1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Correct and add notes to figure 4, switching waveforms and test circuit. Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout jak. 05-10-03 Thomas M. Hess B Update the boilerplate paragraphs t
2、o the current MIL-PRF-38535 requirements. - jak 11-09-19 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ STA
3、NDARD MICROCIRCUIT DRAWING CHECKED BY William J. Johnson THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, DUAL J-K FLIP-FLOP WITH SET AND RESET, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE
4、 DRAWING APPROVAL DATE 89-07-28 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89702 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E512-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND
5、MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The comp
6、lete PIN is as shown in the following example: 5962-89702 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT112 Dual J-K
7、 flip-flop with set and reset, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified
8、in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) . 20 mA DC output current (per pin) (IO
9、UT). 20 mA DC drain current (per pin) (IDRAIN) 25 mA DC VCCor GND current (per pin) (ICC, IGND) . 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 2/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-18
10、35 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time (tr, tf): VCC= 4.5 V . 0 to 500 ns Minimum input pulse width, CP (tw): TC= +25C, VCC= 4.5 V . 16 ns T
11、C= -55C to +125C, VCC= 4.5 V . 24 ns Minimum input pulse width, R, S (tw): TC= +25C, VCC= 4.5 V . 18 ns TC= -55C to +125C, VCC= 4.5 V . 27 ns Minimum removal time, R to CP, S to CP(trem): TC= +25C, VCC= 4.5 V . 20 ns TC= -55C to +125C, VCC= 4.5 V . 30 ns Minimum hold time, J, K to CP (th): TC= +25C,
12、 VCC= 4.5 V . 3 ns TC= -55C to +125C, VCC= 4.5 V . 3 ns Minimum setup time, J, K to CP (ts): TC= +25C, VCC= 4.5 V . 16 ns TC= -55C to +125C, VCC= 4.5 V . 24 ns Maximum frequency (fMAX): TC= +25C, VCC= 4.5 V . 30 MHz TC= -55C to +125C, VCC= 4.5 V . 20 MHz 1/ Unless other wise specified, all voltages
13、are referenced to ground. 2/ For TC= +100C to +125C, derate linearly at 8 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 D
14、SCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the soli
15、citation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT
16、OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Phil
17、adelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has bee
18、n obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and
19、qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Q
20、uality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required t
21、o identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Termin
22、al connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test cir
23、cuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical perf
24、ormance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in ta
25、ble II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the en
26、tire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The complia
27、nce indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of su
28、pply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of
29、conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3
30、.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by
31、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Condition
32、s 1/ -55C TC +125C unless otherwise specified VCCGroup A subgroups Limits Unit Min Max High level output voltage VOHVIN= VIH= 2.0 V, or VIL= 0.8 V IOH= -20 A 4.5 V 1, 2, 3 4.4 V IOH= -4 mA 3.7 Low level output voltage VOLVIN= VIH= 2.0 V, or VIL= 0.8 V IOL= +20 A 4.5 V 1, 2, 3 0.1 V IOL= +4 mA 0.4 Hi
33、gh level input voltage VIH2/ 4.5 V 1, 2, 3 2.0 V Low level input voltage VIL2/ 4.5 V 1, 2, 3 0.8 V Input capacitance CINTC+25C , VIN= 0 V, see 4.3.1c 4 10 pF Quiescent supply current ICCVIN= VCCor GND, IOUT= 0.0 A 5.5 V 1, 2, 3 80 A Input leakage current IINVIN= VCCor GND 5.5 V 1, 2, 3 1 A Additiona
34、l quiescent supply current ICCAny one input, VIN = 2.4 V Other inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 1, 2, 3 490 A Functional tests See 4.3.1d 7, 8 Propagation delay time, CP to Q or Q tPHL1, tPLH1CL= 50 pF see figure 4 4.5 V 9 35 ns 10, 11 53 Propagation delay time, S to Q or Q tPHL2, tPLH24.5 V
35、 9 32 ns 10, 11 48 Propagation delay time, R to Q or Q tPHL3, tPLH34.5 V 9 37 ns 10, 11 56 Output transition time tTLH, tTHL3/ 4.5 V 9 15 ns 10, 11 22 1/ For power supply of 5 V 10 percent, the worst case output voltages (VOHand VOL) occur for HCT at 4.5 V. Thus, the 4.5 V values should be used when
36、 designing with this supply. Worst cases VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. 2/ VIHand VILtests are not required and shall be applied as forcing functions for VOHor VOLtests. 3/ Transition times (tTLH, tTHL), if not tested, shall be guaranteed to the specified limits in table I. P
37、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline E Terminal number Terminal symbo
38、l 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1CP 1K 1J 1S 1Q 1Q 2Q GND 2Q 2S 2J 2K 2CP 2R 1R VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS
39、, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Inputs Ouputs nS nR nCP nJ nK nQ nQ L H X X X H L H L X X X L H L L X X X H* L* H H L L No change H H H L H L H H L H L H H H H H Toggle H H H X X No change L = Low voltage level H = High voltage level X = Irrelevant = Transition of th
40、e clock from high to low * = Output states unpredictable if S and R go high simultaneously after both being low at the same time FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DL
41、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO
42、 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
43、 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF or equivalent, includes test jig and probe capacitance. 2. Input signal from pulse generator: VIN= 0.0 V to 3.0 V; PRR 1 MHz; ZO= 50; tr = 6.0 ns; tf= 6.0 ns; trand tfshall be measured from 0.3 V to 2.7 V and from 2.7 V to 0.3 V, r
44、espectively; duty cycle = 50 percent. 3. The outputs are measured one at a time with one transition per measurement. FIGURE 4. Switching waveforms and test circuit Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
45、NG SIZE A 5962-89702 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 11 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance
46、with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D, the test circuit shall be maintained by the manufacturer under
47、 document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, mi
48、nimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test paramet
