1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Add vendor CAGE F8859. Add case outline X. Add table III, delta limits. Update drawing to MIL-PRF-38535 requirements. Editorial changes throughout. jak 02-10-25 Thomas M. Hess B Update boilerplate paragraphs to the current MIL
2、-PRF-38535 requirements. - LTG 10-02-12 Thomas M. Hess REV SHET REV B B SHET 15 16 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kelleher DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STAND
3、ARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Ray Monnin APPROVED BY D. R. Cool MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 8-INPUT UNIVERSAL SHIFT/STORAGE REGISTER WITH COMMON PARALLEL I/O PINS, TTL COMPATIBLE INPUTS, TH
4、REE-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-03-24 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88771 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E185-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR
5、AWING SIZE A 5962-88771 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V)
6、. A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 59
7、62 - 88771 01 R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.2.4)Lead finish (see 1.2.5) / /Drawing number For device class V: 5962 - 88771 01 V R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class
8、 designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-
9、38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT299 8-input universal shift/storage
10、 register with common parallel I/O pins, TTL compatible inputs, three-state outputs 02 54ACT299 8-input universal shift/storage register with common parallel I/O pins, TTL compatible inputs, three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying
11、 the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor
12、 self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-
13、,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88771 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Packa
14、ge style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack X See figure 1 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class
15、 M. 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input clamp current (IIK) (VINVCC) 20 mA DC output clamp current (IOK) (VINVCC) . 20 mA Con
16、tinuous output current (IOUT) (VOUT= 0 to VCC) . 50 mA Continuous current through VCCor GND . 100 mA Maximum power dissipation (PD) . 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Ju
17、nction temperature (TJ) +175C 3/ 1.4 Recommended operating conditions. 2/ 4/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCCase operating temperature range (TC) . -55C to +125C Input rise and fall rate (t/V)
18、maximum: VCC= 4.5 V to 5.5 V 0.0 to 8 ns/V Minimum setup time, Sn to CP (ts): Device types 01, 02, TC= +25C, VCC= 4.5 V . 5.5 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 6.5 ns Minimum hold time, Sn to CP (th): Device types 01, 02, TC= +25C, VCC= 4.5 V . 1.5 ns Device types 01, 02, TC= -
19、55C to +125C, VCC= 4.5 V . 1.5 ns Minimum setup time, I/On to CP (ts): Device types 01, 02, TC= +25C, VCC= 4.5 V . 4.0 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 4.5 ns Minimum hold time, I/On to CP (th): Device types 01, 02, TC= +25C, VCC= 4.5 V . 1.5 ns Device types 01, 02, TC= -55C t
20、o +125C, VCC= 4.5 V . 1.5 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ Maximum junction temperature
21、 shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 4/ Unless otherwise specified, the values listed above shall apply over the full VCCand TCrecommended operating range. Provided by IHSNot for ResaleNo reproduction o
22、r networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88771 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions Continued. Minimum setup time, DSn to CP (ts): Device types
23、 01, 02, TC= +25C, VCC= 4.5 V . 4.5 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 5.5 ns Minimum hold time, DSn to CP (th): Device types 01, 02, TC= +25C, VCC= 4.5 V . 1.5 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 1.5 ns Minimum pulse width, CP (tw): Device types 01, 02, TC=
24、+25C, VCC= 4.5 V . 5.0 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 5.0 ns Minimum pulse width, MR (tw): Device types 01, 02, TC= +25C, VCC= 4.5 V . 5.0 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 5.0 ns Minimum recovery time, MR to CP (trec): Device types 01, 02, TC= +25C, VC
25、C= 4.5 V . 1.5 ns Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 1.5 ns Maximum frequency (fmax): Device types 01, 02, TC= +25C, VCC= 4.5 V . 95 MHz Device types 01, 02, TC= -55C to +125C, VCC= 4.5 V . 95 MHz 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The f
26、ollowing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturi
27、ng, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microc
28、ircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this d
29、ocument to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANCE (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies o
30、f these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes
31、 precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88771 DEFENSE SUPPLY C
32、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Qual
33、ity Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design,
34、construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 a
35、nd figure 1 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.5 Switching waveforms and test circuit. The
36、switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and
37、shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2
38、 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall stil
39、l be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in M
40、IL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this d
41、rawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supp
42、ly for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required fo
43、r device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) in
44、volving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentatio
45、n. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 40 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo rep
46、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88771 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/
47、Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type 3/ and device class VCCGroup A subgroups Limits 4/ Unit Min Max Positive input clamp voltage 3022 VIC+For input under test, IIN= 1.0 mA All V 0.0 V 1 0.4 1.5 V Negative input clamp voltage 3022 VIC-For i
48、nput under test, IIN= -1.0 mA All V Open 1 -0.4 -1.5 V High level output voltage 3006 VOH5/ VIN= VIHminimum or VILmaximum IOH= -50 A All All 4.5 V 1, 2, 3 4.4 V All All 5.5 V 1, 2, 3 5.4 VIN= VIHminimum or VILmaximum IOH= -24 mA All All 4.5 V 1, 2, 3 3.70 All All 5.5 V 1, 2, 3 4.70 VIN= VIHminimum or VILmaximum IOH= -50 mA All All 5.5 V 1, 2, 3 3.85 Low level output voltage 3007 VOL5/ VIN= VIHminimum or VILmaximum IOL= +50 A All All 4.5 V 1, 2, 3 0.1 V All All 5.5 V 1, 2, 3 0.1 VIN= VIH
