DLA SMD-5962-86703 REV F-2011 MICROCIRCUITS MEMORY DIGITAL 32 x 8-BIT PROM MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Correct typing errors in truth table and table I. Reword paragraph 4.3.1c. Update vendors part numbers. 1987 July 13 M. A. Frye B Add one vendor, CAGE 18324 and their part numbers. Add programming procedure and waveforms for circuit B. 1988 May 17 M. A. Fry

2、e C Change vendor similar part numbers from 82523B/BEA and 82523B/BFA to 82S123B/BEA and 82S123B/BFA respectively. Table I changed VOLmax limit from 0.45 volt to 0.5 volt and IOSmax limit from -90 mA to -100 mA. Editorial changes throughout. 1989 Jan 12 M. A. Frye D Updated boilerplate. Removed prog

3、ramming specifics from drawing, including table III. Separated source bulletin from body of drawing. - glg 00-08-09 Raymond Monnin E Updated boilerplate as part of 5 year review. ksr 05-11-15 Raymond Monnin F Updated body of drawing to reflect current requirements. glg 11-12-16 Charles Saffle THE OR

4、IGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Steve Duncan DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.landandmari

5、time.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Michael. A. Frye MICROCIRCUITS, MEMORY, DIGITAL, 32 x 8-BIT PROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 1986 July 17 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-86703

6、SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E118-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86703 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1

7、.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-86703 01 E X | | | | | | | | | | |

8、 | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit Access time 01 1/ 32 x 8-bit PROM, T.S. 50 ns 02 1/ 32 x 8-bit PROM, T.S. 35 ns 1.2.2

9、 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line package F GDFP2-F16 or CDFP3-F16 16 flat package 2 CQCC1-N20 20 square leadless chip carrier package 1.

10、2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -0.5 V dc to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD): 2/ . 633 mW Lead temperature

11、 (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 DC voltage applied to outputs during programming 21 V dc DC voltage applied to outputs (except during programming) -0.5 V dc to +VCCmaximum Output current into outputs during programming (maximum duration of

12、one second) 250 mA DC input current -30 mA to +5 mA 1.4 Recommended operating conditions. Case operating temperature range (TC) . -55C to +125C Maximum low level input low voltage (VIL) . 0.8 V dc Minimum high level input high voltage (VIH) . 2.0 V dc Supply voltage range (VCC) . 4.5 V dc to 5.5 V d

13、c 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted

14、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86703 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand

15、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT O

16、F DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents

17、 are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the t

18、ext of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN

19、class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordanc

20、e with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A “Q“

21、 or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal c

22、onnections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for co

23、ntracts involving no altered item drawing shall be as specified on figure 3. When testing is required per 4.3 herein, the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed) or to any altered item dr

24、awing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical per

25、formance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provi

26、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86703 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test |Symbol |

28、output voltage |VOL1/ |VIN= VILor VIH| 1, 2, 3 | All | | 0.5 | V | |IOL= 16 mA, VCC= min. | | | | | | | | | | | | Input high level voltage |VIH1/ |Guaranteed input logical high | 1, 2, 3 | All | 2.0 | | V | |voltage for all inputs. | | | | | Input low level voltage |VIL1/ |Guaranteed input logical l

29、ow | 1, 2, 3 | All | | 0.8 | V | |voltage for all inputs. | | | | | High level input current |IIH|VCC= max., VIN= 2.7 V | 1, 2, 3 | All | | 25 | A | | | | | | | Low level input current |IIL|VCC= max., VIN= 0.45 V | 1, 2, 3 | All | | -250 | A | | | | | | | Output short-circuit | | | | | | | current |

30、IOS|VCC= 5.5 V, VO= 0 V 2/ | 1, 2, 3 | All |-20 |-100 | mA | | | | | | | Power supply current |ICC|VCC= max. | 1, 2, 3 | All | | 115 | mA | |All inputs = GND | | | | | | | | | | | | Input clamp voltage |VI1/ |VCC= min., IIN= -18 mA | 1, 2, 3 | All | | -1.2 | V | | | | | | | | |VCC= max. | VO= 4.5 V

31、| | | | 40 | | |VCS= 2.4 V | | | | | | | | | VO= 2.4 V | | | | 40 | Output leakage current |ICEX| | | 1, 2, 3 | All | | | A | | | VO= 0.4 V | | | | -40 | | | | | | | | | | | | | | | | Address access time |tAA|See figures 3 and 4 3/ | 9, 10, 11 | 01 | | 50 | ns | | | | 02 | | 35 | | | | | | | | | | |

32、 | | | | Enable access time |tEA|See figures 3 and 4 4/ | 9, 10, 11 | 01 | | 30 | ns | | | | 02 | | 25 | | | | | | | | Enable recovery time |tER|See figures 3 and 4 4/ | 9, 10, 11 | 01 | | 30 | ns | | | | 02 | | 25 | | | | | | | | 1/ These are absolute voltages with respect to device ground pin and

33、include all overshoots due to system or tester noise or both. Do not attempt to test these values without suitable equipment. 2/ Not more than one output should be shorted at a time. Duration of the short circuit should not be more than 1 second. 3/ Parameter tAAis tested with switch S1 closed and C

34、L= 30 pF. 4/ Parameter tEAis tested with CL= 30 pF to the 1.5 V; S1 is open for high impedance to high tests and closed for high impedance to low tests. Parameter tERis tested with CL= 5 pF. High to high impedance tests are made with S1 open to an output voltage of VOH-0.5 V. Low to high impedance t

35、ests are made with S1 closed to the VOL+0.5 V level. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86703 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 3.5 Ma

36、rking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the opt

37、ion of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance w

38、ith MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land

39、 and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall b

40、e provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent and the acq

41、uiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either

42、the manufacturer or the user to result in a wide variety of PROM configurations, two processing options are provided for the selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 3

43、.2.3.1 and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration. 3.10.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the a

44、ltered item drawing shall be satisfied by the manufacturer prior to delivery. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and sh

45、all be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test (method 1015 of MIL-STD-883). (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be

46、 made available to the preparing or procuring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test p

47、arameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. All devices processed to an altered item drawing may be programmed either before or after burn-in at the discretion of the manufacturer. The required electrical testing shall include, as a minimum, the final electrical tests for programmed devices as specified in table II. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

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