1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device types 03 and 04. Technical changes to 1.3 and table I. Changes to table III, and changes to reflect MIL-H-38534 processing. Editorial changes throughout. 90-10-10 G. Lude B Made correction to the lead length on figure 2 for case outl
2、ine Y. Editorial changes throughout. 91-11-25 G. Lude C Add case outline Z. Make technical changes to table I. Change dimensions for case outlines X and Y. Make technical changes to figure 2, terminal connections. Editorial changes throughout. 93-03-10 K. Cottongim D Add case outline T. Make changes
3、 to paragraph 1.4. Make technical changes to table I. Changed package height for case outline X from .25 inches to .20 inches. Made corrections to the terminal connections. 93-07-27 K. Cottongim E Changes in accordance with NOR 5962-R077-94. 93-12-22 K. Cottongim F Changes in accordance with NOR 596
4、2-R036-95. 94-11-16 K. Cottongim G Changes in accordance with NOR 5962-R119-95. 95-04-27 K. Cottongim H Correct case outline T package height dimension from .150 inches to .145 inches. Make changes to table I. 97-03-04 K. A. Cottongim J Figure 1, create individual diagrams for case outlines T and Y.
5、 00-07-18 Raymond Monnin K Table I, device type 03, correct maximum limits for ICC2and ICC3. 00-08-28 Raymond Monnin L Add Vendor Cage code 88379. Figure 1, case outline Y, change dimension A max. from .186“ to .225“. Figure 1, case outline X, correct dimension L, min. from .024“ to .240“ and Max. f
6、rom .026“ to .260“. Figure 2, terminal connections for device types 01 through 03, case outlines Y and T, correct pin 39 to TX/RX-B and pin 40 to TX/RX-B. 06-04-13 Raymond Monnin M Added device type 05. Paragraph 1.3, corrected the power dissipation from“120 mW“ to “1.8 W“ for device type 03. Table
7、I; Added footnote 17 to the following tests: ICC2, ICC3, IEE2, VOVRSHT, tPW1, tPW2, tPW3, and tr. Removed footnote 17 from the Output Offset Voltage (VOS) test. Added footnote 15 to the IIL1test. Corrected the unit for the tests trand tZfrom “ns“ to “s“. Updated drawing paragraphs. -sld 12-06-04 Cha
8、rles F. Saffle REV SHEET REV M M M M M M M M M M M M M M M M M M SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-399
9、0 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Gregory A. Lude MICROCIRCUIT, HYBRID, LINEAR, MIL-STD-1553, BC/RTU/MT, MULTIPLEXED TERMINAL DRAWIN
10、G APPROVAL DATE 89-06-02 AMSC N/A REVISION LEVEL M SIZE A CAGE CODE 67268 5962-88692 SHEET 1 OF 32 DSCC FORM 2233 APR 97 5962-E041-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIM
11、E COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected
12、in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88692 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Dev
13、ice type Generic number Circuit function 01 BUS61553, BUS61563, CT2553 MIL-STD-1553, BC/RTU/MT, transceiver multiplexed terminal 02 BUS61554, BUS61564, CT2554 MIL-STD-1553, BC/RTU/MT, transceiver multiplexed terminal 03 BUS61555, BUS61565, CT2555 MIL-STD-1553, BC/RTU/MT, transceiver multiplexed term
14、inal 04 BUS61556 MIL-STD-1553, BC/RTU/MT, transceiverless multiplexed terminal 05 CT2555-003 MIL-STD-1553, BC/RTU/MT, transceiver, multiplexed terminal 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Pa
15、ckage style T See figure 1 82 Flat pack X See figure 1 78 Dual-in-line Y See figure 1 82 Flat pack Z See figure 1 78 Flat pack 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range: VCC(device types 01 through 03 and 05) . -0
16、.5 V dc to +7.0 V dc VEE(device types 01 and 02) +0.3 V dc to -18 V dc Logic input voltage range (VDD) -0.5 V dc to +7.0 V dc Power dissipation (PD): 2/ 3/ Device types 01 and 02 810 mW Device type 03 1.8 W Device type 04 100 mW Device type 05 1.2 W Storage temperature range -65 C to +150 C Lead tem
17、perature (soldering, 10 seconds) +300 C Thermal resistance, junction-to-case (qJC): 3/ Devices types 01 and 02 5.7 C/W Device type 03 112 C/W Device type 04 11.6 C/W Device type 05 13 C/W 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at th
18、e maximum levels may degrade performance and affect reliability. 2/ Applies up to TC= +125C. 3/ Hottest die.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-399
19、0 REVISION LEVEL M SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range: VCC(device types 01 and 02) . +4.5 V dc to +5.5 V dc VCC(device types 03 and 05) . +4.75 V dc to +5.5 V dc VEE(device type 01) . -14.25 V dc to -15.75 V dc VEE(device type 02) . -11.40 V dc t
