1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R142-94 94-04-21 Michael A. Frye B Drawing updated to reflect current requirements. Editorial changes throughout. -gap 00-11-02 Raymond Monnin C Boilerplate update and part of five year review. tcr 07-04-02 Rob
2、ert M. Heber THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED REV SHET REV C C C C C C C SHEET 15 16 17 18 19 20 21 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Charles Reusing DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DR
3、AWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 256 X 9 PARALLEL FIFO, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90
4、-10-09 SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89666 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E274-07 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBU
5、S COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PI
6、N is as shown in the following example: 5962-89666 01 U A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 7200L 256 X
7、9-bit parallel FIFO 120 ns 02 7200L 256 X 9-bit parallel FIFO 80 ns 03 7200L 256 X 9-bit parallel FIFO 65 ns 04 7200L 256 X 9-bit parallel FIFO 50 ns 05 7200L 256 X 9-bit parallel FIFO 40 ns 06 7200L 256 X 9-bit parallel FIFO 30 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-
8、STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDIP3-T28 or GDIP4-T28 28 Dual-in-line package Y CDIP2-T28 or GDIP1-T28 28 Dual-in-line package Z GDFP2-F28 28 Flat package U CQCC1-N32 32 Rectangular leadless chip carrier 1.2.3 Lead finish. The lead finish is
9、as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Terminal voltage with respect to ground -0.5 V dc to +7.0 V dc DC output current 50 mA Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 1.0 W Lead temperature (soldering, 10 seconds). +260C Thermal res
10、istance, junction-to-case (JC): See MIL-STD-1835 Junction temperature (TJ). +150C 1/ 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input high voltage (VIH) . 2.2 V dc Maximum low level input low voltage (VIL) 0.8 V dc 2/ Case operating tem
11、perature range (TC) . -55C to +125C 1/ Maximum junction temperature may be increased to +175C during burn-in and steady-state life tests. 2/ 1.5 V undershoots are allowed for 10 ns once per cycle. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND
12、ARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this
13、 drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-S
14、TD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at
15、http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, th
16、e text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
17、JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accor
18、dance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the
19、device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions
20、shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth tables. The truth tables shall be as specified on figure 2. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 here
21、in. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the su
22、bgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 R
23、EVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless otherwise specified Min Max Input leakage current ILI0.0 V VIN VCC1, 2, 3 All -10 10 A Output
24、 leakage current ILO0.0 V VOUT VCC, R VIH1, 2, 3 All -10 10 A Output low voltage VOLVCC= 4.5 V, IOL= 8.0 mA, 1, 2, 3 All 0.4 V VIL= 0.8 V, VIH= 2.2 V Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA, 1, 2, 3 All 2.4 V IL= 0.8 V, VIH= 2.2 V Operating supply ICC1f = fS, outputs open, 1, 2, 3 01, 02, 10
25、0 mA current VCC= 5.5 V 03, 04 f = 20 MHz, outputs open, 05, 06 140 CC= 5.5 V Standby power supply ICC2R = W = RS = FL / TR = VIH, 1, 2, 3 01, 02, 15 mA current outputs open 03, 04 05, 06 20 Power down current ICC3All inputs = VCC-0.2 V, 1, 2, 3 All 900 A outputs open Input capacitance CINVI= 0 V, f
26、 = 1.0 MHz, 4 All 8 pF TA= +25C, see 4.3.1c Output capacitance COUTVO= 0 V, f = 1.0 MHz, 4 All 8 pF A= +25C, see 4.3.1c Shift frequency fSCL= 30 pF, see figures 3 and 4 9, 10, 11 01 7.0 MHz 02 10 03 12.5 04 15 05 20 06 25 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or
27、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C VS
