1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. ksr 10-04-23 Charles F. Saffle The original first page of this drawing has been replaced. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7
2、 8 9 10 11 12 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR,
3、 512 X 8-BIT PROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-08-05 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-87690 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E249-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without li
4、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
5、accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87690 01 R_ A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circui
6、t function as follows: Device type Generic number 1/ Circuit function Propagation Delay 01 27S29 512 x 8 Bit Bipolar PROM, T.S. 70 ns 02 27S29A 512 x 8 Bit Bipolar PROM, T.S. 45 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
7、 designator Terminals Package style R GDIP1-T20, CDIP2-T20 20 dual-in-line package S GDFP2-F20, CDFP3-F20 20 flat package 2 CQCC1-N20 20 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range - -
8、 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -0.5 V dc to +5.5 V dc Storage temperature range- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -6
9、5C to +150C Maximum power dissipation (PD) 1/- - - - - - - - - - - - - - - - - - - - - - - - - - 880 mW Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - - - - - - - - - 300C Thermal resistance, junction-to-case (JC): 2/- - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction te
10、mperature (TJ)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 175 C/W DC voltage applied to outputs (except during programming)- - - - - - - - - -0.5 V to +VCCmaximum DC voltage applied to outputs during programming- - - - - - - - - - - - - - - 21 V dc DC current into outputs durin
11、g programming (maximum duration of 1.0 seconds) - - - - - - - - - - - - - - - - - - - - - - - - 250 mA dc DC input current - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -30 mA to +5 mA 1.4 Recommended operating conditions. Supply voltage (VCC) - - - - - - - - - - - -
12、- - - - - - - - - - - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high-level input voltage (VIH)- - - - - - - - - - - - - - - - - - - - - - - - 2.0 V dc Maximum low-level input voltage (VIL) - - - - - - - - - - - - - - - - - - - - - - - - 0.8 V dc Case operating temperatur
13、e range (TC) - - - - - - - - - - - - - - - - - - - - - - - -55C to +125C 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ Heat sinking is recommended to reduce the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
14、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
15、part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STA
16、NDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availabl
17、e online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this d
18、rawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level
19、B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the m
20、anufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These mo
21、difications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as spec
22、ified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The truth table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving
23、no altered item drawing shall be as specified on figure 2. When required in groups A, B, or C (see 4.3), the devices shall be programmed by the manufacturer prior to test with a minimum of 50 percent of the total number of gates programmed or to any altered item drawing pattern which includes at lea
24、st 25 percent of the total number of gates programmed. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless other
25、wise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
26、 subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Elect
27、rical performance characteristics. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V (Unless otherwise specified) Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= MIN, IOH= -2.0 mA VIN= VIHor VIL1,2,3 All 2.4 V Output low voltage VOLVCC= MIN, IOH= 16 mA VIN= VIHor VIL
28、1,2,3 All 0.50 V Input low current IILVCC= MAX, VIN= 0.45 V 1,2,3 All -250 A Input high current IIH CC= MAX, VIN= 2.7 V 1,2,3 All 25 A Output short circuit current ISCVCC= MAX, VOUT= 0.0 V 1/ 1,2,3 All -20 -90 mA Power supply current ICCAll inputs = GND. VCC= MAX 1,2,3 All 160 mA Input clamp voltage
29、 VIVCC= MIN, IIN= -18 mA 1,2,3 All -1.2 V Output leakage current ICEXVCC= 5.5 V VCS= 2.4 V VO= 5.5 V VO= 0.4 V 1,2,3 All 40 -40 A Address valid to output valid access time tAVQVSee figures 4 and 5 2/ 9,10,11 01 70 ns 02 45 Delay from output enable valid to output High-Z tGVQZSee figures 4 and 5 3/ 9
30、,10,11 01 30 ns 02 25 Delay from output enable valid to output valid tGVQVSee figures 4 and 5 3/ 9,10,11 01 30 ns 02 25 1/ Not more than one output should be shorted at a time. Duration of the short circuit should not be more than 1 second. 2/ tAVQVis tested with switch S1 closed and CL= 50 pF. 3/ t
31、GVQVis tested with CL= 50 pF to the 1.5 V; S1 is open for high impedance to high tests and closed for high impedance to low tests. tGVQZis tested with CL= 5 pF. High to high impedance tests are made with S1 open to an output voltage of VOH-0.5 V. Low to high impedance tests are made with S1 closed t
32、o the VOL+0.5 V level. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 Device types All Case outli
33、nes R, S, and 2 Terminal number Terminal symbol 1 A02 A13 A24 A35 A46 Q07 Q18 Q29 Q310 GND 11 Q412 Q513 Q614 Q715 G 16 A517 A618 A719 A820 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN
34、G SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Word no. G Address Data A8A7A6A5A4A3A2A1A0Q7Q6Q5Q4Q3Q2Q1Q0NA H L X X X X X X X X X X X X X X X X X X OC L OC L OC L OC L OC L OC L OC L OC L NA = Not applicable H = High L = Lo
35、w X = Input may be high level, low level, or open circuit. OC = Open circuit (high resistance output). FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMB
36、US COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3
37、990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. All device test loads should be located within 2 inches of device output pin. 2. S1is open for output data HIGH to Hi-Z to output data HIGH tests. S1is closed for all other ac tests. 3. Load capacitance includes all stray and fixture capac
38、itance. FIGURE 4. Switching test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 FIGURE 5
39、. Switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87690 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall
40、 be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of no
41、t marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-P
42、RF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
43、listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot o
44、f microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. Defense Supply Center Columbus (DSCC), DSCCs agent, and the acquiring activity retain the option to review
45、 the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of conf
46、igurations; two processing options are provided for selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.2.1 and table II. It is recommended that users perform subgroups 7 a
47、nd 9 after programming to verify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to
48、delivery. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer u
