DLA SMD-5962-88730 REV B-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL QUADRUPLE 2-INPUT POSITIVE OR DRIVERS MONOLITHIC SILICON《单片硅四倍2输入改进型肖特基TTL四2输入正或驱动双极数字微电路》.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 00-11-17 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 08-04-04 Robert M. Heber REV SHET REV SHET REV

2、STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Christopher A. Rauch DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVE

3、D BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, QUADRUPLE, 2-INPUT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-09-16 POSITIVE OR DRIVERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88730 SHEET 1 OF 9 DSCC FORM 2233 APR

4、97 5962-E032-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing d

5、escribes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88730 01 C X Drawing number Device type (see 1.2.1) Case outline

6、(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AS1032 Quadruple, 2-input positive OR drivers 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as foll

7、ows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratin

8、gs. 1/ Supply voltage . -0.5 V dc to +7.0 V dc Input voltage -1.2 V dc at -18mA to +7.0 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 132 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperatur

9、e (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Minimum high-level input voltage (VIH) +2.0 V dc Maximum low-level input voltage (VIL) +0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Stresses above the absolute maximum rating

10、may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER C

11、OLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specifie

12、d, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interf

13、ace Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mi

14、l or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document,

15、 however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built t

16、o this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

17、activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described

18、herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2

19、.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Switching waveforms and test circuit. The switching wavefo

20、rms and test circuit shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requiremen

21、ts. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENS

22、E SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For package

23、s where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535

24、, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as

25、 an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certifi

26、cate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verific

27、ation and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling an

28、d inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in tes

29、t, method 1015 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and po

30、wer dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the disc

31、retion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical pe

32、rformance characteristics. Test Symbol Conditions 1/ -55C TC+125C 4.5 V VCC 5.5 V Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHIOH= -2 mA 1, 2, 3 2.5 V IOH= -3 mA 2.4 VCC= +4.5 V, VIL= +0.8 V, VIH= +2.0 V 2/ IOH= -40 mA 2.0 Low level output voltage VO

33、LVCC= +4.5 V, VIL= 0.8 V VIH= +2.0 V, IOL= 40 mA 2/ 1, 2, 3 0.4 V Input clamp voltage VICIIN= -18 mA, VCC= +4.5 V 1, 2, 3 -1.2 V Low level input current IILVCC= +5.5 V, VIN= 0.4 V, All other inputs = 4.5 V 1, 2, 3 -0.5 mA High level input current IIH1VCC= +5.5 V, VIN= +2.7 V All other inputs = 0.0 V

34、 1, 2, 3 20 A IIH2VCC= +5.5 V, VIN= +7.0 V All other inputs = 0.0 V 1, 2, 3 0.1 mA Output current IOVCC= +5.5 V, 3/ VOUT= 2.25 V 1, 2, 3 -50 -200 mA ICCHVCC= 5.5 V, VIN= 4.5 V 1, 2, 3 11.5 mA Supply current ICCLVCC= 5.5 V, VIN= 0.0 V 24 Functional testing See 4.3.1c 7, 8 tPLH 1 7 ns Propagation dela

35、y time, A, B to Y tPHL VCC= 4.5 to 5.5 V, CL= 50 pF, RL= 500 See figure 3 4/ 9, 10, 11 1 7 1/ Unused inputs that do not directly control the pin under test must be put at 2.5 V or 0.4 V. No unused inputs shall exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 2/ All outputs must be tes

36、ted. In the case where only one input at VILmaximum or VIHminimum produces the proper state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input 3/ The output conditions have been chosen to produce a current that closely approximates one half of the true s

37、hort circuit output current, IOS. Not more than one output will be shorted at a time and the duration of the test condition shall not exceed one second. 4/ Propagation delay limits are based on single output switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or n

38、etworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Case outlines C and D 2 Terminal number Terminal connection 1 1A NC 2 1B 1A 3 1Y 1B 4 2A 1Y 5 2B NC

39、6 2Y 2A 7 GND NC 8 3Y 2B 9 3A 2Y 10 3B GND11 4Y NC 12 4A 3Y13 4B 3A 14 VCC3B 15 NC 16 4Y17 NC 18 4A 19 4B 20 VCCNC = No connection FIGURE 1. Terminal connections. Input Output A B Y H X H X H H L L L L = Low voltage level H = High voltage level X = Irrelevant FIGURE 2. Truth table (each gate). Provi

40、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All

41、input pulses have the following characteristics: PRR 10 MHz, duty cycle = 50%, tr= tf= 3 ns 1 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 3. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted

42、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method

43、 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1

44、. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subg

45、roups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1

46、005 of MIL-STD-883. (1) Test condition A or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipa

47、tion, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STA

48、NDARD MICROCIRCUIT DRAWING SIZE A 5962-88730 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered b

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