28、S= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless otherwise specified Min Max Read cycle time tRCCL= 30 pF, see figures 3 and 4 9, 10, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 Access time tA9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Read recovery time tRR9, 10, 11 0
29、1, 02 20 ns 03, 04 15 05, 06 10 Read pulse width tRPW9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Read pulse low to data tRLZ9, 10, 11 01, 02, 10 ns bus at low Z 1/ 03, 04 05, 06 5.0 Write pulse low to data tWLZ9, 10, 11 01, 02 20 ns bus at low Z 1/ 2/ 03, 04 15 05 10 06 5.0 Data valid from rea
30、d tDV9, 10, 11 All 5.0 ns pulse high See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC
31、 FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless otherwise specified Min Max Read pulse high to data tRHZCL= 30 pF, see figures 3 and 4 9, 10, 11 01 35 ns bus a
32、t high Z 1/ 02, 03, 30 04 05 25 06 20 Write cycle time tWC9, 10, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 Write pulse width tWPW9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Write recovery time tWR9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 10 Data setup time tDS9, 10, 11 01, 02 40 ns 03, 04 30 0
33、5 20 06 18 Data hold time tDH9, 10, 11 01, 02, 10 ns 03 04 5.0 05, 06 0.0 Reset cycle time tRSC9, 10, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
34、WING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless ot
35、herwise specified Min Max Reset pulse width tRSCL= 30 pF, see figures 3 and 4 9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Reset recovery time tRSR9, 10, 11 01, 02 20 ns 03, 04 15 05, 06 10 Reset setup time tRSS9, 10, 11 01 120 ns 1/ 02 80 03 65 04 50 05 40 06 30 Retransmit cycle time tRTC9, 10
36、, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 Retransmit pulse width tRT9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Retransmit recovery tRTR9, 10, 11 01, 02 20 ns time 03, 04 15 05, 06 10 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted withou
37、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Grou
38、p A subgroups Device types Limits Unit unless otherwise specified Min Max Reset to empty flag low tEFLCL= 30 pF, see figures 3 and 4 9, 10, 11 01 140 ns 02 100 03 80 04 65 05 50 06 40 Read low to empty flag tREF9, 10, 11 01, 02, 60 ns low 03 04 45 05, 06 30 Read high to full flag tRFF9, 10, 11 01, 0
39、2, 60 ns high 03 04 45 05 35 06 30 Write high to empty tWEF9, 10, 11 01, 02, 60 ns flag high 03 04 45 05 35 06 30 Write low to full flag tWFF9, 10, 11 01, 02, 60 ns low 03 04 45 05 35 06 30 Reset to half-full and tHFH, 9, 10, 11 01 140 ns full flag high tFFH02 100 03 80 04 65 05 50 06 40 See footnot
40、es at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE I. Electrical performanc
41、e characteristics Continued. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless otherwise specified Min Max Read/Write to XO low tXOLCL= 30 pF, see figures 3 and 4 9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 Read/Write to XO high tXO
42、H9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 XI pulse width tXI9, 10, 11 01 120 ns 02 80 03 65 04 50 05 40 06 30 XI recovery time tXIR9, 10, 11 All 10 ns XI setup time tXIS9, 10, 11 All 15 ns Retransmit setup time tRTS9, 10, 11 01 120 ns 1/ 02 80 03 65 04 50 05 40 06 30 See footnotes at end of
43、 table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 TABLE I. Electrical performance character
44、istics Continued. Test Symbol Conditions -55C TC+125C VSS= 0 V, 4.5 V VCC 5.5 V Group A subgroups Device types Limits Unit unless otherwise specified Min Max Read pulse width after tRPECL= 30 pF, see figures 3 and 4 9, 10, 11 01 120 ns EF high 02 80 03 65 04 50 05 40 06 30 Write low to half-full tWH
45、F9, 10, 11 01 140 ns flag low 02 100 03 80 04 65 05 50 06 40 Read high to half-full tRHF9, 10, 11 01 140 ns flag high 02 100 03 80 04 65 05 50 06 40 Write pulse width after tWPF9, 10, 11 01 120 ns FF high 02 80 03 65 04 50 05 40 06 30 1/ If not tested, shall be guaranteed to the limits specified in
46、table I. 2/ Only applies to read data flow-through mode. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89666 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 Device types All Case outlines X, Y, and Z U Terminal number Terminal symbol 1 W NC 2 D8W 3 D3D84 D2 35 D1D26 D0 17 XI D08 FF XI 9 Q0FF 10 Q1Q011 Q2 112 Q3NC 13 Q8Q214 GND Q315 R Q816 Q4GND 17 Q5NC 18 Q6R 19 Q7Q420 XO / HF Q521 EF Q622 RS Q723 FL / RT XO / HF 24 D7EF 25 D6
