DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

上传人:inwarn120 文档编号:699302 上传时间:2019-01-01 格式:PDF 页数:14 大小:95.15KB
下载 相关 举报
DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf_第1页
第1页 / 共14页
DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf_第2页
第2页 / 共14页
DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf_第3页
第3页 / 共14页
DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf_第4页
第4页 / 共14页
DLA SMD-5962-88646 REV G-2008 MICROCIRCUIT LINEAR ADJUSTABLE POSITIVE LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf_第5页
第5页 / 共14页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 69210. Add case outline U. Editorial changes throughout. 90-09-24 W. J. JOHNSON B Add case outline N. Editorial changes throughout. 96-01-16 M. A. FRYE C Make change to the JAlimit for case X under paragraph 1.3. Make correction t

2、o the case X terminal connections under Figure 2. Changes in accordance with NOR 5962-R104-96. 96-04-29 M. A. FRYE D Update dimensions A, E, S, and S1 for case outline N. Update boilerplate. Redrawn. - rrp 98-03-04 R. MONNIN E Add radiation hardened requirements. - ro 00-04-03 R. MONNIN F Make chang

3、es to case outline N. Add case outlines M and T. Make changes to 1.2.3, 1.3, figure 1, and figure 2. - rrp 02-02-11 R. MONNIN G Drawing updated to reflect current requirements. - ro 08-10-23 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV G G G G

4、 G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY CHARLES E. BESORE CHECKED BY D. H. JOHNSON DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY A

5、LL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-11-23 MICROCIRCUIT, LINEAR, ADJUSTABLE, POSITIVE, LOW DROPOUT, VOLTAGE REGULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 5962-88646 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E473-08 Provided

6、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirem

7、ents for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 L 88646 01 U A Federal stock class designator RHA designator (see 1.2.1) Device type (se

8、e 1.2.2)Case outline (see 1.2.3)Lead finish (see 1.2.4) / / Drawing number 1.2.1 RHA designator. RHA marked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Dev

9、ice type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1085, 1850 3.0 A positive regulator, adjustable 1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator

10、Terminals Package style M See figure 1 3 Flange mount, glass sealed, with gull wings N CBCC2-N3 3 Bottom terminal chip carrier T CBCC1-N3 3 Bottom terminal chip carrier U See figure 1 3 TO-257 flange mount, with isolated tab and glass sealed X MBFM1-P2 2 TO-3 can 1.2.4 Lead finish. The lead finish i

11、s as specified in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.3 A

12、bsolute maximum ratings. Input to output voltage differential . 35 V dc Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C Power dissipation (PD) Internally limited Thermal resistance, junction-to-case (JC): Case M 6.3C/W Case

13、 N 6C/W Case T 2.8C/W Case U 3.5C/W Case X 3.0C/W Thermal resistance, junction-to-ambient (JA): Case M 60C/W Case N 3.5C/W Case T 80C/W Case U 42C/W Case X 35C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C Output current (IOUT) 2.0 A Input to output

14、 voltage differential . 25 V dc 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads (Si) / s) 50 Krads 1/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the

15、 extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test M

16、ethod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.da

17、ps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted para

18、meters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

19、REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a speci

20、fic exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing

21、 (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow a

22、s documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PR

23、F-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2

24、.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the elect

25、rical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in ta

26、ble I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the

27、manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certificat

28、ion mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of complian

29、ce submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A

30、shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review

31、 the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 D

32、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reference voltage VREF(VIN-

33、VOUT) = 3.0 V, 1 01 1.238 1.262 V IOUT= 10 mA M,D,P,L 3/ 1 1.238 1.262 1.5 V (VIN-VOUT) 25 V, 4/ 1, 2, 3 1.225 1.270 10 mA IOUT 2.0 A 5/ 1.220 1.270 M,D,P,L 3/ 1 1.220 1.270 Line regulation 6/ VOUT/ 1.5 V (VIN-VOUT) 15 V, 1 01 0.2 % VINIOUT= 10 mA M,D,P,L 3/ 1 0.2 15 V (VIN-VOUT) 35 V, IOUT= 10 mA 2

