1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Editorial changes throughout. 92-09-24 M. A. FRYE B Add case outline F. Make changes to 1.2.2, 1.3, and FIGURE 1. Changes in accordance with N.O.R. 5962-R066-94. 93-12-16 M. A. FRYE C Add case outline E. Make changes to 1.2.
2、2, 1.3, FIGURE 1, and editorial changes throughout. Redrawn. 97-11-13 R. MONNIN D Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. -rrp 04-03-25 R. MONNIN REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3
3、 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR, DUAL DIFFE
4、RENTIAL LINE DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-02-07 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88744 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E203-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
5、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
6、 accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88744 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the cir
7、cuit function as follows: Device type Generic number Circuit function 01 55113 Dual differential line driver with three state outputs 02 55114 Dual differential line driver with two state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline let
8、ter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage
9、(VCC) . +7.0 V dc 1/ Input voltage +5.5 V dc Off-state output voltage +12.0 V dc Maximum power dissipation (PD): Cases E and 2 1375 mW 2/ Case F 1000 mW 2/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) +150C Thermal resistance, junct
10、ion-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E . 90C/W Case F . 165C/W Case 2 . 65C/W 1/ All voltage values are with respect to network ground terminal. 2/ With TAabove +25C, the derating factors are 8.0C/W for case F and 11.0C/W for cases E and 2. Provided by
11、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) .
12、+4.5 V dc to +5.5 V dc Ambient operating temperature range (TA) . -55C to +125C Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Maximum low level output current (IOL) . 40 mA High level output current (IOH) -40 mA 2. APPLICABLE DOCUMENTS 2.1 Governmen
13、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
14、MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro
15、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order
16、of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item
17、 requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufact
18、urer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
19、 modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option
20、is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal c
21、onnections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Timing waveforms(s). The timing waveform(s) shall be as specified on figures 3, 4, and 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
22、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Device ty
23、pes Group A subgroups Min Max Unit Low level output voltage VOLVCC= 4.5 V, IOL= 40 mA All 1, 2, 3 0.4 V IOH= -10 mA 2.4 V High level output voltage VOHVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V IOH= -40 mA All 1, 2, 3 2.0 Input clamp voltage VIKVCC= 4.5 V, IIN= -12 mA All 1, 2, 3 -1.5 A,B,C All -1.6 Low level
24、 input current CC IILVCC= 5.5 V, VIN= 0.4 V 01 1, 2, 3 -3.2 mA A,B,C All 40 High level input current CC IIHVCC= 5.5 V, VIN= 2.4 V 01 1, 2, 3 80 A 01 1,2,3 -1.5 VCC= 5.5 V, IO= -40 mA 02 1 -1.5 Output clamp voltage VOKVCC= 5.0 V, IO= +40 mA 02 1 6.5 V VCC= 5.5 V 65 VCC= 7.0 V 01 1, 2, 3 85 VCC= 5.5 V
25、 50 Supply current ICCAll inputs at 0 V, no load VCC= 7.0 V 02 1, 2, 3 65 mA VO= 0 V to VCC1 10 VO= 0 V 2 -150 VO= 0.4 V 2 80 VO= 2.4 V 2 80 Off-state (high impedance) output current IOZVCC= 5.5 V, Output controls at 0.8 V VO= VCC01 2 80 A See footnote at end of table. Provided by IHSNot for ResaleN
26、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol
27、Conditions 1/ -55C TA +125C unless otherwise specified Device types Group A Subgroups Min Max Unit 01 10 02 1 100 Off-state (open-collector)output current IO(OFF)VCC= 5.5 V, VOH= 12 V All 2 200 A A, B, C All 1 Input current at maximum input voltage IIVCC= 5.5 V CC 01 1, 2, 3 2 mA Short circuit outpu
28、t current IOSVCC= 5.5 V, VOUT= 0 V, TA= 25C All 1 -40 -120 mA Functional test See 4.3.1.c All 7, 8 tPLH20 Propagation delay time tPHLTA= +25C, VCC= 5 V, CL= 30 pF, see figure 3 All 9 20 ns Output enable time to high level tPZHRL= 180 , TA= +25C, VCC= 5 V, CL= 30 pF, See figure 4 01 9 15 ns Output en
29、able time to low level tPZLRL= 250 , TA= +25C, VCC= 5 V, CL= 30 pF, See figure 5 01 9 30 ns Output disable time from high level tPHZRL= 180 , TA= +25C, VCC= 5 V, CL= 30 pF, See figure 4 01 9 20 ns Output disable time from low level tPLZRL= 250 , TA= +25C, VCC= 5 V, CL= 30 pF, See figure 5 01 9 35 ns
30、 1/ All parameters, with the exception of off-state open collector output current (IO(OFF), are measured with the active pull-up connected to the sink output. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8
31、8744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines E and F 2 E and F 2 Terminal number Terminal symbol 1 1ZP NC 1ZP NC 2 1ZS 1ZP 1ZS 1ZP 3 1YS 1ZS 1YS 1ZS 4 1YP 1YS 1YP 1YS 5 1A 1YP 1A 1YP 6 1B NC 1B NC 7 1C 1
32、A 1C 1A 8 GND 1B GND 1B 9 CC 1C 2A 1C 10 2C GND 2B GND 11 2A NC 2C NC 12 2YP CC 2YP 2A 13 2YS 2C 2YS 2B 14 2ZS 2A 2ZS 2C 15 2ZP 2YP 2ZP 2YP 16 VCCNC VCCNC 17 - 2YS - 2YS 18 - 2ZS - 2ZS 19 - 2ZP - 2ZP 20 - VCC- VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or network
33、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Inputs Output 1A or 2A 1B 1C or 2C CC ZP ZS YS YP L L or H H H H Hi Z L Hi Z L or H L H H
34、H Hi Z L Hi Z H H H H Hi Z L Hi Z H L or H L or H L L or H Hi Z Hi Z Hi Z Hi Z L or H L or H L or H L Hi Z Hi Z Hi Z Hi Z Device type 02 Inputs Outputs A B C Y Z H H H H L All other input combinations L H FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted wit
35、hout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. The pulse generator has the following characteristics ZO= 50 , PRR 500 kHz, tW= 100 ns. 2. CLincludes probe and
36、jig capacitance. FIGURE 3. Waveforms and test circuit for low-to-high and high-to-low outputs. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 RE
37、VISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. The pulse generator has the following characteristics ZO= 50 , PRR 500 kHz, tW= 100 ns. 2. CLincludes probe and jig capacitance. 3. The parameter from table I is valid with the switch in either position. FIGURE 4. Waveforms and test circuit for
38、enable-to-high and high-to-disable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. The
39、 pulse generator has the following characteristics ZO= 50 , PRR 500 kHz, tW= 100 ns. 2. CLincludes probe and jig capacitance. 3. The parameter from table I is valid with the switch in either position. FIGURE 5. Waveforms and test circuit for enable-to-low and low-to-disable outputs. Provided by IHSN
40、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 11 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise spec
41、ified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgr
42、oup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to
43、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a
44、“Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The
45、certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL
46、-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity reta
47、in the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, a
48、ppendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit sha
