1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 02. Editorial and technical changes throughout. 96-05-16 M. A. FRYE B Drawing updated to reflect current requirements. - ro 03-01-07 R. MONNIN C Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 11-05-02 C.
2、 SAFFLE REV SHET REV SHET REV STATUS REV C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF
3、THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, REGULATOR CONTROLLER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-12-29 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-90650 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E249-11 Provided by IHS
4、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD
5、-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90650 01 P A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1
6、Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 UC1835 Fixed, regulator controller 02 UC1836 Adjustable, regulator controller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outli
7、ne letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Input supply voltage (+VIN) . -1.0 V to +40 V Driv
8、er output current (sink or source) 600 mA Driver sink to source voltage . +40 V Maximum current through sense resistor 4 A VOUTsense input voltage . -0.3 V to +40 V Power dissipation (PD) 1000 mW Junction temperature (TJ) . -55C to +150C Storage temperature range . -65C to +150C Lead temperature (so
9、ldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) Case P . 160C/W Case 2 . 70C/W 1.4 Recommended operating conditions. Supply voltage (+VIN) . +6 V Ambient operating temperature range (TA) . -55C to +125C Provided b
10、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and
11、handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circu
12、its, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 -
13、 Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the
14、text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall
15、be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification t
16、o MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modif
17、ications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimens
18、ions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic
19、diagram. The logic diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test r
20、equirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addi
21、tion, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
22、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device
23、 type Limits 2/ Unit Min Max Input supply section Supply current ICC+VIN= 6 V 1,2,3 All 4.0 mA +VIN= 40 V 6.0 Under-voltage lockout threshold VTH+VINlow to high, VOUTSENSE = 0 V 1,2,3 All 3.9 4.9 V Threshold hysteresis VTH(HYST) 1,2,3 All 0.35 V Reverse current IR+VIN= -1.0 V, driver sink open 1,2,3
24、 All 20 mA Regulating voltage and error amplifier section Regulating level at VOUTSENSE VREGIDRIVER= 10 mA 1 01 4.94 5.06 V 2,3 4.9 5.1 1 02 2.47 2.532,3 2.45 2.55Line regulation VLN+VIN= 5.2 V to 35 V 1,2,3 01 40 mV 02 20Load regulation VLDIDRIVER= 0 mA to 250 mA 1,2,3 01 25 mV 02 15Bias current at
25、 VOUTSENSE IIBVOUTSENSE = 5.0 V 1,2,3 01 75 210 A VOUTSENSE = 2.5 V 02 -1.0 Error amp transconductance 100 A at COMP/SHUTDOWN pin 1,2,3 All 0.8 2.0 ms Maximum compensation output current ICOSink or source, driver source open 1,2,3 All 90 260 A See footnotes at end of table. Provided by IHSNot for Re
26、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/
27、 -55C TA+125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Driver section Maximum current IMAX1,2,3 All 250 mA Saturation voltage VSATIDRIVER= 250 mA, at DRIVER SINK pin 1,2,3 All 2.8 V Pull-up current at driver sink COMP/SHUTDOWN = 0.45 V 1,2,3 All 140 300 A Drive
28、r sink leakage In under-voltage lockout 1,2,3 All 10 A In reverse voltage 10 Foldback current limit section Current limit levels at sense resistor out VOUTSENSE = (0.99) VREG1,2,3 All 2.2 2.8 A VOUTSENSE = (0.5) VREG1.3 1.7 VOUTSENSE = 0 V 0.25 0.55 Current limit amp transconductance 100 A at COMP /
29、 SHUTDOWN pin, VOUTSENSE = (0.9) VREG1,2,3 All 12 42 ms Limiting voltage at 3/ current limit (-) VOUTSENSE = (0.9) VREGvolts below +VIN, TA= +25C 1 All 80 140 mV 1/ Unless otherwise specified, +VIN= 6 V, driver sink = 5 V, and driver source = 0 V. 2/ The algebraic convention, whereby the most negati
30、ve value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ This voltage has a positive temperature coefficient of approximately 3500 ppm/C. 3.5.1 Certification/compliance mark. A complia
31、nce indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of complianc
32、e. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the man
33、ufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI
34、ON LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outlines P 2 Terminal number Terminal symbol 1 +VINNC 2 COMP/SHUTDOWN +VIN3 GROUND +VIN4 DRIVER SOURCE NC5 VOUTSENSE COMP/SHUTDOWN 6 DRIVER SINK NC 7 CURRENT LIMIT (-) GROUND 8 SENSE RESISTOR OUT NC 9 - NC 10 - DRIVER SOURCE 11 - N
35、C 12 - VOUTSENSE 13 - NC 14 - NC 15 - DRIVER SINK 16 - NC 17 - CURRENT LIMIT(-) 18 - NC 19 - SENSE RESISTOR OUT 20 - SENSE RESISTOR OUT NC = No connection. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO
36、CIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650
37、DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change.
38、 Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable require
39、d documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 50
40、04 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision level c
41、ontrol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and fina
42、l electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
43、883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspect
44、ions. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the
45、 preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by metho
46、d 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90650 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requiremen
47、ts. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1,2,3 Group A test requirements (method 5005) 1,2,3 Groups C and D end-point electrical parameters (method 5
48、005) 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration contro