20、o -12.60 V dc Logic input voltage range: VDD(device types 01, 02, and 04) +4.5 V dc to +5.5 V dc VDD(device types 03 and 05) . +4.75 V dc to +5.5 V dc Minimum logic high input voltage (VIH) . 2.2 V dc Maximum logic low input voltage (VIL) 0.8 V dc Operating frequency (FOP) . 16.0 MHz Case operating
21、temperature range (TC) . -55 C to +125 C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are tho
22、se cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
23、DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Buildi
24、ng 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exempt
25、ion has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Quality
26、Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in
27、the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) sh
28、all be in accordance with 1.2.2 herein and figure 1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 4 DSCC FORM 2234 APR 97 3.2.2
29、Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram(s). The block diagram(s) shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless other
30、wise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for
31、 each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general pe
32、rformance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all p
33、arameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of co
34、mpliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of confo
35、rmance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufac
36、turers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Te
37、st condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and pow
38、er dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical param
39、eter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 5 D
40、SCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55 C TC +125 C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Logic supply current, idle 2/ IDDVCC= 5.5 V, VDD= 5.5 V VEE= -15 V for device 01, VEE= -12 V for device 02. IOL
41、1= 3.6 mA, IOH1= -400 mA, IOL2= 2.0 mA, IOL3= 4.0 mA, fIN= 16 MHz 1,2,3 01,02 5.0 170 mA 03 50.0 170 04 5.0 60 05 40.0 170 Positive supply current, 3/ idle ICC11,2,3 01,02 5.0 170 mA 03 50.0 170 05 40.0 170 Negative supply current, 4/ idle IEE11,2,3 01,02 -5.0 -80 mA Positive supply current, channel
42、 A = 25 percent duty cycle, Channel B = idle 3/ 17/ ICC21,2,3 01,02 5.0 170 mA 03 50.0 250 05 40.0 250 Positive supply current, channel B = 25 percent duty cycle, Channel A = idle 3/ 17/ ICC31,2,3 01,02 5.0 170 mA 03 50.0 250 05 40.0 250 Negative supply current, channel A = 25 percent duty cycle, Ch
43、annel B = idle 4/ 17/ IEE21,2,3 01,02 -25 -130 mA Negative supply current, channel B = 25 percent duty cycle, Channel A = idle 4/ 17/ IEE21,2,3 01,02 -25 -130 mA High level output voltage 5/ VOHVCC= 4.5 V, VDD= 4.5 V, VIH= 2.7 V, VIL= 0.4 V, VEE= -15 V for device 01, VEE= -12 V for device 02, IOH= -
44、400 mA 6/ 1,2,3 All 2 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 6 DSCC FORM 2234 APR 97 TABL
45、E I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55 C TC +125 C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Low level output 7/ voltage VOL1VCC= 4.5 V, VDD= 4.5 V, VIH= 2.7 V, VIL= 0.4 V, VEE= -15 V for device type 01, VEE= -12 V fo
46、r device 6/ type 02 IOL1= 3.6 mA 1,2,3 All 0.4 V Low level output 8/ voltage VOL2IOL2= 2.0 mA 1,2,3 All 0.4 V Low level output 9/ voltage VOL3IOL3= 4.0 mA 1,2,3 All 0.4 V High level input 10/ current IIH1VCC= 5.5 V, VDD= 5.5 V, VIN= 2.7 V, VEE= -15 V for device type 01, VEE= -12 V for device type 02
47、 1,2,3 All -30 -220 mA High level input 11/ current IIH21,2,3 All -20 -630 mA High level input 12/ current IIH31,2,3 01-04 -50 -300 mA 05 -50 -200 High level input 13/ current IIH41,2,3 All -10 10 mA High level input 14/ current IIH51,2,3 All -20 20 mA High level input 15/ current IIH61,2,3 All -40
48、-220 mA Low level input 10/ 15/ current IIL1VCC= 5.5 V, VDD= 5.5 V, VIN= 0.4 V, VEE= -15 V for device type 01, VEE= -12 V for device type 02 1,2,3 All -100 -400 mA Low level input 11/ current IIL21,2,3 All -35 -700 mA Low level input 12/ current IIL31,2,3 All -100 -400 mA Low level input 13/ current
49、 IIL41,2,3 All -10 10 mA Low level input 14/ current IIL51,2,3 All -20 20 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88692 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REV