34、, 3 0.5 Load regulation 6/ VOUT/ (VIN- VOUT) = 3.0 V, 4/ 1 01 0.3 % IOUT10 mA IOUT 2.0 A 5/ 0.8 M,D,P,L 3/ 1 0.8 4/ 2, 3 0.4 5/ 1.0 Dropout voltage VDOIOUT= 2.0 A, VREF= 1% 1, 2, 3 01 1.5 V M,D,P,L 3/ 1 1.5 Thermal regulation - 30 ms pulse, TA= 25C 1 01 0.02 %/W M,D,P,L 3/ 1 0.02 Ripple rejection VI

35、N/ VOUT4, 5, 6 01 60 dB f = 120 Hz, CADJ= 25 F, COUT= 25 F (tantalum), IOUT= 2.0 A, (VIN- VOUT) = 3.0 V M,D,P,L 3/ 4 60 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEF

36、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Adjustment pin cur

37、rent IADJ1.5 V (VIN-VOUT) 25 V, 10 mA IOUT 2.0 A 1, 2, 3 01 120 A M,D,P,L 3/ 1 120 Minimum load current IMIN(VIN- VOUT) = 24 V 1, 2, 3 01 10 mA M,D,P,L 3/ 1 10 Current limit ILIM(VIN- VOUT) = 5.0 V 1, 2, 3 01 3.2 A M,D,P,L 3/ 1 3.2 (VIN- VOUT) = 25 V 1,2,3 0.2 M,D,P,L 3/ 1 0.2 Temperature 7/ stabili

38、ty VOUT/ T -55C TJ +125C 1, 2, 3 01 1.5 % Long term 7/ stability VOUT/ T TA= +125C, t = 1,000 hrs 2 01 1.0 % 1/ RHA devices supplied to this drawing have been characterized through all levels M, D, P, L of irradiation. However, this device is only tested at the “L” level. Pre and Post irradiation va

39、lues are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the note

40、d parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ Case U only. 4/ Case X only. 5/ Cases M, N, T, and U only. 6/ Line and load regulation are measured at a constant junction temperature using a low duty cycle pulse technique. Although power dis

41、sipation is internally limited, regulation is guaranteed up to the maximum power dissipation of 30 W. Power dissipation is determined by the input/output differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input/output voltage range.

42、7/ If not tested, shall be guaranteed to the limits specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G

43、 SHEET 7 DSCC FORM 2234 APR 97 Case outline M Symbol Inches Millimeters Min Max Min Max A .190 .210 4.83 5.33 b - .030 - 0.76 D .410 .430 10.41 10.92 D1 .580 .610 14.73 15.49 e - .100 - 2.54 e1 - .200 - 5.08 E .410 .420 10.41 10.67 L1 .090 .110 2.29 2.79 L .115 .125 2.92 3.18 N 3 3 NOTE: The U.S. go

44、vernment preferred system of measurement is the metric SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlines. Provided by

45、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Case outline U Inches mm .005 0.13 .010 0.25 .020 0.51 Inches

46、 Millimeters Symbol Min Max Min Max A .190 .200 4.83 5.08 A1.035 .045 0.89 1.14 A2.120 BSC 3.05 BSC b .025 .035 0.64 0.89 D .645 .665 16.38 16.89 D1.410 .430 10.41 10.92 D3.000 .065 0.00 1.65 e .100 BSC 2.54 BSC E .410 .422 10.41 10.71 L .500 .750 12.70 19.05 O .527 .537 13.39 16.64 P .140 .150 3.56

47、 3.81 NOTE: The US government preferred system of measurement is the metric SI system. However, this item was originally designed using inch-pound units of measurement. In the event of conflict between the metric and inch-pound units, the inch-pound units shall take precedence. FIGURE 1. Case outlin

48、es Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88646 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 Case U 1. ADJUST 2. VOUT3. VINDevice type 01 Case outlines N M T Terminal number Terminal symbol 1 ADJUSTMENT ADJUS

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1