dimensions b and c increase by 3 mils maximum limit if tinplate/solder dip lead finish is applied. 4. All dimensions are given in inches. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted wit

45、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 NOTE: Pin is marked for orientation. FIGURE 2. Terminal connections. FIGURE 3. Block diagram. Provided by IHSNot for ResaleNo r

46、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF includes scope probe, stray wiring, and capacitances without device

47、 in test fixture. 2. S1, S2, S3are closed during function tests and all AC tests except output enable tests. 3. S1and S3are closed while S2is open for tPZHtest. S1and S2are closed while S3is open for tPZLtest. 4. CL= 5.0 pF for output disable tests Test output loads for: Pin no. (DIP) Pin labelTest

48、circuit R1R2- A0 - 7A 220 1K - D0 - 7A 220 1K 6 ACO B 470 2.4K 7 DONE C 270 - 10 WCO B 470 2.4K FIGURE 4. Test circuit and timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 FIGURE 4. Test circuit and timing waveforms - Continued. Provided by IHS

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1