1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Figure 1, change to side braze package outline. Correct the maximum dimension for E1 and S. Editorial changes throughout. 89-01-10 M. A. Frye B Changed to reflect MIL-H-38534 processing. Corrections to table I and figures 1 and 2. Editorial chang
2、es throughout. 92-01-13 Alan Barone C Changes in accordance with NOR 5962-R009-93. 92-11-03 Kendall A. Cottongim D Update drawing boilerplate. 02-06-28 Raymond Monnin E Figure 1; case outline X, change dimension “R“ to “A“. Editorial changes trhoughout. -sld 07-01-25 Joseph Rodenbeck THE ORIGINAL FI
3、RST PAGE OF THE DRAWING HAS BEEN REPLACED REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Donald R. Osborne DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. H. Johnson COLUMBUS, OHIO 43218-3990
4、http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, HYBRID, LINEAR, QUAD, 12-BIT, DIGITAL-TO-ANALOG CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-09-26 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 59
5、62-88509 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E201-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234
6、 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be
7、as shown in the following example: 5962-88509 01 X X Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD390S Quad 12 bit DAC (bipol
8、ar) 02 AD390T Quad 12 bit DAC (bipolar) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 28 Dual-in-line 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
9、 1.3 Absolute maximum ratings. 1/ VCCto DGND range . 0 V dc to +18 V dc VEEto DGND range 0 V dc to -18 V dc Digital inputs (pins 1-12 and 23-28) to DGND -1.0 V dc to +7 V dc VREFINto AGND VEEto VCCAGND to DGND. 0.6 V Outputs (pins 16, 18, 19, 20, 21): Shorted to AGND or DGND Indefinite Shorted to (V
10、CCor VEE). Momentary Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds). +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) . 8C/W Thermal resistance, junction-to-ambient (JA) 25C/W 1.4 Recommended operating conditions. VCCto DGND . +15 V dc 10% V
11、EEto DGND -15 V dc 10% VREFINto AGND +10 V dc Ambient operating temperature range (TA) -55C to +125C _ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot
12、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and
13、handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcir
14、cuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard
15、 Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict
16、 between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item perfor
17、mance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the te
18、sts and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534
19、 shall be met for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2
20、.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) data shall be as specified on figure 3. 3.2.4 Timing waveform(s). The timing waveform(s) shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless
21、 otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tes
22、ts for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. Provided by IHSNot for ResaleNo r
23、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the
24、 manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those whi
25、ch, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to sup
26、ply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provi
27、ded with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not a
28、ffect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufact
29、urer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-
30、STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by I
31、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Sy
32、mbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max Unit 1 Pins 1 through 12 2, 3 2/ All 2.0 Input voltage (high) VIHPins 23 through 28 3/ 1, 2, 3 2/ All 2.0 V 1 Pins 1 through 12 2, 3 2/ All 0.8 Input voltage (low) VILPins 23 through 28 3/ 1, 2, 3 2/ Al
33、l 0.8 V 1 VIN= +5 V Pins 1 through 12 2, 3 2/ All 1200 Input current (high) IIHVIN= +5 V Pins 23 through 28 1, 2, 3 2/ All 1200 A 1 VIN= 0 V Pins 1 through 12 2, 3 2/ All 400 Input current (low) IILVIN= 0 V Pins 23 through 28 1, 2, 3 2/ All 400 A Output voltage range VOUTExternal +10.000 V ref 4/ 1,
34、 2, 3 All -10 +10 V Gain error Ae External +10.000 V ref BC = 111111111111 End-point electrical 4 4 4 01 02 All -.1 -.05 -.2 +.1 +.05 +.2 % FSR 5/ Gain error temperature coefficient TC/Ae External +10.000 V ref BC = 111111111111 5,6 5,6 01 02 -10 -5 +10 +5 ppm/ C Offset error VOSExternal +10.000 V r
35、ef BC = 000000000000 End-point electrical 1 1 1 01 02 All -.05 -.025 -.1 +.05 +.025 +.1 % FSR 5/ See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLU
36、MBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max Unit Bipolar zero temperature coefficient TC/BPZ
37、VBPFS= 10 V 6/ 2,3 2,3 01 02 -10 -5 +10 +5 ppm /C Differential linearity error DLE 7/ End-point electrical 1 1 2,3 1 01 02 All All -.75 -.5 -1 -1 +.75 +.5 +1 +1 LSB Integral linearity error 8/ LE End-point electrical 1,2,3 1,2,3 1 01 02 All -.75 -.5 -1 +.75 +.5 +1 LSB VCC1, 2, 3 All +13.5 +16.5 Powe
38、r supply voltages VEE 4/ 1, 2, 3 All -16.5 -13.5 V 1 -100 0 Power supply current (negative) IEEData input bits 111111111111 no load 2,3 2/ All -120 0 mA 1 35 Power supply current (positive) ICCData input bits 111111111111 no load 2,3 2/ All 35 mA 1 -.006 +.006 Power supply gain sensitivity gain/ VS(
39、VCCand VEE) PSRR Data input bits 111111111111 VS= 15 V 10% 2,3 2/ All -.006 +.006 % FS per % Functional tests See 4.3.1b 7,8 All Chip select pulse width 2/ tAW See figure 4 9,10,11 All 100 ns Address select low time 2/ tWP See figure 4 9,10,11 All 100 ns See footnotes at end of table. Provided by IH
40、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Lim
41、its Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Min Max Unit Data valid before 0A rising edge 2/ tDW See figure 4 9,10,11 All 50 ns Data valid after 0A rising edge 2/ tDH See figure 4 9,10,11 All 10 ns Chip select valid before 1A low 2/ tAS See fi
42、gure 4 9,10,11 All 0 ns Settling time 2/ tSETT See figure 4 9,10,11 All 8 s 1/ VCC= +15 V, VEE= -15 V. 2/ Parameter shall be tested as part of device initial characterization and after design and process changes. Parameter shall be guaranteed to the limits specified in table I for all lots not speci
43、fically tested. 3/ The maximum limit for pin 24 is three times the specified maximum limit for pins 23, 25, 26, 27, and 28. 4/ Verified as test condition while testing other parameters. 5/ Full scale range = 20 V for a 10 V bipolar range. Full scale range = 10 V for a 0 V to +10 V unipolar range. 6/
44、 Bipolar zero = (BC = 100000000000) - (BC = 000000000000). 7/ Monotonicity is tested over the full military temperature range. 8/ Integral nonlinearity is a measure of the maximum deviation from a straight line passing through the end points of the transfer function. Provided by IHSNot for ResaleNo
45、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88509 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 Case outline X. Inches Millimeters Symbol Min Max Min Max Notes A .225 5.72 b .014
46、 .023 0.36 0.58 b1 .030 .070 0.76 1.78 2 c .008 .015 0.20 0.38 D 1.414 35.92 E .580 .610 14.73 15.49 E1.590 .620 14.99 15.75 6 e .100 BSC 2.54 BSC 4, 7 L .120 .200 3.05 5.08 L1.180 4.57 Q .015 .075 0.38 1.90 3 S .098 2.49 5 S1 .005 0.13 5 NOTES: 1. Index area; a notch or a lead one identification ma
47、rk is located adjacent to lead one. 2. The minimum limit for dimension b1 may be .023 (0.58 mm) for all four corner leads only. 3. Dimensions Q shall be measured from the seating plane to the base plane. 4. The basic pin spacing is .100 (2.54 mm) between centerlines. 5. Applies to all four corners.
48、6. E1shall be measured at the center line of all the leads (at stand off). 7. Twenty-six spaces. 8. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outline (all device types). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
