DLA SMD-5962-90905 REV B-2007 MICROCIRCUIT LINEAR HIGH SPEED CURRENT FEEDBACK OPERATIONAL AMPLIFIER MONOLITHIC SILICON《硅单块 操作放大器 电流反作用 高速直线式微型电路》.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. -ro 01-08-29 R. MONNIN B Drawing updated as part of 5 year review. -rrp 07-01-16 J. RODENBECK REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A

2、 PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED, CURRENT FEEDBACK,

3、 OPERATIONAL AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-04-05 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90905 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E227-06 Provided by IHSNot for ResaleNo reproduction or networking permitted withou

4、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes

5、Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the fo

6、llowing example: 5962 - 90905 01 M P X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-

7、PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device typ

8、e(s) identify the circuit function as follows: Device type Generic number Circuit function 01 OP-160A High speed, current feedback, operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Dev

9、ice requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designa

10、ted in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendi

11、x A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratin

12、gs. 1/ Supply voltage (VS) . 18 V dc Input voltage (VIN) . Supply voltage Differential input voltage (VID) . 1 V dc Inverting input current 7 mA continuous, 20 mA peak Output short-circuit duration 10 seconds Storage temperature range -65C to +150C Lead temperature range (soldering, 60 seconds) +300

13、C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case P . 148C/W Case 2 98C/W 1.4 Recommended operating conditions. Supply voltage (VS) . 15 V dc Common mode voltage (VCM) . 0 V Feedback resistance (RF) 820 Amb

14、ient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these docu

15、ments are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Com

16、ponent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardizati

17、on Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applic

18、able laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or

19、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V

20、 shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in

21、 accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, ap

22、pendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless oth

23、erwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified

24、in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations

25、, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535,

26、 appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes

27、Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of

28、supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device cl

29、ass M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this

30、drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class

31、M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M d

32、evices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4321

33、8-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input offset voltage 3/ VOS1 01 -5 +5 mV 2,3 -8 +8 Noninverting input bias cu

34、rrent +IB1 01 -1 +1 A 2,3 -2 +2 Inverting input bias current -IB1 01 -20 +20 A 2,3 -30 +30 Noninverting input bias current common mode CMRR+IBVCM= 11 V 1 01 75 nA / V rejection ratio VCM= 10 V 2,3 150 Inverting input bias current common mode CMRR-IBVCM= 11 V 1 01 75 nA / V rejection ratio VCM= 10 V

35、2,3 150 Noninverting input bias current power supply PSRR+IBVS= 9 V, 18 V 1 01 5 nA / V rejection ratio 2,3 10 Inverting input bias current power supply PSRR-IBVS= 9 V, 18 V 1 01 50 nA / V rejection ratio 2,3 100 Common mode rejection ratio CMRR VCM= 11 V 1 01 60 dB VCM= 10 V 2,3 56 Power supply rej

36、ection ratio PSRR VS= 9 V, 18 V 1 01 74 dB 2,3 70 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B

37、 SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxInput voltage range 4/ +IVR 1 01 +11 V 2,3 +10 -IVR 1 -11 2,3 -10 Supply current ISYNo load

38、 1 01 8.0 mA 2,3 9.0 Output current +IOUTVOUT= -10 V, TA= +25C 1 01 -35 mA -IOUTVOUT= +10 V, TA= +25C +35 Output voltage swing +VOUTRL= 500 4 01 +11 V 5,6 +10 -VOUT4 -11 5,6 -10 Open-loop transimpedance RTVOUT= 10 V, RL= 500 4 01 3 M 5,6 1.75 Slew rate 5/ +SR AV= +2, RL= 500 , VOUT= 10 V, 7 01 1000

39、V / s measured at -5 V to +5 V, rising edge 8 600 -SR AV= +2, RL= 500 , VOUT= 10 V, 7 1000 measured at +5 V to -5 V, falling edge 8 600 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

40、A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min MaxRise

41、time 5/ tRVOUT= 100 mV, AV= +1, TA= +25C, measured at 10 percent to 90 percent points 9 01 5.5 ns VOUT= 100 mV, AV= -1, TA= +25C, measured at 10 percent to 90 percent points 9.0 Settling time 5/ tSAV= -1, 10 V step at 0.1 percent of the fixed value, TA= +25C 9 01 130 ns AV= -1, 10 V step at 0.01 per

42、cent of the fixed value, TA= +25C 200 -3 dB bandwidth 5/ BW AV= -1, -3 dB point, RL= 500 , TA= +25C 9 01 45 MHz AV= +1, -3 dB point, RL= 500 , TA= +25C 75 AV= +2, -3 dB point, RL= 500 , TA= +25C 60 1/ Unless otherwise specified, VS= 15 V, VCM= 0 V, and RF= 820 . 2/ The algebraic convention, whereby,

43、 the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current shall be defined as conventional current flow out of a device terminal. 3/ The input offset voltage (VOS) and inverting bias current can be adjusted with an external 10 k potentiometer b

44、etween the NULL pins with wiper connected to +VSto make output offset voltage zero. 4/ The input voltage range (IVR) is guaranteed by common mode rejection ratio (CMRR) test. 5/ Guaranteed by characterization and not 100 percent tested. Provided by IHSNot for ResaleNo reproduction or networking perm

45、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines P 2 Terminal number Terminal symbol 1 NULL NC 2 -INPUT NULL 3 +INPUT NC 4 -VSNC 5 NU

46、LL NC 6 OUTPUT -INPUT 7 +VSNC 8 DISABLE ( DIS ) +INPUT 9 - -VS10 - NC 11 - NC 12 - NULL 13 - NC 14 - OUTPUT 15 - NC 16 - +VS17 - NC 18 - NC 19 - NC 20 - DISABLE ( DIS ) NC = No connection The NULL pin is used to reduce to VOSlimit. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo repr

47、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90905 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and

48、inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in a

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