1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R128-92. 92-02-21 Monica L. Poelking B Redrawn with changes. Update to current requirements. Editorial changes throughout. - gap 06-07-06 Raymond Monnin The original first page of this drawing has been replaced
2、. REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY AL
3、L DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, BIPOLAR, LOW POWER SCHOTTKY, TTL, BCD-TO-SEVEN AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-09-17 SEGMENT DECODER/DRIVERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89944 SHEET 1
4、OF 10 DSCC FORM 2233 APR 97 5962-E332-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE
5、1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89944 01 E X Drawing number Device type
6、 (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS248 BCD-to-seven-segment decoders/drivers 1.2.2 Case outline(s). The case outline(s) are as designated in M
7、IL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage referenc
8、ed to ground +7.0 V dc DC input voltage . -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation, (PD) 1/ 209 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C
9、 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICCand m
10、ust withstand the added PD due to short-circuit output test, e.g., IOSProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DS
11、CC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solic
12、itation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT O
13、F DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Aven
14、ue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a speci
15、fic exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
16、 (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow a
17、s documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PR
18、F-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with
19、 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Ele
20、ctrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups spe
21、cified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEV
22、EL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible du
23、e to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced wi
24、th a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein).
25、 The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required i
26、n MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity
27、 retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-385
28、35, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D
29、. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the i
30、ntent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for Resal
31、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions
32、 -55C TC +125C 1/ unless otherwise specified Group A subgroups Min Max Unit IOH= -100 A a thru g 2.4 High level output voltage VOHVCC= 4.5 V VIL= 0.7 V VIH= 2.0 V IOH= -50 A RBO/BI 1, 2, 3 2.4 V IOL= 2 mA a thru g 0.4 Low level output voltage VOLVCC= 4.5 V VIL= 0.7 V VIH= 2.0 V IOL= 1.6 mA RBO/BI 1,
33、 2, 3 0.4 V IIH1VIN= 7.0 V 100 High level input current IIH2VCC= 5.5 V VIN= 2.7 V Any input except RBO/BI 1, 2, 3 20 A Any input except RBO/BI -0.4 Low level input current IILVCC= 5.5 V VIN= 0.4 V RBO/BI 1, 2, 3 -1.2 mA Short circuit output current IOSVCC= 5.5 V RBO/BI 1, 2, 3 -0.3 -2 mA Input clamp
34、 voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 -1.5 V Supply current ICCVCC= 5.5 V All outputs open All inputs at 4.5 V 1, 2, 3 38 mA Functional tests See 4.3.1c 1/ 7, 8 9 100 tPLH110, 11 140 9 100 Propagation delay time from A input to output tPHL1VCC= 5.5 V, CL= 15 pF, RL= 4 k, See figure 3 10, 11 14
35、0 ns 9 100 tPLH210, 11 140 9 100 Propagation delay time from RBI input to output tPHL2VCC= 5.0 V, CL= 15 pF, RL= 6 k, See figure 3 10, 11 140 ns 9 103 tPLH310, 11 144 9 103 Propagation delay time from A input to output tPHL3VCC= 5.0 V, CL= 50 pF, 2/ RL= 4 k, See figure 3 10, 11 144 ns 9 103 tPLH410,
36、 11 144 9 103 Propagation delay time from RBI input to output tPHL4VCC= 5.0 V, CL= 50 pF, 2/ RL= 6 k, See figure 3 10, 11 144 ns 1/ Functional test shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 2/ Testing may be performed at either 15 pF or 50 pF, however, the manufactur
37、er must guarantee that the microcircuits meet the switching limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
38、VISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Case outlines E 2 Terminal number Terminal symbol 1 B NC 2 C B 3 LT C 4 RBO/BI LT 5 RBI RBO/BI 6 D NC 7 A RBI 8 GND D 9 e A 10 d GND 11 c NC 12 b e 13 a d 14 g c 15 f b 16 VCCNC 17 - - - a 18 - - - g 19 - - - f 20 - - - VCCFIGURE 1. Terminal connections.
39、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs Decimal or function LT RBI D C B A
40、RBO/BI NOTE 1a b c d e f g NOTES 0 H H L L L L H H H H H H H L 1 H X L L L H H L H H L L L L 2 H X L L H L H H H L H H L H 3 H X L L H H H H H H H L L H 4 H X L H L L H L H H L L H H 5 H X L H L H H H L H H L H H 6 H X L H H L H H L H H H H H 7 H X L H H H H H H H L L L L 8 H X H L L L H H H H H H H
41、 H 9 H X H L L H H H H H H L H H 10 H X H L H L H L L L H H L H 11 H X H L H H H L L H H L L H 12 H X H H L L H L H L L L H H 13 H X H H L H H H L L H L H H 14 H X H H H L H L L L H H H H 15 H X H H H H H L L L L L L L 2 BI X X X X X X L L L L L L L L 3 RBI H L L L L L L L L L L L L L 4 LT L X X X X
42、 X H H H H H H H H 5 H = High voltage level L = Low voltage level X = Irrelevant. NOTES: 1. RBO/BI is wire-AND logic serving as blanking input (BI ) or ripple-blanking output ( RBO ). 2. The blanking input ( BI ) must be held open or held at a high logic level when output functions 0 through 15 are
43、desired. The ripple-blanking input ( RBI ) must be open or high if blanking of a decimal zero is not desired. 3. When a low logic level is applied directly to the blanking input ( BI ), all segment outputs are low regardless of the level of any other input. 4. When ripple-blanking input ( RBI ) and
44、inputs A, B, C, and D are at a low level with the lamp test input high, all segment outputs go low and the ripple-blanking output ( RBO ) goes to low level (respond condition). 5. When the blanking input/ripple-blanking output ( RBO/BI ) is open or held high and a low is applied to the lamp-test inp
45、ut, all segment outputs are high. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234
46、APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All input pulses have the following characteristics: PRR MHz, ZOUT= 50 , tr 15 ns, and tf 6 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 3. Test circuit and switching waveforms. Provided by I
47、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89944 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requir
48、ements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10*, 11* Group A test requirements (method 5005) 1*, 2, 3, 7, 8, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11 shall be guaranteed if not tested to limits specified in table I. 4.3 Quality conformance inspection. Quality conformance
