DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf

上传人:ownview251 文档编号:699706 上传时间:2019-01-01 格式:PDF 页数:10 大小:61.09KB
下载 相关 举报
DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf_第1页
第1页 / 共10页
DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf_第2页
第2页 / 共10页
DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf_第3页
第3页 / 共10页
DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf_第4页
第4页 / 共10页
DLA SMD-5962-89961 REV B-2009 MICROCIRCUIT LINEAR DUAL DPST ANALOG SWITCH MONOLITHIC SILICON.pdf_第5页
第5页 / 共10页
点击查看更多>>
资源描述

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. 02-11-20 R. MONNIN B Part of 5 year review update. -rrp 09-05-20 J. RODENBECK THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B OF SHEETS

2、 SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY JOSEPH A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINE

3、AR, DUAL, DPST, ANALOG SWITCH, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-01-02 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89961 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E045-08 Provided by IHSNot for ResaleNo reproduction or networking permitted

4、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microci

5、rcuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89961 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify t

6、he circuit function as follows: Device type Generic number Circuit function 01 DG405 Dual, DPST analog switch 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in

7、-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. +V to V 44 V dc GND to V . 25 V dc VLto V (GND 0.3 V) to 44 V dc VIN, VS, VD-2 V to +V + 2 V or 30 mA, whichever occurs first 1/ Current, c

8、ontinuous (any terminal) 30 mA Current (S or D), pulsed 1 ms, 10 % duty 100 mA Power dissipation (PD): Case E . 900 mW 2/ Case 2 . 750 mW 2/ Storage temperature range . -65C to +150C Junction temperature (TJ) . +175C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 _ 1/ Signals on SX, DX

9、or INXexceeding +V or V will be clamped by internal diodes. Limit forward diode current to maximum current ratings. 2/ Derate linearly above TA= +75C: for case E, 12 mW/C; for case 2, 10 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

10、MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Positive supply voltage (+V) +15 V dc Negative supply voltage (-V) . -15 V dc Logic supply voltage (VL) +5 V dc Charge

11、injection 60 pC Crosstalk (channel-to-channel) . 90 dB 3/ Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified

12、 herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Mi

13、crocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicks

14、earch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this docu

15、ment, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product bu

16、ilt to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualif

17、ying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as descr

18、ibed herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein

19、. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. _ 3/ Crosstalk performance is improved with case outline 2. Provided by IHSNot for ResaleNo reproduction or networking permitted wi

20、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group

21、A subgroups Device type Limits Unit Min Max Drain-source ON resistance rDS(ON) IS= -10 mA, VD= 10 V, 1 01 35 +V = +13.5 V, -V = -13.5 V 2,3 45 Delta drain-source ON resistance rDS(ON) IS= -10 mA, 1 01 3 VD= 5 V, 0 V, -5 V, +V = +16.5 V, -V = -16.5 V 2,3 5 Source OFF leakage current IS(OFF) VD= -15.5

22、 V, VS= +15.5 V, 1 01 0.25 nA +V = +16.5 V, -V = -16.5 V 2 20 VD= +15.5 V, VS= -15.5 V, 1 0.25 +V = +16.5 V, -V = -16.5 V 2 20 Drain OFF leakage current ID(OFF) VD= -15.5 V, VS= +15.5 V, 1 01 0.25 nA +V = +16.5 V, -V = -16.5 V 2 20 VD= +15.5 V, VS= -15.5 V, 1 0.25 +V = +16.5 V, -V = -16.5 V 2 20 Cha

23、nnel ON leakage current ID(ON) + VS= VD= 15.5 V, 1 01 0.4 nA IS(ON) +V = +16.5 V, -V = -16.5 V 2 40 Low level input current IILVINunder test = 0.8 V, all other inputs = 2.4 V 1,2 01 1.0 A High level input current IIHVINunder test = 2.4 V, all other inputs = 0.8 V 1,2 01 1.0 A See footnote at end of

24、table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteris

25、tics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Turn on time tONRL= 300 , CL= 35 pF 9 01 150 ns 10,11 275 Turn off time tOFFRL= 300 , CL= 35 pF 9 01 100 ns 10 250 11 175 Positive supply current +I +V = +16.5 V, -V =

26、-16.5 V, 1 01 +1.0 A VIN= 0 V or 5 V 2,3 +5.0 Negative supply current -I +V = +16.5 V, -V = -16.5 V, 1 01 -1.0 A VIN= 0 V or 5 V 2,3 -5.0 Logic supply current IL+V = +16.5 V, -V = -16.5 V, 1 01 +1.0 A VIN= 0 V or 5 V 2,3 +5.0 Ground current IGND+V = +16.5 V, -V = -16.5 V, 1 01 -1.0 A VIN= 0 V or 5 V

27、 2,3 -5.0 1/ Unless otherwise specified, +V = +15 V, -V = -15 V, VL= 5 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET

28、6 DSCC FORM 2234 APR 97 Device type 01 Case outlines E 2 Terminal number Terminal symbol 1 D1NC 2 NC D13 D3NC 4 S3D35 S4S36 D4NC 7 NC S48 D2D49 S2NC 10 IN 2 D211 +V NC 12 VLS213 GND IN 2 14 -V +V 15 IN 1 VL16 S1NC 17 - GND 18 - -V 19 - IN 1 20 - S1FIGURE 1. Terminal connections. Provided by IHSNot f

29、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified

30、 herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup a

31、re described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space

32、 limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ o

33、r “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certi

34、ficate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-

35、38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain th

36、e option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, append

37、ix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or C. The test circui

38、t shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified i

39、n method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality c

40、onformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005

41、 of MIL-STD-883 shall be omitted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electr

42、ical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*,2,3,9 Group A test requirements (method 5005) 1,2,3,9,10*,11* Groups C and D end-poin

43、t electrical parameters (method 5005) 1 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test

44、conditions, method 1005 of MIL-STD-883. (1) Test condition A or C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biase

45、s, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be

46、in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing

47、 will replace the same generic device covered by a contractor-prepared specification or drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89961 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990

48、REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicab

展开阅读全文
相关资源
猜你喜欢
相关搜索

当前位置:首页 > 标准规范 > 国际标准 > 其他

copyright@ 2008-2019 麦多课文库(www.mydoc123.com)网站版权所有
备案/许可证编号:苏ICP备17064731号-1