1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R036-96. drw 96-01-11 Michael A. Frye B Incorporate rev. A NOR. Update drawing to current requirements. drw 04-03-25 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET
2、REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENT
3、S APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, CMOS, 8-BIT, MICROPROCESSOR COMPATIBLE, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-05-30 A/D CONVERTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88650 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-
4、E145-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes
5、 device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88650 01 R A Drawing number Device type (see 1.2.1) Case outline (see 1.
6、2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function Total unadjusted error 01 AD7820U CMOS 8-bit ADC with T/H 0.5 LSB 02 AD7820T CMOS 8-bit ADC with T/H 1.0 LSB 1.2.2 Case outlines. The case outlines
7、are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line 2 CQCC1-N20 20 square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum r
8、atings. 1/ Supply voltage to ground (VDD) 0 V dc to +7.0 V dc Digital input voltage -0.3 V dc to VDDDigital output voltage -0.3 V dc to VDDPositive reference voltage VREF- to VDDNegative reference voltage 0 V dc to VREF+ Input voltage (VIN). -0.3 V dc to VDDStorage temperature range -65C to +150C Le
9、ad temperature (soldering, 10 seconds) +300C Power dissipation (PD) . 450 mW 2/ Thermal resistance, junction-to-case (JC): Cases R and 2 See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Cases R and 2 120C/W Junction temperature (TJ) +150C 1.4 Recommended operating conditions. Supply vo
10、ltage range (VDD) +4.75 V dc to +5.25 V dc Positive reference voltage (VREF+). +5.0 V dc Negative reference voltage (VREF-) 0 V dc Ground potential (GND). 0 V dc Ambient operating temperature range (TA) . -55C to +125C 1/ All voltages are with respect to ground. 2/ Derate above TA= +75C at 6.0 mW/C.
11、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specificat
12、ion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards
13、(DoDISS) and supplement thereto, cited in the solicitation. 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those ci
14、ted in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlin
15、es. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk,
16、700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulation
17、s unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manu
18、facturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535.
19、 This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accord
20、ance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in acc
21、ordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambie
22、nt operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
23、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Dev
24、ice type Limits Unit Min MaxResolution RES This is the minimum resolution for which no missing codes are guaranteed 1, 2, 3 All 8.0 LSB Total unadjusted error TUE 3/ 1 01 1 LSB 2, 3, 12 0.5 1, 2, 3 02 1 Analog input leakage current IIN1, 2, 3 All 3.0 A Analog input capacitance CIASee 4.3.1c, TA= +25
25、C 4 All 60 pF Reference input resistance RIN1, 2, 3 All 1.0 4.0 k Digital input high level voltage VIHCS , WR and RD inputs (pin 7) 1, 2, 3 All 2.4 V Mode input 3.5 Digital input low level voltage VILCS , WR and RD inputs (pin 7) 1, 2, 3 All 0.8 V Mode input 1.5 Digital input high current IIHCS and
26、RD inputs 1, 2, 3 All 1.0 A WR input 3.0 Mode input (pin 7) 200 Digital input low current IILCS , WR , RD and mode inputs (pin 7) 1, 2, 3 All -1.0 A Digital input capacitance CIDCS , WR , RD and mode inputs, See 4.3.1c, TA= +25C 4 All 8.0 pF Digital output high level voltage VOHDB0 DB7, OFL , and IN
27、T outputs, ISOURCE= 360 A 1, 2, 3 All 4.0 V Digital output low level voltage VOLDB0 DB7, OFL , and INT outputs, ISINK= 1.6 mA 1, 2, 3 All 0.4 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
28、NG SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Mi
29、n MaxFloating state leakage current IOUTDB0 DB71, 2, 3 All 3.0 A Digital output capacitance COUTSee 4.3.1c, TA= +25C 4 All 8.0 pF Supply current from VDDIDDCS = RD = 0 V 1, 2, 3 All 20.0 mA Power supply sensitivity PSS VDD= 5 V 5% 1, 2, 3 All .25 LSB CS to RD / WR setup time tCSS6/, 7/ 9, 10, 11 All
30、 0 ns CS to RD / WR hold time tCSH6/, 7/ 9, 10, 11 All 0 ns CS to RDY delay tRDYCL= 50 pF, 9 All 70 ns Pull-up resistor = 2.0 k 6/, 7/ 10, 11 100 Conversion time tCRDSee figure 3. 7/ 9 All 1.6 s( RD mode) 10, 11 2.5 Data access time tACCO4/, 7/ 9 All 1.62 s( RD mode) 10, 11 2.55 RD to INT delay tINT
31、HCL= 50 pF 7/ 9 All 175 ns( RD mode) 10, 11 225 Data hold time tDH5/, 6/, 7/ 9 All 60 ns10, 11 100 Delay time between conversion tP6/, 7/ 9 All 500 ns10, 11 600 Write pulse width tWR6/ 9, 10, 11 All 0.6 50 s Delay time between tRD6/ 9 All 600 nsWR and RD pulses 10, 11 700 See footnotes at end of tab
32、le. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristic
33、s - continued. Test Symbol Conditions 1/ 2/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxData access time tACC14/, 6/ 9 All 160 ns ( WR / RD mode) 10, 11 250 RD to INT delay tR16/ 9 All 140 ns10, 11 225 WR to INT delay tINTLCL= 50 pF 6/ 9 All 1.0 s10, 11
34、1.7 Data access time tACC24/, 6/ 9 All 70 ns( WR / RD mode) 10, 11 110 WR to INT delay tIHWRCL= 50 pF 6/ 9 All 100 ns(Stand alone operation) 10, 11 150 Data access time after INT tID6/ 9 All 50 ns(Stand alone operation) 10, 11 75 1/ VDD= +5.0 V; VREF(+) = +5.0 V; VREF(-) = GND = 0 V unless other wis
35、e specified. Specifications apply for RD mode (pin 7 = 0 V). 2/ All input control signals are specified with tr= tf= 20 ns (10 percent to 90 percent of +5.0 V) and timed from a voltage level of 1.6 V. 3/ Includes gain error, offset error and linearity error. 4/ Measured with load circuits of figure
36、2 and defined as the time required for an output to cross 0.8 V to 2.4 V. 5/ Defined as the time required for the data lines to change 0.5 V when loaded with the circuits of figure 2 and is measured only for the initial test and after process or design changes which may affect tDH. 6/ Refer to timin
37、g diagrams of figure 3. These parameters, if not tested, shall be guaranteed to the limits specified in table I. 7/ Refer to timing diagram of figure 3 ( RD mode). These parameters are tested to subgroup 9 under group A test requirements. Provided by IHSNot for ResaleNo reproduction or networking pe
38、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device types All Case outlines R and 2 Terminal number Terminal symbol 1 VIN2 DB0(LSB)3 DB1 4 DB2 5 DB3 6 WR /R
39、DY 7 MODE8 RD 9 INT 10 GND11 VREF- 12 VREF+ 13 CS 14 DB4 15 DB5 16 DB6 17 DB7(MSB) 18 OPL 19 NC20 VDDFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER
40、 COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 2. Output load circuits. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS
41、, OHIO 43216-5000 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Mode timing waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
42、 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 FIGURE 3. Mode timing waveforms - continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88650 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REV
43、ISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not f
44、easible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be r
45、eplaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.
46、6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as
47、required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquirin
48、g activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted
