1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R008-92. 91-10-18 M. A. Frye B Changes in footnotes at end of table I. Editorial changes throughout. 92-10-29 M. A. Frye C Update drawing to current requirements. Editorial changes throughout. drw 04-09-14 Raym
2、ond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore CO
3、LUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, CMOS LATCHED 8- AND 16-CHANNEL ANALOG MULTIPLEXERS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-08-08 MONOLITHIC SILICON AMSC N
4、/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89710 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E430-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218
5、-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the f
6、ollowing example: 5962-89710 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 ADG526A CMOS 16-channel multiplexer latched 02 ADG
7、527A CMOS 8-channel multiplexer latched 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The l
8、ead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VDD) to VSS44 V dc Supply voltage (VDD) to GND 25 V dc VSSto GND . -25 V dc Analog inputs: 1/ Voltage at S or D. VSS2.0 V dc to VDD+2.0 V dc or 20 mA, whichever occurs first Continuous current, S o
9、r D. 20 mA Pulsed current, S or D (1.0 ms duration, 10% duty cycle) . 40 mA DC input voltages 1/ VSS4.0 V dc to VDD+4.0 V dc or 20 mA, whichever occurs first Storage temperature range. -65C to +125C Lead temperature (soldering, 10 seconds). +300C Power dissipation to +75C (PD). 470 mW 2/ Thermal res
10、istance, junction-to-case (JC): Cases X and 3. See MIL-STD-1835 Junction temperature (TJ). +175C 1.4 Recommended operating conditions. Supply voltage to ground (VSS). -15 V dc Supply voltage to ground (VDD). +15 V dc Ambient operating temperature range -55C to +125C 1/ Overvoltage at A, EN, WR , RS
11、, S, or D will be clamped by diodes. Current should be limited to the maximum rating above. 2/ Derate above TA= +75C at 6.0 mW/C.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COL
12、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified,
13、 the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interfac
14、e Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or fro
15、m the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however
16、, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this d
17、rawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
18、 approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein.
19、A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case
20、outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified
21、 herein, the electrical performance characteristics are as specified in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
22、subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible du
23、e to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced wi
24、th a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
25、S, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxDual supply Analog signal range VANALOGTA= +25C 2/ 4 01, 02 -15 +15 V
26、 Drain-source “ON” resistance RDS(ON)VDD= 14.25 V, VSS= -14.25 V, 1 01, 02 300 IDS= 1.0 mA, VD= 5.0 V, VS= VD+ (IDSX RON) 2, 3 400 VDD= 10.8 V, VSS= -10.8 V, 1 450 IDS= 1.0 mA, VD= 5.0 V, VS= VD+ (IDSX RON) 2, 3 600 Source “OFF” leakage current IS(OFF)3/ 1 01, 02 1.0 nA 2, 3 50 Drain “OFF” leakage c
27、urrent ID(OFF)3/ 1 01 1.0 nA 2, 3 200 1 02 1.0 2, 3 100 Drain “ON” leakage current ID(ON)3/ 1 01 1.0 nA 2, 3 200 1 02 1.0 2, 3 100 Differential “OFF” output leakage current IDIFF(OFF)3/ 2, 3 02 25 nA High level input current IINHVDD= 16.5V, VSS= -16.5 V, VIN= 16.5 V 1, 2, 3 01, 02 1.0 A Low level in
28、put current IINLVDD= 16.5V, VSS= -16.5 V, VIN= 0 V 1, 2, 3 01, 02 1.0 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218
29、-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxDual supply - continued Supply current IDDVDD= 16.5 V, VSS= -16.5 V VI
30、NH= 2.4/15 V, VINL= 0.8/0 V 1, 2, 3 01, 02 1.5 mA Supply current ISSVDD= 16.5 V, VSS= -16.5 V VINH= 2.4/15 V, VINL= 0.8/0 V 1, 2, 3 01, 02 0.2 mA Delay time tOPENV1= 10 V, See figure 3 9 01, 02 25 ns 4/ 10, 11 10 Enable delay time tON/OFF (EN)See figure 3 4/ 9 01, 02 300 ns10, 11 400 Single supply A
31、nalog signal range VANALOGTA= +25C, VSS= 0 V 2/ 4 01, 02 0 +15 V Drain-source “ON” resistance RDS(ON)VDD= 10.8 V, VSS= 0 V, 1 01, 02 700 IDS= 0.5 mA, VD= 5.0 V, VS= VD+ (IDSX RON) 2, 3 1000 Source “OFF” leakage current IS(OFF)5/ 1 01, 02 1.0 nA 2, 3 50 Drain “OFF” leakage current ID(OFF)5/ 1 01 1.0
32、nA 2, 3 200 1 02 1.0 2, 3 100 Drain “ON” leakage current ID(ON)5/ 1 01 1.0 nA 2, 3 200 1 02 1.0 2, 3 100 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CEN
33、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxSingle supply - continued Differentia
34、l “OFF” output leakage current IDIFF(OFF)5/ 2, 3 02 25 nA High level input current IINHVDD= 16.5V, VSS= 0 V, VIN= 16.5 V 1, 2, 3 01, 02 1.0 A Low level input current IINLVDD= 16.5V, VSS= 0 V, VIN= 0 V 1, 2, 3 01, 02 1.0 A Supply current IDDVDD= 16.5 V, VSS= 0 V, VINH= 2.4/15 V, VINL= 0.8/0 V 1, 2, 3
35、 01, 02 1.5 mA Delay time tOPENV1= 10/0 V, VSS= 0 V, See figure 3 9 01, 02 25 ns 4/ 10, 11 10 Enable delay time tON/OFF (EN)VSS= 0 V, See figure 3 9 01, 02 450 ns 4/ 10, 11 600 1/ Unless otherwise specified, VDD= +15 V, VSS= -15 V and logic inputs are at desired logic levels (2.4 V and 0.8 V). 2/ Th
36、is parameter is tested initially and after any process changes which may affect it. 3/ VDD= +16.5 V, VSS= -16.5 V, VD= +10 V/ -10 V, VS= -10 V/ +10 V, VINL= 0.8 V, VINH= 2.4 V. 4/ Figure 3 refers to device type 01. For device type 02 the test circuits are functionally identical, but there are some D
37、UT pin name changes 5/ VDD= +16.5 V, VSS= 0 V, VD= +10 V/ -10 V, VS= 0 V/ +10 V, VINL= 0.8 V, VINH= 2.4 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4
38、3218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines X and 3 X and 3 Terminal number Terminal symbol 1 VDDVDD2 NC DB3 RS RS 4 S16 S8B 5 S15 S7B 6 S14 S6B 7 S13 S5B 8 S12 S4B 9 S11 S3B 10 S10 S2B 11 S9 S1B 12 GND GND 13 WR WR 14 A3 NC15 A2 A2 16 A1 A1 17 A0 A0 18
39、EN EN 19 S1 S1A 20 S2 S2A 21 S3 S3A 22 S4 S4A 23 S5 S5A 24 S6 S6A 25 S7 S7A 26 S8 S8A 27 VSSVSS28 D DA NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710
40、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Device type 01 A3 A2 A1 A0 EN WR RS ON SWITCH X X X X X _| 1 Retains previous switch condition X X X X X X 0 None (address and enable latches cleared) X X X X 0 0 1 None 0 0 0 0 1 0 1 1 0 0 0 1 1
41、0 1 2 0 0 1 0 1 0 1 3 0 0 1 1 1 0 1 4 0 1 0 0 1 0 1 5 0 1 0 1 1 0 1 6 0 1 1 0 1 0 1 7 0 1 1 1 1 0 1 8 1 0 0 0 1 0 1 9 1 0 0 1 1 0 1 10 1 0 1 0 1 0 1 11 1 0 1 1 1 0 1 12 1 1 0 0 1 0 1 13 1 1 0 1 1 0 1 14 1 1 1 0 1 0 1 15 1 1 1 1 1 0 1 16 Device type 02 A2 A1 A0 EN WR RS ON SWITCH X X X X _| 1 Retains
42、 previous switch condition X X X X X 0 None (address and enable latches cleared) X X X 0 0 1 None 0 0 0 1 0 1 1 0 0 1 1 0 1 2 0 1 0 1 0 1 3 0 1 1 1 0 1 4 1 0 0 1 0 1 5 1 0 1 1 0 1 6 1 1 0 1 0 1 7 1 1 1 1 0 1 8 X = Do not care _| = Signal is switching from low to high FIGURE 2. Truth tables. Provided
43、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Test circuits. Provided by IHSNot for ResaleNo r
44、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 FIGURE 3. Test circuits - continued. Provided by IHSNot for ResaleNo reproduction
45、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89710 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 11 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufactur
46、er in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requi
47、rements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affect
48、s this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of M
