1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 01-05-22 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap 08-12-12 Robert M. Heber The original first shee
2、t of this drawing has been replaced. REV SHET REV SHET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS
3、 DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, 2-INPUT NAND SCHMITT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-02-18 TRIGGER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE
4、67268 5962-89487 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E275-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FO
5、RM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89487 01 C X Dr
6、awing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F132 Quad 2-input NAND Schmitt trigger 1.2.2 Case outlines. The case outlines are as
7、designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535,
8、appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to minimum to +7.0 V dc maximum Input voltage range (VIN) . -0.5 V dc to minimum to +7.0 V dc maximum Input current range -30.0 mA to +5.0 mA Voltage applied to output in high output state range . -0.5 V to VCCCurrent applied
9、 to output in low output state . 40 mA Storage temperature range . -65C to +150C Maximum power dissipation (PD) 1/ . 99.0 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (C) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions
10、 Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Maximum input clamp current (IIK) -18 mA Maximum high level output current (IOH) . -1.0 mA Maximum low level output current (IOL) . 20 mA Case operating temperature range (TC) -55C to +125C _ 1/ Power dissipation is defined as VCCx ICCand must wi
11、thstand the added PDdue to short circuit test, e.g., IOS.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234
12、APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or co
13、ntract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HAN
14、DBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19
15、111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.
16、REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manuf
17、acturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manageme
18、nt (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when
19、 the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connection
20、s. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unl
21、ess otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
22、 for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 M
23、arking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has th
24、e option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accorda
25、nce with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSC
26、C-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided w
27、ith each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers
28、facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall
29、be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the m
30、anufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.
31、2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted withou
32、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C Group A subgroups Limits Unit unless oth
33、erwise specified Min Max Positive-going threshold voltage VT+VCC= 5.0 V 1, 2, 3 1.45 2.0 V Negative-going threshold voltage VT-1, 2, 3 0.7 1.05 V Input clamp voltage VT1, 2, 3 0.4 V High level output voltage VOHVCC= 4.5 V, VIL= 0.7 V, IOH= -1.0 mA 1, 2, 3 2.5 V Low level output voltage VOLVCC= 4.5 V
34、 IOL= 20 mA VIH= 2.0 V 1, 2, 3 0.5 V Input clamp voltage VIK1, 2, 3 -1.2 V High level input current IIH1VCC= 5.5 V VIN= 2.7 V 1, 2, 3 20 A IIH2VIN= 7.0 V 1, 2, 3 100 A Low level input current IILVCC= 5.5 V, VIN= 0.5 V , 1, 2, 3 -0.6 mA Short circuit output current IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2
35、 3 -60 -150 mA Supply current ICCHVCC= 5.5 V, VIN= 0.0 V 1, 2, 3 17 mA ICCLVCC= 5.5 V, VIN= 5.5 V 1, 2, 3 18 mA Functional tests See 4.3.1c, VCC= 4.5 V, 5.5 V 7, 8 Propagation delay time, An, Bn to nO tPLHVCC= 5.0 V 9 4.0 11.0 ns tPLH CC= 4.5 V, 5.5 V 10, 11 2.0 13.0 ns PHLVCC= 5.0 V 9 4.5 12.5 ns
36、tPHLCL= 50 pF RL= 500 See figure 3 VCC= 4.5 V, 5.5 V 10, 11 4.5 16.0 ns 1/ Not more than one output should be shorted at a time, and the duration of the short circuit condition should notexceed one second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-
37、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Case outlines C and D 2 Terminal number Terminal Symbol 1 A0 NC 2 B0 A03 0OB04 A1 0O 5 B1NC 6 1OA17 GND NC 8 3OB19 B31O10 A3 GND 11 2O NC 12 B23
38、O13 A2B314 VCCA315 NC16 2O 17 NC18 B219 A2 20 VCCFIGURE 1. Terminal connections. Inputs Outputs A B O L L H L H H H L H H H L H = High level voltage. L = Low level voltage. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDA
39、RD MICROCIRCUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 NOTES: 1. For the waveform, VM= 1.5 V. 2. RL= load resistor; see table I for value. 3. CL= load capacitance includes jig and probe capacitance; see table
40、I for value. 4. All input pulses have the following characteristics: PRR = 1MHz, tr= tf= 2.5 ns, pulse width = 500 ns, duty cycle = 50%. FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR
41、CUIT DRAWING SIZE A 5962-89487 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters
42、method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quality conforma
43、nce inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-8
44、83 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D.
45、The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the int
46、ent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89487 DE
47、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are
48、 intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of use
