1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE U4637 and 69210. Add case outlines T and U. Change test limits for line regulation, load regulation, standby current drain and standby current drain with line tests. Change test conditions for line regulation and output voltage te
2、sts. Add temperature characterization for ripple rejection test. Change footnotes 1/, 2/, and 5/ in table I. 89-07-24 M. A. FRYE B Add case outline 2. Change to test conditions in table I. Editorial changes throughout. 92-09-15 M. A. FRYE C Add device type 02. Add case outline P. Technical and edito
3、rial changes throughout. 93-11-09 M. A. FRYE D Add device type 03. Technical and editorial changes throughout. 94-04-04 M. A. FRYE E Changes in accordance with N.O.R. 5962-R185-94. 94-05-09 M. A. FRYE F Changes in accordance with N.O.R. 5962-R122-95. 95-07-05 M. A. FRYE G Add radiation hardness requ
4、irements. Add CAGEs 21845, 27851, and case outline M. Make changes to 1.2.2, 1.3, 1.4, table I, figure 1, and figure 2. Redrawn. - ro 00-01-31 R. MONNIN H Make change to case outline N. Add case outlines 5 and 6. Make changes to 1.2.3, 1.3, figure 1, and figure 2. rrp 02-02-11 R. MONNIN J Add a foot
5、note to the case outline U, TO-257 package as specified under 1.2.3 and figure 1. - ro 04-03-09 R. MONNIN K For case outline T only, add footnote 2/ under 1.2.3 and make change to note 2 under figure 1. Drawing updated to reflect current requirements. rrp 06-01-11 R. MONNIN L Update drawing to curre
6、nt MIL-PRF-38535 requirements. -rrp 13-03-07 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV L L L L L L SHEET 15 16 17 18 19 20 REV STATUS REV L L L L L L L L L L L L L L OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY CHARLES E. BESORE DLA
7、LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAY MONNIN APPROVED BY D. A. DiCENZO MICROCIRCUIT, LINEAR, POSITIVE 5-VOLT REGULATOR,
8、MONOLITHIC SILICON DRAWING APPROVAL DATE 88-07-28 AMSC N/A REVISION LEVEL L SIZE A CAGE CODE 67268 5962-87782 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E284-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8
9、7782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Numb
10、er (PIN). The complete PIN is as shown in the following example: 5962 F 87782 01 P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.3) Lead finish (see 1.2.4) / / Drawing number 1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-3
11、8535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 7805A (see figure 2
12、, case 2) Positive regulator, fixed, 5 volt fixed 02 78M05M Positive regulator, fixed, 5 volt fixed 03 1/ 7805A (see figure 2, case 2) Positive regulator, fixed, 5 volt fixed 1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desig
13、nator Terminals Package style M See figure 1 3 Power surface mount N CBCC2-N3 3 Bottom terminal chip carrier P GDIP1-T8 or CDIP2-T8 8 Dual-in-line T 2/ See figure 1 3 TO-257 flange mounted and glass sealed U 2/ See figure 1 3 TO-257 flange mounted with isolated tab and glass sealed X See figure 1 3
14、TO-39 can Y See figure 1 2 TO-3 can Z MBFM4-P2 2 TO-66 can 2 CQCC1-N20 20 Square leadless chip carrier 4 CQCC1-N20B 20 Square leadless chip carrier with thermal pads 5 See figure 1 3 Flange mount, glass sealed, with gullwings 6 CBCC1-N3 3 Bottom terminal chip carrier 1.2.4 Lead finish. The lead fini
15、sh is as specified in MIL-PRF-38535, appendix A. 1/ Device type 03 has been added only to incorporate a different pin out for case outline 2. 2/ For outline letters T and U, CAGE 34333 manufacturers the TO-257 package with ceramic seal. Provided by IHSNot for ResaleNo reproduction or networking perm
16、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Input voltage: Operating or output shorted to ground (device types 01 02, and 03) 35 V dc Tr
17、ansient (device types 01 and 03) 43 V dc 3/ Output current (IO) Case M (device type 01) . 1.5 A Cases P, X, and 2 (device types 01 and 03) 0.5 A Cases N, T, U, Y, Z, 5, and 6 (device types 01 and 03) 1.0 A Case 4 (device type 03) 0.5 A Power dissipation (PD): TC= +25C: Device type 01, case M 18 W De
18、vice type 01, cases N and Y 20 W Device type 01, cases T, U, Z, 5, and 6 . 15 W Device types 01 and 03, cases X and 2 . 2 W Device type 03, case 4 . 2 W TA= +25C: Device type 01, cases M, T, U, and Z 3.0 W Device type 01, case N 15.0 W Device types 01 and 03, cases X and 2 . 1.0 W Device type 01, ca
