1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02, generic 2070. Made changes to 1.2.1, 1.3, table I, figure 1, figure 2, and 6.4. 88-11-28 M. A. Frye B Update drawing to current requirements. Editorial changes throughout. - drw 06-09-20 Raymond Monnin THE ORIGINAL FIRST SHEET
2、 OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Rick Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS
3、 DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, QUAD 1.5 AMP AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-05-27 DARLINGTON SWITCHES, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-87532 SHEET 1 OF 10 D
4、SCC FORM 2233 APR 97 5962-E641-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Sco
5、pe. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87532 01 E A Drawing number Device type (see 1
6、.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 2069 Quad darlington switches with pre-driver stages, recommended supply voltage 5.0 V 02 2070 Quad darlington switches wi
7、th pre-driver stages, recommended supply voltage 12.0 V 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-P
8、RF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VS): Device 01 . 10 V dc Device 02 . 20 V dc Logic input voltage (VIN): Device 01 . 15 V dc Device 02 . 30 V dc Logic input current (IB) . 25 mA Output voltage (VCEX): Device 01 . 80 V dc Device 02 . 50 V dc Output voltage (VCE(SUS)
9、: Device 01 . 50 V dc Device 02 . 35 V dc Output current (IOUT) 1.5 A Power dissipation (PD) . 2.2 W 1/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Thermal resistanc
10、e, junction-to-ambient (JA) +90C/W _ 1/ Derate at 11 mW/C above +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DS
11、CC FORM 2234 APR 97 1.4 Recommended operating conditions. Ambient operating temperature range . -55C to +125C Supply voltage (VS): Device 01 . 5.0 V dc Device 02 . 12.0 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and ha
12、ndbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT
13、 OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documen
14、ts are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the
15、references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF
16、-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be proces
17、sed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect for
18、m, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, constructio
19、n, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shal
20、l be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical tes
21、t requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMB
22、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C Device 01, VS= 5.0 V Device 02, VS= 12.0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Output leakage cur
23、rent ICEXVCE= 80 V 1, 2, 3 01 500 A VCE= 50 V 02 500 Output sustaining voltage VCE(SUS)IC= 100 mA, VIN= 0.4 V 1, 2, 3 01 50 V 02 30 Collector-emitter saturation voltage VCE(SAT)Device 01, VIN= 2.9 V IC= 500 mA 1 All 1.20 V Device 02, VIN= 5.1 V IC= 750 mA 1.35 TA= +25C IC= 1.0 A 1.55 C= 1.25 A 1.75
24、Device 01, VIN= 2.8 V IC= 500 mA 2 All 1.35 V Device 02, VIN= 5.0 V IC= 750 mA 1.55 TA= +125C IC= 1.0 A 1.75 C= 1.25 A 1.95 Device 01, VIN= 3.2 V IC= 500 mA 3 All 1.35 V Device 02, VIN= 5.5 V IC= 750 mA 1.55 TA= -55C IC= 1.0 A 1.75 C= 1.25 A 1.95 Provided by IHSNot for ResaleNo reproduction or netwo
25、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. - continued Test Symbol Conditions -55C TA +125C Devic
26、e 01, VS= 5.0 V Device 02, VS= 12.0 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input current IINVIN= 2.75 V, TA= +25C 1 01 550 A VIN= 5.0 V, TA= +25C -55C 1, 3 02 400 IN= 2.75 V, TA= +125C 2 01 850 VIN= 12.0 V, TA= +25C, -55C 1, 3 02 1250 IN= 3.75 V, TA= +125C 2 0
27、1 1400 VIN= 5.0 V, TA= +125C 2 02 800 IN= 3.2 V, TA= -55C 3 01 600 VIN= 12.0 V, TA= +125C 2 02 1600 Input voltage VINVCE= 2.0 V TA= +25C 1 01 2.75 V IC= 1.0 A 02 5.0 TA= -55C 3 01 3.2 02 5.0 Supply current ISVIN= 3.2 V, IC= 500 mA 1, 2, 3 01 6 mA VIN= 5.0 V, IC= 500 mA 02 6 Turn-on delay tPHL0.5 VIN
28、to 0.5 VOUT, See figure 3 9, 10, 11 All 1 s Turn-off delay tPLH9 All 1.5 s 10, 11 3.5 Clamp diode leakage current IRVR= 80 V 1, 2, 3 01 100 A VR= 50 V 02 100 Clamp diode forward voltage VFIF= 1.25 A 1, 2, 3 All 2.1 V Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
29、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device types 01, 02 Case outline E Terminal number Terminal symbol 1 K1& 4 2 C13 B14 GND 5 GND 6 B27 NC 8 C29 K2& 3 10 C311 B312 GND
30、13 GND 14 VS15 B416 C4FIGURE 1. Terminal connections. FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B S
31、HEET 7 DSCC FORM 2234 APR 97 NOTE: Device type 01, 2.4 V. Device type 02, 5.0 V. FIGURE 3. Switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
32、HIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PI
33、N number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicat
34、or “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL
35、-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate o
36、f conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent,
37、 and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in
38、accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) T
39、est condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicabl
40、e, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. P
41、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883
42、 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (me
43、thod 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D insp
44、ections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be a
45、s specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon r
46、equest. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSN
47、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87532 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for pac
48、kaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to ex
