1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R229-94. 94-08-11 M. A. FRYE B Changes to table I. Editorial changes throughout. drw 98-03-17 R. MONNIN C Make change to input bias current test as specified in table I. ro 99-08-02 R. MONNIN D Updated drawing
2、to reflect current requirements. -rrp 04-05-03 R. MONNIN THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Sandra B. Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRA
3、WING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, HIGH SPEED, 8-BIT, A/D CONVERTER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93
4、-04-28 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-90508 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E256-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBU
5、S, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available an
6、d are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90508 01 M X A Federal stock class designator RHA designator (see 1.2.1) Devicetype (
7、see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked
8、devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD9002S High sp
9、eed 8-bit A/D converter 02 AD9002T High speed 8-bit A/D converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-S
10、TD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Pack
11、age style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking pe
12、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Negative supply voltage (VS-) -6 V dc Analog input voltage VS- to +0.5 V dc Po
13、wer dissipation (PD), TA= +25C. 1.2 W Storage temperature range . -65C to +150C Lead temperature (soldering, 10 sec) . +300C Junction temperature (TJ) +175C ENCODE to ENCODE differential voltage . 4.0 V dc Reference input voltage (+VREF, -VREF) . -3.5 to +0.1 V dc 2/ Reference midpoint current. 4.0
14、mA Digital output current . 20 mA Differential reference voltage 2.1 V dc Digital input voltage. -VSto 0 V dc Analog to digital supply voltage differential . 0.5 V dc Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case outline X 56C/W Case ou
15、tline 3. 69C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C Differential reference voltage 2.0 V dc Negative supply voltage (VS-) -5.2 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, s
16、tandards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification
17、 for. DEPARTMENT OF DEFENSE SPECIFICATION MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE SPECIFICATION MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings.
18、(Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of thi
19、s drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device.
20、 Extended operation at the maximum levels may degrade performance and affect reliability. 2/ +VREF -VREFunder all circumstances. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COL
21、UMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Manag
22、ement (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construct
23、ion, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.
24、2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified i
25、n table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the
26、PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA desi
27、gnator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“
28、 as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requi
29、rements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approv
30、ed source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conforman
31、ce as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (s
32、ee 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable requ
33、ired documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 57 (see MIL-PRF-38535, appendix A).Provided by IHSNot
34、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditio
35、ns 1/ Group A Device Limits Unit -55C TA +125C subgroups Type unless otherwise specified Min Max Input bias current IBAnalog input = 0 V 1 All 200 A 2, 3 200 Reference ladder R TA= +25C 1 All 40 110 resistance Overflow inhibit IIN1,2,3 All 300 A0 V input current High level 2/ VOH1,2,3 All -1.1 V out
36、put voltage Low level 2/ VOL1,2,3 All -1.5 output voltage Negative supply 3/ -ICCVS-= -5.2 V 1 All 175 mA current 2, 3 200 Conversion rate FSTA = +25C 4 All 125 MSPS Encode pulse 4/ tPWLTA = +25C 4 All 1.5 ns width (low) Encode pulse 4/ tPWHTA = +25C 4 All 1.5 width (high) Signal-to-noise 5/ SNR Ana
37、log input signal = 1.23 MHz 4 All 46 dB ratio TA= +25C Differential linearity DNL 7 01 0.75 LSB 02 0.5 8 01 1.0 02 0.75 Integral linearity INL 7 01 1.0 LSB 02 0.5 8 All 1.2 Top of reference 7 All 14 mV ladder 8 17 Bottom of reference 7 All 10 ladder 8 12 See footnotes at end of table. Provided by IH
38、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Tes
39、t Symbol Conditions 1/ Group A Device Limits Units -55C TA +125C subgroups Type unless otherwise specified Min Max High level input VIH7, 8 All -1.1 V voltage Low level input VIL-1.5 voltage High level input IIH7, 8 All 150 A current Low level input IIL120 current Power supply 3/ 6/ PSRR TA = +25C 7
40、 All 1.5 mV/V rejection ratio Output delay 7/ 2/ tPDTA = +25C 9 All 1.0 3.5 ns Output rise time 2/ trTA = +25C 9 All 3.0 ns Output fall time 2/ tfTA = +25C 9 All 2.5 ns In-band harmonics 5/ Analog Input Signal = 1.23 MHz 4 All 48 dB TA = +25C Input capacitance 8/ CINTA = +25C 4 All 22 pF Input resis
41、tance 8/ RINTA = +25C 4 All 50 k 1/ VS- = -5.2 V, differential reference voltage = 2.0 V unless otherwise specified. 2/ Outputs terminated through 100 to -2 V. 3/ Supplies should remain stable within +5% for normal operation. 4/ ENCODE signal rise/fall times should be less than 10 ns for normal oper
42、ation. 5/ RMS signal to RMS noise, including harmonics with 1.23 MHz analog input signal. 6/ Measured at -5.2 V +5%. 7/ Measured from ENCODE into data out for LSB only. 8/ Subgroup 4 measurements CINand RINshall be measured only for the initial test and after process or design changes which may affe
43、ct input capacitance and resistance. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device types
44、01 and 02 Case outlines X and 3 Terminal number Terminal symbol 1 DIGITAL GND 2 OVERFLOW INH 3 HYSTERESIS 4 +VREF5 ANALOG INPUT6 ANALOG GROUND 7 ENCODE 8 ENCODE 9 ANALOG GROUND 10 ANALOG INPUT11 -VREF12 REFMID13 DIGITAL GND14 DIGITA VS-15 D1 (LSB) 16 D217 D318 D4 19 D520 DIGITAL GROUND 21 ANALOG VS-
45、22 ANALOG VS-23 DIGITAL GROUND 24 D625 D726 D8 (MSB) 27 OVERFLOW 28 DIGITAL VS-FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90508 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OH
46、IO 43216-5000 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification
47、 in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be
48、conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, or C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon r
