1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A The 01FX and 02FX devices are inactive for new designs. Editorial changes throughout. 91-04-19 M.A. Frye B Changes in accordance with NOR 5962-R164-92. 92-03-23 Michael.A. Frye C Updated boilerplate paragraphs. glg 10-11-23 Charles Saffle THE ORI
2、GINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Monica L. Grosel DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-39
3、90 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUITS, MEMORY, DIGITAL, BIPOLAR, 512 X 4-BIT PROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 14 March 1988 AMSC N/A REVISION LEVEL C SIZE A CAGE
4、 CODE 67268 5962-88541 SHEET 1 OF 14 DSCC FORM 223 APR 97 5962-E093-11 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88541 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM
5、 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-88541 | | D
6、rawing Number 01 | | Device type (see 1.2.1) F | | Case outline (see 1.2.2) X | | Lead finish (see (1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 1/ Circuit function Access time 01 (see 6.6) 512 x 4-bit bipolar PROM (three-
7、state) 40 ns 02 512 x 4-bit bipolar PROM (three-state) 60 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat package 2
8、CQCC1-N20 20 square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range -0.5 V dc to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipa
9、tion (PD) per device 2/ 715 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) 3/ See MIL-STD-1835 Junction temperature (TJ) 175C DC voltage applied to outputs (except during programming) . -0.5 V dc to +5.5 V dc maximum DC voltage applied to outputs during p
10、rogramming . 21 V dc Output current into outputs during programming (maximum duration of 1 second) . 250 mA DC input current -30 mA to +5.0 mA 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to +5.5 V dc maximum Minimum high-level input voltage (VIH) 2.0 V dc Max
11、imum low-level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document. 2/ Must withstand the added PDdue to short circuit test; e.g., IOS. 3/ Heat sin
12、king is recommended to reduce the junction temperature. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88541 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2.
13、APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DE
14、PARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL
15、-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.
16、) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREME
17、NTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer o
18、r a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) p
19、lan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML
20、flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table. The trut
21、h table shall be as specified on figure 2. 3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices shall be as specified on figure 2. 3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing. 3.2.3 Logic diagram. The logic diagram shal
22、l be as specified on figure 3. 3.2.4 Switching test circuit. The switching test circuit shall be as specified on figure 4. 3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 5. 3.2.6 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. Provid
23、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88541 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Cond
24、itions -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Group A Subgroups Device types Limits Unit Min Max Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA VIH= 2.0 V, VIL= 0.8 V 1, 2, 3 All 2.4 V Output low voltage VOLVCC= 4.5 V, IOL= 16 mA VIH= 2.0 V, VIL= 0.8 V 1, 2, 3 0.45 V Input high le
25、vel current IIHVCC= 5.5 V, VIN= 2.7 V 1, 2, 3 25 uA Input low level current IILVCC= 5.5 V, VIN= 0.45 V 1, 2, 3 -250 uA Power supply current ICCVCC= 5.5 V, VIN= 0.0 V 1, 2, 3 130 mA Input clamp voltage VIVCC= 4.5 V, VIN= -18 mA 1, 2, 3 -1.2 V High output leakage current IOZHVCC= 5.5 V VCS= 2.4 V VIH=
26、 2.0 V VIL= 0.8 V VO= 4.5 V 1, 2, 3 40 uA IOZLVO= 0.4 V -40 Output short circuit current IOSVCC= 5.5 V VOUT= 0.0 V 1/ 1, 2, 3 -20 -90 mA Functional tests See 4.3.1d 7, 8 Address access time tAVQVCL= 50 pF S1 is closed (See figures 4 and 5) 9, 10, 11 01 40 ns 02 60 Enable access time tGVQV(See figure
27、s 4 and 5) 2/ 9, 10, 11 01 25 ns 02 30 Enable recovery time tGVQZ(See figures 4 and 5) 2/ 9, 10, 11 01 25 ns 02 30 1/ Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed one second. 2/ tGVQVis tested with CL= 50 pF to the 1.5 V level
28、; S1 is open for high impedance to high tests and closed for high impedance to low tests. tGVQZis tested with CL= 5 pF. High to high impedance tests are made with S1 open to an output voltage of VOH-0.5 V. Low to high impedance tests are made with S1 closed to the VOL+0.5 V level. Provided by IHSNot
29、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88541 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein
30、, the electrical performance characteristics are as specified in table I and apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in
31、table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, th
32、e manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certific
33、ation mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used 3.6 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the manufacturer or the user to result in a wide variety of PROM configurations, two processing options are
34、provided for selection in the contract, using an altered item drawing. 3.6.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program con
35、figuration. 3.6.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery. 3.7 Certificate of compliance. A certificate of com
36、pliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meet
37、s the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.9 Notification of change. Notification of c
38、hange to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.10 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation.
39、Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883
40、, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control and s
41、hall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical
42、 test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SI
43、ZE A 5962-88541 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following addition
44、al criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of gro
45、up A, subgroups 9, 10, and 11. Either of two techniques is acceptable. (1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability and performance without programming the user array. If this is done, the resulting test pattern shall be
46、verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the sampling plan specified in MIL-STD-883, method 5005. (2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy programmability requirements prior to performin
47、g subgroups 9, 10, and 11. Twelve devices shall be submitted to programming (see 3.2.2.2). If more than two devices fail to program, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than four total device failures allowed. Ten devic
48、es from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than two total devices fail, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than four total device failures allowable. d. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1)
