1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 02-11-04 R. MONNIN B Drawing updated to reflect current requirements. - ro 03-02-13 R. MONNIN C Make change to the test circuit as specified in FIGURE 2. - ro 04-04-15 R. MONNIN THE ORIGINAL F
2、IRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY JOSEPH A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43216 http:/www.dscc.dla.mi
3、l THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, QUAD 2-INPUT NOR POWER DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-10-27 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89604 SHEET 1 OF 9
4、 DSCC FORM 2233 APR 97 5962-E219-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 S
5、cope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89604 01 C X Drawing number Device type (see
6、 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Output voltage 01 UH-432 Quad 2-input NOR power driver 40 V 02 UH-432-1 Quad 2-input NOR power driver 70 V 03 UH-532
7、 Quad 2-input NOR power driver 100 V 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 1.2.3 Lead finish. The lead f
8、inish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) . 7.0 V dc Input voltage (VIN) . 5.5 V dc Output off-state voltage (VOFF): Device type 01 . 40 V Device type 02 . 70 V Device type 03 . 100 V Output on-state sink current (ION): One driver 500 mA T
9、otal package . 1.0 A Power dissipation (PD): Device type 01 . 6 W Device type 02 . 10 W Device type 03 . 15 W Suppression diode on-state current (IF) 500 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +150C Provided by IHSNot for R
10、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings continued. Thermal resistance, junction-to-ca
11、se (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C . 90C/W Case D . 140C/W 1.4 Recommended operating conditions. Supply voltage (VCC) . 4.5 V dc to 5.5 V dc Current into any output (on-state) 250 mA maximum Minimum high level input voltage (VIH) 2.0 V Maximum low level i
12、nput voltage (VIL) . 0.8 V Maximum collector cutoff current (ICEX) 250 mA Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the
13、extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Me
14、thod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.dap
15、s.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing
16、 takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SU
17、PPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this
18、 drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activi
19、ty approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein
20、. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Cas
21、e outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Switching waveforms, test circuit and input pulse characteristics. The switching waveforms, test circuit and input pulse characteristi
22、cs shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electri
23、cal test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers
24、PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices b
25、uilt in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a ma
26、nufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and t
27、he requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change tha
28、t affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot fo
29、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions
30、 -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input current high IIN(1)VCC= 5.5 V, other input = 0 V, driven input = 2.4 V 1,2,3 All 40 A VCC= 5.5 V, other input = 0 V, driven input = 5.5 V 1,000 Input current low IIN(0)VCC= 5.5 V, other input = 4.5 V, d
31、river input = 0.4 V 1,2,3 All -800 A Output reverse 1/ current IOFFVCC= 4.5 V, other input = 0.8 V, driver input = 0.8 V 1,2,3 All 100 A Output voltage low VONVCC= 4.5 V, other input = 0 V, driver input = 2.0 V, 1,3 All 0.5 V output = 150 mA 2 0.6 VCC= 4.5 V, other input = 0 V, driver input = 2.0 V,
32、 1,3 0.7 output = 250 mA 2 0.8 Input voltage VIN(1)VCC= 4.5 V 1,2,3 All 2.0 V VIN(0)0.8 Supply current, high level (each gate) ICC(1)VCC= 5.5 V, TA= +25C, 1 All 7.5 mA all inputs = 0 V 2,3 10 Supply current, low level (each gate) ICC(0)VCC= 5.5 V, TA= +25C, 1 All 26.5 mA all inputs = 5.0 V 2,3 40 In
33、put clamp voltage VICDriven input = -12 mA 1,2,3 All -1.5 V Propagation delay, “Turn-on” time tpdON VCC= 5.0 V, 2/ CL= 15 pF 9,10,11 All 500 ns Propagation delay, “Turn-off” time tpdOFF VCC= 5.0 V, 2/ CL= 15 pF 9,10,11 All 750 ns 1/ Off state voltage VOFF= 40 V for device type 01, 70 V for device ty
34、pe 02, and 100 V for device type 03. 2/ For device type 01, VOFF= 40 V, RL= 265 , for device type 02, VOFF= 70 V, RL= 465 , and for device type 03, VOFF= 100 V, RL= 670 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S
35、IZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device types 01, 02, and 03 Case outlines C D Terminal number Terminal symbol 1 INPUT 1A INPUT 1A 2 INPUT 1B INPUT 1B 3 OUTPUT 1 OUTPUT 1 4 INPUT 2A VCC5 INPUT 2B OUTPUT 2 6 OUTPU
36、T 2 INPUT 2A 7 GND INPUT 2B8 OUTPUT 3 OUTPUT 3 9 INPUT 3A INPUT 3A 10 INPUT 3B INPUT 3B 11 OUTPUT 4 GND 12 INPUT 4A INPUT 4A 13 INPUT 4B INPUT 4B 14 VCCOUTPUT 4 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
37、MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 NOTE: CLincludes probe and test fixture capacitance. INPUT PULSE CHARACTERISTICS VIN(0)= 0 V tf 7.0 ns tp= 1.0 s VIN (1)= 3.5 V tr 14 ns PRR = 500 kHz FIGURE
38、 2. Switching waveforms, test circuit, and input pulse characteristics. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 8
39、DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conform
40、ance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring acti
41、vity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein
42、, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additi
43、onal criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herei
44、n. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shal
45、l specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The
46、requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89604 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL
47、C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*,2,3,9 Group A test requirements (meth
48、od 5005) 1,2,3,9,10*,11* Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I herein. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or draw
