1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add test circuits in figure 4. Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG 05-06-22 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-09-26 Thomas M. Hess
2、REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY James E. Nicklaus DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AG
3、ENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, ANALOG MULTIPLEXER/DEMULTIPLEXER, DOUBLE-POLE FOUR POSITION, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-05-16 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88556
4、SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E527-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1
5、.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88556 01 E A Drawing number Device type
6、(see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HC4052 Analog multiplexer/demultiplexer, double-pole, four-position 1.2.2 Case outline(s). The case outline(s)
7、 are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC)
8、 -0.5 V dc to +7.0 V dc Supply voltage range (VCC-VEE) . -0.5 V dc to +11.0 V dc Supply voltage range (VEE) +0.5 V dc to -7.0 V dc DC input diode current (IIK): (VIVCC+ 0.5 V dc) 20 mA DC output diode current (IOK): (VIVCC+ 0.5 V dc) 20 mA DC switch current: (VI VEE 0.5 V dc or VI VCC+ 0.5 V dc) 25
9、mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1/ Stresses above the ab
10、solute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full s
11、pecified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO
12、 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) . +2.0 V dc to +6.0 V dc Supply voltage range (VEE) . 0.0 V dc to -6.0 V dc Supply voltage range (VCC-VEE) +2.0 V dc to +10.0 V dc DC input voltage, digital inputs (VI) . 0.0 V
13、 dc to VCCDC input voltage, analog inputs (VIS) VEEto VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf) : VCC= 2.0 V . 0 to 1000 ns VCC= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks.
14、The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufa
15、cturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard M
16、icrocircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of t
17、his document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS De
18、vices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herei
19、n, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for
20、 non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in
21、accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of
22、 the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
23、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and
24、 herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Functional diagram. The functional diagram shall
25、 be as specified on figure 3. 3.2.5 Switching waveforms and test circuits. The switching waveforms and test circuits shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table
26、I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF
27、-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the d
28、evice. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the
29、QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as a
30、n approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircu
31、its delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to
32、 review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-
33、88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC+125C VEE= 0 V dc unless otherwise specified Device type Group A subgroups Limits Unit Min Max High level input
34、voltage VIHVCC= 2.0 V All 1, 2, 3 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low level input voltage VILVCC= 2.0 V All 1, 2, 3 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 “ON” resistance RONVIS= VEEor VCCVI= VIHor VILIS 1.0 mA VCC= 4.5 V VEE= 0.0 V All 1 160 2, 3 240 VCC= 4.5 V VEE= -4.5 V 1 1202, 3 180 Peak “ON”
35、 resistance RON(peak) VIS= VEEor VCCVI= VIHor VILIS 1.0 mA VCC= 4.5 V VEE= 0.0 V All 1 200 2, 3 300 VCC= 4.5 V VEE= -4.5 V 1 1302, 3 195 Control input leakage current IINVI= VCCor GND VCC= 6.0 V All 1, 2, 3 1.0 A Switch “ON/OFF” leakage current (4 channels) IIZVI= VIHor VILVOS= VCCor VEEVIS= VCCor G
36、ND VCC= 6.0 V VEE= 0.0 V All 1, 2, 3 2.0 A VIS= VIHor VILVCC= 5.0 V VEE= -5.0 V All 1, 2, 3 1.0 Quiescent supply current ICCVI= VCCor GND IO= 0.0 mA VCC= 6.0 V VEE= 0.0 V All 1, 2, 3 160 A VCC= 5.0 V VEE= -5.0 V 320 Input capacitance CINTC= +25C, see 4.3.1c All 4 10 pF Functional tests See 4.3.1d Al
37、l 7 Propagation delay time, switch IN to OUT 2/ tPHL, tPLHCL= 50 pF 10% See figure 4 VCC= 2.0 V All 9 60 ns 10, 11 90 VCC= 4.5 V 9 12 10, 11 18 VCC= 6.0 V 9 10 10, 11 15 Propagation delay time, channel select to switch output (switch turn “OFF”) 2/ tPHZ, tPLZCL= 50 pF 10% See figure 4 VCC= 2.0 V All
38、 9 250 ns 10, 11 375 VCC= 4.5 V 9 50 10, 11 75 VCC= 6.0 V 9 43 10, 11 65 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 RE
39、VISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test conditions 1/ -55C TC+125C VEE= 0 V dc unless otherwise specified Device type Group A subgroups Limits Unit Min Max Propagation delay time, channel select to switch output (switch
40、 turn “ON”) 2/ tPZL, tPZHCL= 50 pF 10% See figure 4 VCC= 2.0 V All 9 325 ns 10, 11 490 VCC= 4.5 V 9 65 10, 11 98 VCC= 6.0 V 9 55 10, 11 83 1/ For a power supply of 5.0 V 10%, the worst case “ON” resistance (RON) occur at VCC= 4.5 V. Thus, the 4.5 V values should be used when designing with this supp
41、ly. Worst case VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. (The VIHvalue at 5.5 V is 3.85 V). The worst case leakage currents (IIN, ICC, and IIZ) occur for CMOS at the higher voltage so the 6.0 V value should be used. Power dissipation capacitance (CPD), typically 80 pF, determines the no
42、-load dynamic power consumption (PD) and the no-load dynamic current consumption (IS). Where: PD= CPDVCC2f + ICCVCCIS= CPDVCCf + ICCf is the frequency of the input signal. 2/ AC testing at VCC= 2.0 V and VCC= 6.0 V shall be guaranteed, if not tested, to the specified parameters. Device type All Case
43、 outline E Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 B0* B2* Bn* B3* B1* E VEEGND S1 S0 A3* A0* An* A1* A2* VCC* Channel IN/OUT. * Common OUT/IN. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
44、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs Enable S1 S0 “ON” channels L L L A0, B0 L L H A1, B1 L H L A2, B2 L H H A3, B3 H X X None H = High voltage level L = Low voltage level X
45、= Irrelevant FIGURE 2. Truth table. FIGURE 3. Functional diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234
46、APR 97 FIGURE 4. Switching waveforms and test circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88556 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4.
47、VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The foll
48、owing additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final elec