19、se Y 4.3 W Device type 02, case P 1050 mW 4/ Device type 02, case 2 . 1375 mW 5/ Device type 03, case 4 1.0 W Device type 01, case 5 1.7 W Device type 01, case 6 1.3 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Case temperature, case outline 2 (soldering
20、, 10 seconds): Device type 02 +260C Junction temperature (TJ) +150C 6/ Thermal resistance, junction-to-case (JC): Case M 6.7C/W Cases N and T 3.5C/W Cases P, 2, and 4 . See MIL-STD-1835 Case U . 4.2C/W Case X 15C/W Case Y 3C/W Case Z 6C/W Case 5 5.1C/W Case 6 3.6C/W 3/ The 43 volt input rating refer
21、s to the ability of the regulator to withstand high line or transient conditions without damage. Since the regulators maximum current capability is reduced, the output may fall out of regulation at high input voltages under nominal loading. 4/ Derate at 8.4 mW/C above TA= +25C. 5/ Derate at 11.0 mW/
22、C above TA= +25C. 6/ The device is protected by thermal shutdown circuit which is designed to turn off the output transistor whenever the device junction temperature is in excess of +150C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR
23、OCIRCUIT DRAWING SIZE A 5962-87782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 4 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings Continued. Thermal resistance, junction-to-ambient (JA): Device type 01, cases M, T, U, and Z 42C/W Device types 01 and 03, cases N, X, and 2
24、 . 120C/W Device type 01, case Y . 29C/W Device type 02, case P . 110C/W Device type 02, case 2 . 65C/W Device type 03, case 4 . 120C/W Device type 01, case 5 . 60C/W Device type 01, case 6 . 80C/W 1.4 Recommended operating conditions. Input voltage range (VIN) . +8 V dc to +25 V dc Ambient operatin
25、g temperature range (TA) . -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si)/s) . 300 Krads (Si) 7/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this
26、drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-ST
27、D-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at h
28、ttps:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes prece
29、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 7/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters
30、 are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL
31、 L SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
32、 (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow a
33、s documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PR
34、F-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2
35、 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient op
36、erating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be m
37、arked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the
38、“5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to id
39、entify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior
40、 to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each l
41、ot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity reta
42、in the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
43、ING SIZE A 5962-87782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Output volt
44、age VOUTTA= +25C 1 01, 03 4.92 5.08 V M,D,P,L,R,F 1 01 4.92 5.08 TA= +25C 1 02 4.8 5.2 VIN= 7.5 V to 20 V 4/ 1,2,3 01, 03 4.85 5.15 M,D,P,L,R,F 1 01 4.85 5.15 VIN= 8.0 V to 20 V 4/ 1,2,3 02 4.7 5.3 Ripple rejection 5/ VIN/ f = 120 Hz, 4 01, 03 68 dB VOUTVIN= 8 V to 18 V 5,6 6/ 60 f = 120 Hz, IOUT= 1
45、00 mA, 4,5,6 6/ 02 62 VIN= 8 V to 18 V f = 120 Hz, IOUT= 300 mA, 4 6/ 62 VIN= 8 V to 18 V Line regulation VRLINEVIN= 7.5 V to 20 V, 5/ 7/ 1 01, 03 5 mV -55C TJ +125C 2,3 12 M,D,P,L,R,F 1 01 5 VIN= 8.0 V to 12 V, 5/ 7/ 1 01, 03 4 -55C TJ +125C 2,3 10 M,D,P,L,R,F 1 01 4 VIN= 7.0 V to 25 V, TA= +25C 1
46、02 50 VIN= 8.0 V to 20 V, TA= +25C 1 25 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87782 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL L SHEET 7 DSCC FORM
47、2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Dropout voltage VDOVOUT= 100 mV, 8/ IO= 1.0 A 1 01, 03 2.5 V M,D,P,L,R,F 1 01 2.5 VOUT= 100 mV, 9/ IO= 5
48、00 mA 1 01, 03 2.5 IO= 350 mA, TA= +25C 1 02 2.5 Load regulation 5/ VRLOADIO= 5.0 mA to 1.5 A, 8/ -55C TJ +125C 1 01, 03 12 mV M,D,P,L,R,F 1 01 12 IO= 5.0 mA to 1.0 A, 8/ -55C TJ +125C 2,3 01, 03 25 IO= 250 mA to 750 mA, 8/ 1 01, 03 6 -55C TJ +125C 2,3 15 M,D,P,L,R,F 1 01 6 IO= 5.0 mA to 500 mA, 9/ 1 01
