1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outlines T and U. Change limits for VOUT, line regulation, load regulation, standby current drain; with line and with load tests. Change footnotes 1/, 2/, and 5/. Add vendors CAGE U4637 and 69210 89-07-24 M. A. FRYE B Add case outline 2.
2、 Change limit for ripple rejection test. Editorial changes throughout. 92-11-16 M. A. FRYE C Add device type 02. Add case outline P. Technical and editorial changes throughout. 93-11-09 M. A. FRYE D Add case outline N. Make changes to 1.2.2, 1.3, table I, figure 1,and figure 2. - ro 99-10-20 R. MONN
3、IN E Add radiation hardness requirements. Add CAGE 21845. -rrp 99-12-17 R. MONNIN F Add radiation hardness requirements. Add CAGE 21845. -rrp 00-02-01 R. MONNIN G Make change to case outline N. Add case outlines 4 and 5. Make changes to 1.2.3, 1.3, figure 1, and figure 2. 02-02-11 R. MONNIN H Make c
4、hange to VINlimits to Ripple rejection test and footnote 3/ as specified in table I. - ro 02-10-09 R. MONNIN J For case outlines T and U only, add footnote 1/ under 1.2.3 and add note 2 under figure 1. Drawing updated to reflect current requirements. rrp 06-01-11 R. MONNIN K Delete figure 3 irradiat
5、ion exposure circuit. Make change to paragraph 3.2.3. Update paragraphs to current MIL-PRF-38535 requirements. - ro 13-03-21 C. SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV K K K K SHEET 15 16 17 18 REV STATUS REV K K K K K K K K K K K K K K OF SHEETS SHEET 1 2 3 4
6、 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY CHARLES E. BESORE DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAY MONNIN APPROV
7、ED BY D. A. DiCENZO MICROCIRCUIT, LINEAR, POSITIVE 12 VOLT REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-07-28 AMSC N/A REVISION LEVEL K SIZE A CAGE CODE 67268 5962-87776 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E323-13 Provided by IHSNot for ResaleNo reproduction or networking permitted wi
8、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in a
9、ccordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 F 87776 01 P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.3) Lead finish (see 1.2.4) / / Drawing nu
10、mber 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 7812A Positive regulator, fixed, 12 volt 02 78M12 Positive regulator, fixed, 12 volt 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
11、 as follows: Outline letter Descriptive designator Terminals Package style M See figure 1 3 Power surface mount N CBCC2-N3 3 Bottom terminal chip carrier P GDIP1-T8 or CDIP2-T8 8 Dual-in-line T 1/ See figure 1 3 TO-257 flange mounted and glass sealed U 1/ See figure 1 3 TO-257 flange mounted with is
12、olated tab and glass sealed X See figure 1 3 TO-39 can Y See figure 1 2 TO-3 can Z MBFM4-P2 2 TO-66 can 2 CQCC1-N20 20 Square leadless chip carrier 4 See figure 1 3 Flange mount, glass sealed, with gull wings 5 CBCC1-N3 3 Bottom terminal chip carrier 1.2.3 Lead finish. The lead finish is as specifie
13、d in MIL-PRF-38535, appendix A. _ 1/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COL
14、UMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Input voltage: Operating or output shorted to ground (Device types 01 and 02) . 35 V dc Transient (Device type 01) . 50 V dc 2/ Output current (IO) Cases M, N, T, U, Y, Z, 4, and 5 1.5 A Cases P, X, a
15、nd 2 (Device type 01) 0.5 A Power dissipation (PD): TC= +25C: Device type 01, cases M, N, T, U, Z, 4, and 5 15 W Device type 01, cases X and 2 . 2 W Device type 01, case Y 20 W TA= +25C: Device type 01, cases M, N, T, U, and Z 3.0 W Device type 01, cases X and 2 . 1.0 W Device type 01, case Y 4.3 W
16、Device type 01, case 4 . 1.7 W Device type 01, case 5 . 1.3 W Device type 02, case P 1050 mW 3/ Device type 02, case 2 . 1375 mW 4/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Case temperature, case outline 2 (soldering, 10 seconds): Device type 02 . +260C
17、Junction temperature (TJ) +150C 5/ Thermal resistance, junction-to-case (JC): Cases M and U 4.2C/W Cases N and T . 3.5C/W Cases P and 2 . See MIL-STD-1835 Case X . 15C/W Case Y . 3C/W Case Z . 6C/W Case 4 . 5.1C/W Case 5 . 3.6C/W Thermal resistance, junction-to-ambient (JA): Device type 01, cases M,
18、 N, T, U, and Z . 42C/W Device type 01, cases X and 2 120C/W Device type 01, case Y . 35C/W Device type 01, case 4 60C/W Device type 01, case 5 80C/W Device type 02, case P 110C/W Device type 02, case 2 65C/W 2/ The 50 volt input rating refers to the ability of the regulator to withstand high line o
19、r transient conditions without damage. Since the regulators maximum current capability is reduced, the output may fall out of regulation at high input voltages under nominal loading. 3/ Derate at 8.4 mW/C above TA= +25C. 4/ Derate at 11.0 mW/C above TA= +25C. 5/ The device is protected by thermal sh
20、utdown circuit which is designed to turn off the output transistor whenever the device junction temperature is in excess of +150C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME C
21、OLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Input voltage range (VIN) +8 V dc to +25 V dc Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si)/s) .
