1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 02 and 03. Add case outline P. Make changes to table I and editorial changes throughout. 90-05-24 M. A. Frye B Make changes to tPLH, tPHL, tTLH, and tTHLtests as specified in table I herein. - ro 00-06-21 R. Monnin C Update drawi
2、ng to current requirements. - drw 04-06-01 R. Monnin REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Gary Zahn DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dl
3、a.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL-LINEAR, DUAL PERIPHERAL NOR DRIVER, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-04-17 SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88715 SHE
4、ET 1 OF 10 DSCC FORM 2233 APR 97 5962-E299-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. S
5、COPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88715 01 P A Drawing number Device
6、 type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 55454 Dual peripheral NOR driver 02 55464 Dual peripheral NOR driver 03 55474 Dual peripheral NOR driver 1.
7、2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF
8、-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) 7.0 V dc 1/ Input voltage (VIN). 5.5 V dc 2/ Interemitter voltage (VEM) 5.5 V dc Offstate output voltage (VOO): Device type 01 30 V dc Device type 02 35 V dc Device type 03 70 V dc Continuous output current (IOC) 400 mA 3/ Peak o
9、utput current (IOP): (tW 10 ms, duty cycle 50 %) . 500 mA 3/ Continuous power dissipation (PD): Device types 01, 02, and 03 1375 mW 4/ Junction temperature (TJ) +150C Storage temperature range -65C to +150C 1/ Voltage values are with respect to ground. 2/ This is the voltage between two emitters of
10、a multiple-emitter transistor. 3/ Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation average over a short time interval must fall within the continuous power dissipation ratings. 4/ Device types 01, 02, and 03 derate above TA= +25C at 11.0 mW/C. P
11、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings continued. Lead temper
12、ature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Ambient operatin
13、g temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are tho
14、se cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case O
15、utlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order D
16、esk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regul
17、ations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR
18、 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualifie
19、d manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality M
20、anagement (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identi
21、fy when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal con
22、nections. The terminal connections shall be as specified on figure .1 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall
23、apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, a
24、ppendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.
25、5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow
26、option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply
27、 shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawi
28、ng. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offsh
29、ore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C
30、 SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxInput clamp voltage VICVCC= 4.5 V, II= -12 mA 1,2,3 All -1.5 V High level output current IOHVCC= 4.5 V, VOH
31、= 30 V 1,2,3 01 300 A VIL= 0.8 V VOH= 35 V 02 300 VOH= 70 V 03 300 Low level output voltage VOL1VCC= 4.5 V, IOL= 100 mA 1,2,3 All 0.5 V VOL2VIH= 2.0 V IOL= 300 mA 0.8 High level input current IIH1VCC= 5.5 V VIN= 5.5 V 1,2,3 All 1.0 mA IIH2VIN= 2.4 V 40 A Low level input current IILVCC= 5.5 V, VIN= 0
32、.4 v 1,2,3 All -1.6 mA High level supply current (outputs high) ICCHVCC= 5.5 V, VIN= 0 V 1,2,3 01 17 mA 02,03 19 Low level supply current (output low) ICCLVCC= 5.5 V, VIN= 5.0 V 1,2,3 01 79 mA 02,03 85 Functional tests See 4.3.1c and figure 2 7,8 All Propagation delay time, low to high level output
33、tPLHVCC= 5.0 V, IO= 200 mA, 9 01 35 ns CL= 15 pF, RL= 50 , 02,03 110 see figure 3 10,11 01 135 02,03 150 Propagation delay time, high to low level output tPHLVCC= 5.0 V, IO= 200 mA 9,10,11 01 90 ns CL= 15 pF, RL= 50 , see figure 3 02,03 110 Provided by IHSNot for ResaleNo reproduction or networking
34、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless othe
35、rwise specified Group A subgroups Device type Limits Unit Min MaxTransition time, low to high level output tTLHVCC= 5.0 V, IO= 200 mA, 9 01 25 ns CL= 15 pF, RL= 50 , 02,03 30 see figure 3 10,11 01 25 02,03 30 Transition time, high to low level output tTHLVCC= 5.0 V, IO= 200 mA 9 01 20 ns CL= 15 pF,
36、RL= 50 , 02,03 35 see figure 3 10,11 01 30 02,03 35 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 9
37、7 Device types 01, 02, and 03 Case outlines P 2 Terminal number Terminal symbol 1 1A NC 2 1B 1A 3 1Y NC 4 GND NC 5 2Y 1B 6 2A NC 7 2B 1Y 8 VCCNC 9 - NC 10 - GND11 - NC 12 - 2Y13 - NC 14 - NC15 - 2A 16 - NC17 - 2B 18 - NC19 - NC 20 - VCCNC = No connection FIGURE 1. Terminal connections. Inputs Output
38、 A B YL L H (off state) L H L (on state) H L L (on state) H H L (on state) NOTES: Positive logic: Y = B A + or AB Truth table is for each driver. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ
39、E A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. Pulse generator characteristics: PRR 1.0 MHz, ZOUT= 50 . 2. CL= load capacitance and includes scope and jig capacitance. FIGURE 3. Switching times test circuit and wavefor
40、ms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. S
41、ampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. B
42、urn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, output
43、s, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are opt
44、ional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 9 Group A
45、test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B,
46、C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. Prov
47、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88715 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electr
48、ical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except
