1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R048-92. - JAK 91-11-19 Monica L. Poelking B Redraw the switching waveforms in figure 4, switching waveforms and test circuit. Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. LTG
2、 06-05-04 Thomas M. Hess C Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. jak 12-10-10 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME C
3、OLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, OCTAL BUFFER AND LINE DRIVER WITH OPEN COLLECTOR OUTPUTS, TTL C
4、OMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-12-21 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-90938 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E212-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without lice
5、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and sp
6、ace application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example:
7、 5962 - 90938 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 spec
8、ified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify
9、the circuit function as follows: Device type Generic number Circuit function 01 54BCT760 Octal buffer and line driver with open collector outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: D
10、evice class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s)
11、 are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for d
12、evice classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM
13、2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range (VIN) -0.5 V dc to +7.0 V dc Voltage applied to any output in the high state (VOUT) . -0.5 V dc to VCCVoltage applied to any output in the disabled state (VOUT) -0.5 V dc to +5.5 V dc C
14、urrent into any output in the low state . 96 mA Input clamp current (IIC) . -30 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 630 mW 2/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperatur
15、e (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Maximum high level output voltage (VOH) 5.5 V dc Maximum low level output current (IOL) +48 mA Case op
16、erating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The PDlimit is based upon dc values. Provided by IHSNot for ResaleNo reprod
17、uction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following spe
18、cification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General
19、Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawi
20、ngs. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the refe
21、rences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in
22、accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance w
23、ith MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and
24、herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic
25、 diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical perfo
26、rmance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DL
27、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be
28、marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this opti
29、on, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall b
30、e a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to sup
31、ply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime
32、 -VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of confo
33、rmance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification
34、to DLA Land and Maritime -VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquir
35、ing activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall
36、 be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2
37、234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level output current IOHVCC= 4.5 V VIH= 2.0 V or VIL= 0.8 V VOH= +5.5 V 1, 2, 3 All +0.1 mA Low level output voltage
38、 VOLVCC= 4.5 V VIH= 2.0 V or VIL= 0.8 V IOL= 48 mA 1, 2, 3 All 0.55 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.2 V High level input current IIH1VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 All 0.1 mA IIH2VCC= 5.5 V, VIN= 2.7 V 20 A Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 All
39、 -1.0 mA Supply current, outputs high ICCHVCC= 5.5 V, outputs open 1, 2, 3 All 33 mA Supply current, outputs low ICCL76 Supply current, OE disabled ICCZ1/ 10 Functional tests 2/ See 4.4.1b 7, 8 All Propagation delay time, mAn to mYn tPLH1CL= 50 pF R1 = R2 = 500 See figure 4 VCC= 5.0 V 9 All 6.3 9.5
40、ns VCC= 4.5 V and 5.5 V 10, 11 6.3 11.1 tPHL1VCC= 5.0 V 9 All 2.1 6.5 VCC= 4.5 V and 5.5 V 10, 11 2.1 7.7 Propagation delay time, mOE to mYn tPLH2VCC= 5.0 V 9 All 8.6 15.2 ns VCC= 4.5 V and 5.5 V 10, 11 8.6 18.7 tPHL2VCC= 5.0 V 9 All 3.2 8.9 VCC= 4.5 V and 5.5 V 10, 11 3.2 10.4 1/ ICCZis defined as
41、the test where the outputs are forced high by the control inputs. 2/ Functional tests shall be conducted at input test conditions of 0.4 V VIL 0.8 V and 2.0 V VIH 2.4 V for VCC= 4.5 V and is repeated for VCC= 5.5 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
42、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device type All Case outlines R, S, and 2 Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1OE 1A1 2Y4 1A2 2Y
43、3 1A3 2Y2 1A4 2Y1 GND 2A1 1Y4 2A2 1Y3 2A3 1Y2 2A4 1Y1 2OE VCC FIGURE 1. Terminal connections. Inputs Outputs mOE mAn mYn H X Z L L L L H H H = High voltage level L = Low voltage level X = Irrelevant Z = High impedance FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking
44、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
45、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF minimum or equivalent (includes test jig and probe capacitance). 2. R1 = R2 = 500 or equivalent. 3. All input pulses are supplied by
46、 the generators having the following characteristics: VIN= 0.0 V to 3.0 V; PRR 10 MHz; ZO= 50; tr 2.5 ns; tf 2.5 ns; trand tfshall be measured from 0.3 V to 2.7 V and from 2.7 V to 0.3 V, respectively; duty cycle = 50 percent. 4. The outputs are measured one at a time with one transition per measure
47、ment. FIGURE 4. Switching waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90938 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4. V
48、ERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device cla