22、300 krads(Si) 6/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicita
23、tion or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF D
24、EFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia,
25、 PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtaine
26、d. _ 6/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo rep
27、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance
28、 with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
29、may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall n
30、ot affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design
31、, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.3 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation e
32、xposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrica
33、l performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table
34、I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manu
35、facturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification
36、mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance s
37、ubmitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-3853
38、5, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Marit
39、imes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice
40、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups
41、Device type Limits Unit Min Max Output voltage VOUTTA = +25C 1 01 11.88 12.12 V M,D,P,L,R,F 1 11.88 12.12 TA= +25C 1 02 11.5 12.5 VIN= 14.5 V to 27 V 4/ 1,2,3 01 11.64 12.36 M,D,P,L,R,F 1 11.64 12.36 VIN= 15.5 V to 27 V 4/ 1,2,3 02 11.4 12.6 Ripple rejection 5/ VIN/ f = 120 Hz, VIN= 19 V 4 01 61 dB
42、VOUT5,6 6/ 54 M,D,P,L,R,F 4 61 f = 120 Hz, IOUT= 100 mA, 4,5,6 6/ 02 55 VIN= 15 V to 25 V f = 120 Hz, IOUT= 300 mA, 4 6/ 55 VIN= 15 V to 25 V Line regulation 5/ 7/ VRLINEVIN= 14.5 V to 27 V 1 01 18 mV -55C TJ +125C 2,3 50 M,D,P,L,R,F 1 18 VIN= 16 V to 22 V 1 9 -55C TJ +125C 2,3 30 M,D,P,L,R,F 1 9 VI
43、N= 14.5 V to 30 V, TA= +25C 1 02 60 VIN= 16 V to 25 V, TA= +25C 1 30 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI
44、ON LEVEL K SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics- Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Load regulation 5/ VRLOADIO= 5.0 mA to 1.5 A, 8/ -55C TJ +125C 1 01 32 mV M,
45、D,P,L,R,F 1 32 IO= 5.0 mA to 1.0 A, 8/ -55C TJ +125C 2,3 60 IO= 250 mA to 750 mA, 8/ 1 01 20 -55C TJ +125C 2,3 40 M,D,P,L,R,F 1 20 IO= 5.0 mA to 500 mA, 9/ 1 01 30 -55C TJ +125C 2,3 60 1 30 IO= 5.0 mA to 500 mA, 1 02 120 TA= 25C IO= 5.0 mA to 200 mA, 1 02 60 TA= 25C Standby current drain ISCD1 01 6.
46、0 mA 2,3 6.5 M,D,P,L,R,F 1 6.0 1 02 7.0 Standby current drain change with line ISCD(line) VIN= 15 V to 30 V 1,2,3 01 0.8 mA M,D,P,L,R,F 1 0.8 VIN= 15 V to 30 V, IO= 200 mA 1,2,3 02 0.8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
47、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87776 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics- Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A su
48、bgroups Device type Limits Unit Min Max Standby current drain change with load ISCD (load) IO= 5.0 mA to 1 A 8/ 1,2,3 01 0.5 mA M,D,P,L,R,F 1 0.5 IO= 5.0 mA to 500 mA 9/ 1,2,3 0.5 1 0.5 IO= 5.0 mA to 350 mA 1,2,3 02 0.5 Dropout voltage VDO VOUT= 100 mV, 8/ IO= 1.0 A 1,2,3 01 2.5 V M,D,P,L,R,F 1 2.5 VOUT= 100 mV, 9/ IO= 500 mA 1,2,3 2.5 1 2.5 IO= 350 mA, TA= +25C 1 02 2.5 Peak output current IO(PK)TA= +25C 8/ 1 01 1.5 3.3 A M,D,P,L,R,F 1 1.5 3.3 TA= +25
