1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 03. Add one vendor, CAGE 64155. Make changes to table I and throughout. 91-02-14 M. A. FRYE B Changes in accordance with 5962-R271-92. 92-11-20 M. A. FRYE C Changes in accordance with 5962-R016-97. 96-10-23 R. MONNIN D Changes in
2、accordance with 5962-R253-97. 97-04-08 R. MONNIN E Drawing updated to reflect current requirements. - ro 02-06-20 R. MONNIN F Drawing updated as part of 5 year review. -rrp 09-01-13 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV F F F F F F F F
3、F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCI
4、RCUIT, LINEAR, PRECISION VOLTAGE REFERENCE, 2.5 VOLT, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-11-17 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 5962-86861 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E398-07 Provided by IHSNot for ResaleNo reproduction o
5、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JA
6、N class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86861 01 P X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device
7、type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 580S, 1503 Precision 2.5 V reference (1%) 02 580T, 1503A Precision 2.5 V reference (0.4%) 03 580U Precision 2.5 V reference (0.4%) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-
8、1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual in-line X See figure 1 3 Can Y MACY1-X3 3 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) 40 V dc M
9、aximum power dissipation (PD): Case P . 600 mW 1/ Case X . 350 mW Case Y . 1.0 W Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +175C Thermal resistance, junction-to-case (JC): Case P . See MIL-STD-1835 Case X . 30C/W Case Y . 15C
10、/W Thermal resistance, junction-to-ambient (JA): Case X . 150C/W Case Y . 120C/W 1/ Derate case P at 4.8 mW/C above +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS C
11、OLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V dc to +30 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The follow
12、ing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, G
13、eneral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircui
14、t Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing a
15、nd the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with
16、MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be
17、 processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not aff
18、ect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q” or “QML” certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, cons
19、truction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical perfor
20、mance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in t
21、able II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the e
22、ntire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CE
23、NTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C VCC= +15 V, IL= 0 mA Group A subgroups Device type Limits Unit unless otherwise specified Min Max Quiescent current ICC1 01,02 2
24、.0 mA 03 1.5 2,3 All 2.0 Output voltage VOUTTA= +25C 1/ 1 All 2.475 2.525 V 12 02,03 2.49 2.51 Line regulation VRLINE1VCC= 7 V to 30 V, 1 01,02 6 mV TA= +25C 03 2 VRLINE2VCC= 4.5 V to 7 V, 01,02 3 TA= +25C 03 1 Load regulation VRLOADIL= 0 mA to 10 mA, TA= +25C 1 All 10 mV Output voltage temperature
25、TCVOUT1/ 2,3 01 25 mV coefficient 02 11 03 4.5 1/ Measurements of output voltage temperature coefficient is acceptable for output voltage across temperature measurement (subgroups 2 and 3) or visa versa. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
26、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 CLSymbol Inches Millimeters Notes Min Max Min Max A 0.115 0.150 2.92 3.81 b 0.016 0.019 0.41 0.48 1,4 b1 - 0.021 - 0.53 1,4 D 0.209 0.230 5.31 5.8
27、4 D1 0.178 0.195 4.52 4.95 e 0.100 T.P. 2.54 T.P. 2 e1 0.050 T.P. 1.27 T.P. 2 F - 0.030 - 0.76 k 0.036 0.046 0.91 1.17 k1 0.028 0.048 0.71 1.22 3 L 0.500 - 12.70 - 1 L1 - 0.050 - 1.27 1 L2 0.250 6.35 45 T.P. NOTES: 1. (Three leads) b applies between L1and L2. b1 applies between L2and 0.5 inch (12.70
28、 mm) from seating plane. Diameter is uncontrolled in L1and beyond 0.5 inch (12.70 mm) from seating plane. 2. Leads having maximum diameter 0.019 inch (0.48 mm) measured in gauging plane 0.054 inch (1.4 mm) + 0.001 inch (0.03 mm) 0.000 inch (0.00 mm) below the seating plane of the device are within 0
29、.007 inch (0.18 mm) of their true positions relative to a maximum-width tab. 3. Measured from maximum diameter of the actual device. 4. All leads increased maximum limit by 0.003 inch (0.08 mm) when hot solder dip finish is applied. 5. The U.S. government preferred system of measurement is the metri
30、c SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permit
31、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 Device type 01, 02, 03 Case outlines P X Y Terminal number Terminal symbol 1 +VIN+VIN+VIN2 VOUTVOUTVOUT3 -VIN-VIN-V
32、IN4 NC - - 5 NC - - 6 NC - - 7 NC - - 8 NC - - NC = No connection FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990
33、 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q” or “QML” certification mark in accordance
34、 with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-V
35、A prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
36、 each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers fac
37、ility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be
38、in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manu
39、facturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2)
40、 TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. c. Optional subgroup 12 is used for grading and part selection at TA= +25C. It
41、 is not included in PDA. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in t
42、able II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Optional subgroup 12 is used for grading and part selection at TA= +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI
43、CROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical param
44、eters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 12 Group A test requirements (method 5005) 1, 2, 3,12 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall
45、be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity up
46、on request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING
47、 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistic
48、s purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86861 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 6.3 Configuration control of SMDs. All proposed ch
